KR960025327U - Wafer cleaning device - Google Patents

Wafer cleaning device

Info

Publication number
KR960025327U
KR960025327U KR2019940035311U KR19940035311U KR960025327U KR 960025327 U KR960025327 U KR 960025327U KR 2019940035311 U KR2019940035311 U KR 2019940035311U KR 19940035311 U KR19940035311 U KR 19940035311U KR 960025327 U KR960025327 U KR 960025327U
Authority
KR
South Korea
Prior art keywords
cleaning device
wafer cleaning
wafer
cleaning
Prior art date
Application number
KR2019940035311U
Other languages
Korean (ko)
Other versions
KR0118693Y1 (en
Inventor
최기식
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019940035311U priority Critical patent/KR0118693Y1/en
Publication of KR960025327U publication Critical patent/KR960025327U/en
Application granted granted Critical
Publication of KR0118693Y1 publication Critical patent/KR0118693Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR2019940035311U 1994-12-23 1994-12-23 Cleansing apparatus for wafer KR0118693Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940035311U KR0118693Y1 (en) 1994-12-23 1994-12-23 Cleansing apparatus for wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940035311U KR0118693Y1 (en) 1994-12-23 1994-12-23 Cleansing apparatus for wafer

Publications (2)

Publication Number Publication Date
KR960025327U true KR960025327U (en) 1996-07-22
KR0118693Y1 KR0118693Y1 (en) 1998-08-01

Family

ID=19402421

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940035311U KR0118693Y1 (en) 1994-12-23 1994-12-23 Cleansing apparatus for wafer

Country Status (1)

Country Link
KR (1) KR0118693Y1 (en)

Also Published As

Publication number Publication date
KR0118693Y1 (en) 1998-08-01

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090223

Year of fee payment: 12

EXPY Expiration of term