KR960015599U - Wafer bottom cleaning device - Google Patents

Wafer bottom cleaning device

Info

Publication number
KR960015599U
KR960015599U KR2019940026754U KR19940026754U KR960015599U KR 960015599 U KR960015599 U KR 960015599U KR 2019940026754 U KR2019940026754 U KR 2019940026754U KR 19940026754 U KR19940026754 U KR 19940026754U KR 960015599 U KR960015599 U KR 960015599U
Authority
KR
South Korea
Prior art keywords
cleaning device
bottom cleaning
wafer bottom
wafer
cleaning
Prior art date
Application number
KR2019940026754U
Other languages
Korean (ko)
Other versions
KR200173904Y1 (en
Inventor
전상균
Original Assignee
현대반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대반도체주식회사 filed Critical 현대반도체주식회사
Priority to KR2019940026754U priority Critical patent/KR200173904Y1/en
Publication of KR960015599U publication Critical patent/KR960015599U/en
Application granted granted Critical
Publication of KR200173904Y1 publication Critical patent/KR200173904Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR2019940026754U 1994-10-13 1994-10-13 Apparatus for backside cleaning of wafer KR200173904Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940026754U KR200173904Y1 (en) 1994-10-13 1994-10-13 Apparatus for backside cleaning of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940026754U KR200173904Y1 (en) 1994-10-13 1994-10-13 Apparatus for backside cleaning of wafer

Publications (2)

Publication Number Publication Date
KR960015599U true KR960015599U (en) 1996-05-17
KR200173904Y1 KR200173904Y1 (en) 2000-03-02

Family

ID=19395435

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940026754U KR200173904Y1 (en) 1994-10-13 1994-10-13 Apparatus for backside cleaning of wafer

Country Status (1)

Country Link
KR (1) KR200173904Y1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990076266A (en) * 1998-03-30 1999-10-15 윤종용 Semiconductor cleaning device to improve the cleaning effect
KR100419004B1 (en) * 2001-11-06 2004-02-14 주식회사 실트론 Wafer mounting, demounting equipment for semiconductor polishing
KR100486094B1 (en) * 2003-02-04 2005-04-28 동부아남반도체 주식회사 Spin rinse drier

Also Published As

Publication number Publication date
KR200173904Y1 (en) 2000-03-02

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20051116

Year of fee payment: 7

LAPS Lapse due to unpaid annual fee