KR960032689A - 반도체웨이퍼를 시트에 고정시키는 압력-감지성 점착제 - Google Patents

반도체웨이퍼를 시트에 고정시키는 압력-감지성 점착제 Download PDF

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Publication number
KR960032689A
KR960032689A KR1019960003291A KR19960003291A KR960032689A KR 960032689 A KR960032689 A KR 960032689A KR 1019960003291 A KR1019960003291 A KR 1019960003291A KR 19960003291 A KR19960003291 A KR 19960003291A KR 960032689 A KR960032689 A KR 960032689A
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KR
South Korea
Prior art keywords
sensitive adhesive
pressure
copolymer
rubber
styrene
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Application number
KR1019960003291A
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English (en)
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KR100196455B1 (ko
Inventor
기시오 니와야마
히로유키 가와베
세이지 사이타
시게루 와다
Original Assignee
모리야마 쥰고
도요 가가쿠 가부시키가이샤
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Application filed by 모리야마 쥰고, 도요 가가쿠 가부시키가이샤 filed Critical 모리야마 쥰고
Publication of KR960032689A publication Critical patent/KR960032689A/ko
Application granted granted Critical
Publication of KR100196455B1 publication Critical patent/KR100196455B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesive Tapes (AREA)

Abstract

반도체웨이퍼를 시트에 고정시키는 압력-감지성 점착제는 100중량부의 엘라스토머, 5내지 200중량부의 점착성부여제 및 0.05 내지 30중량부의 경화제를 함유한다.

Description

반도체웨이퍼를 시트에 고정시킨는 압력-감지성 점착제
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (6)

100중량부의 엘라스토머, 5 내지 200중량부의 점착성부여제 그리고 0.05 내지 30중량부의 경화제로 이루어진, 반도체웨이퍼를 시트에 고정시키는 압력-감지성 점착제.
제1항에 있어서, 3.0×105내지 5.9×106dyn/㎠의탄성반응(G′)을 갖는 것을 특징으로 하는 압력-감지성 점착제.
제1항에 있어서, 20 내지 300gf/20㎜의 180°박리접착력을 갖는 것을 특징으로 하는 압력-감지성 점착제.
제1항에 있어서, 상기 엘라스토머가 천연고무, 합성이소프렌고무, 스티렌부타디엔고무, 스티렌/부타디엔블록 공중합체, 부틸고무, 폴리이소부틸렌, 규소고무, 폴리비닐이소부틸에테르, 클로로프렌, 니트릴고무, 그라프트된 고무, 스티렌/에틸렌/부틸렌 블록 공중합체, 스티렌/프로필렌/부틸렌 블록 공중합체, 스티렌/이소프렌 블로 공중합체, 아크릴로니트릴/부타디엔 공중합체, 메틸메타크릴레이트/부타디엔 공중합체, 폴리이소부틸렌/에틸렌/프로필렌 공중합체, 에틸렌비닐아세테이트 공중합체, 폴루부타디엔, 아크릴로니트릴, 아크릴에스테르 공중합체, 폴리비닐에테르 및 그것들의 혼합물로 구성된 군으로부터 선택되는 것을 특징으로 하는 압력-감지성 점착제.
제1항에 있어서, 상기 점착성부여제가 지방족석유수지, 방향족석유수지, 수화석유수지 및 그것들의 혼합물로 구성된 군으로부터 선택되는 것을 특징으로 하는 압력-감지성 점착제.
제1항에 있어서, 상기 경화제가 이소시아네이트, 황-가황촉진제 혼합물, 폴리알킬페놀, 유기과산화물 및 그것들의 혼합물로구성된 군으로부터 선택되는 것을 특징으로 하는 압력-감지성 점착제.
※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960003291A 1995-02-14 1996-02-12 반도체웨이퍼를 시트에 고정시키는 압력-감지성 점착제 KR100196455B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-49174 1995-02-14
JP4917495 1995-02-14

Publications (2)

Publication Number Publication Date
KR960032689A true KR960032689A (ko) 1996-09-17
KR100196455B1 KR100196455B1 (ko) 1999-06-15

Family

ID=12823703

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960003291A KR100196455B1 (ko) 1995-02-14 1996-02-12 반도체웨이퍼를 시트에 고정시키는 압력-감지성 점착제

Country Status (3)

Country Link
JP (1) JP4040706B2 (ko)
KR (1) KR100196455B1 (ko)
TW (1) TW383332B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11199841A (ja) * 1998-01-19 1999-07-27 Nitto Denko Corp 半導体装置用接着シ―ト類と面実装型半導体装置
JP4651767B2 (ja) * 1999-12-27 2011-03-16 日東電工株式会社 固形タイプの粘着剤組成物とその粘着シ―ト類
JP4780828B2 (ja) 2000-11-22 2011-09-28 三井化学株式会社 ウエハ加工用粘着テープ及びその製造方法並びに使用方法
JP5010800B2 (ja) * 2004-03-26 2012-08-29 リンテック株式会社 半導体デバイスの製造方法及びダイシング用粘着テープ
US8268449B2 (en) * 2006-02-06 2012-09-18 Brewer Science Inc. Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive
JP4920400B2 (ja) * 2006-12-26 2012-04-18 日東電工株式会社 防水気密用粘着シート
JP2008098669A (ja) * 2007-12-21 2008-04-24 Denki Kagaku Kogyo Kk 半導体ウエハ・ダイシング方法
JP5378484B2 (ja) * 2011-11-14 2013-12-25 日東電工株式会社 架橋された固形タイプの粘着剤組成物とその粘着シートおよび防水気密用粘着シートの製造方法
CN116348565B (zh) * 2021-03-31 2024-03-12 株式会社寺冈制作所 粘合组合物和粘合带

Also Published As

Publication number Publication date
JP4040706B2 (ja) 2008-01-30
KR100196455B1 (ko) 1999-06-15
TW383332B (en) 2000-03-01
JPH0912991A (ja) 1997-01-14

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