KR960026192A - Metal wiring formation method of semiconductor device - Google Patents
Metal wiring formation method of semiconductor device Download PDFInfo
- Publication number
- KR960026192A KR960026192A KR1019940037679A KR19940037679A KR960026192A KR 960026192 A KR960026192 A KR 960026192A KR 1019940037679 A KR1019940037679 A KR 1019940037679A KR 19940037679 A KR19940037679 A KR 19940037679A KR 960026192 A KR960026192 A KR 960026192A
- Authority
- KR
- South Korea
- Prior art keywords
- forming
- metal film
- film
- metal
- metal wiring
- Prior art date
Links
Abstract
본 발명은 반도체 소자의 금속배선 형성방법에 있어서; 제1절연막으로 절연된 전도층의 예정된 금속콘택 부위에 접촉창을 형성하는 단계; 전체구조 상부 표면을 따라 상기 접촉성이 매립되지 않을 정도의 일정두께로 제1금속막을 형성하는 단계; 상기 제1금속막에 의해 채워지지 않은 접촉창 내부에 제2절연막을 매립하는 단계; 전체구조 상부에 주금속배선막인 제2금속막을 형성하는 단계를 포함하는 것을 특징으로 하는 반도체 소자의 금속배선 형성방법에 관한 것으로, 초미세콘택홀에 의한 다층금속배선을 플러그 물질의 잔류물 없이 형성함으로써, 반도체 소자의 신뢰성을 향상시키는 효과를 가져온다.The present invention provides a method for forming metal wiring of a semiconductor device; Forming a contact window on a predetermined metal contact portion of the conductive layer insulated with the first insulating film; Forming a first metal film with a predetermined thickness such that the contact is not buried along the upper surface of the entire structure; Embedding a second insulating film in a contact window not filled by the first metal film; A method of forming a metal wiring of a semiconductor device, the method comprising forming a second metal film as a main metal wiring film on an entire structure, wherein the multilayer metal wiring by an ultra-fine contact hole is formed without residue of a plug material. Formation brings about the effect of improving the reliability of a semiconductor element.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제2A도 내지 제2D도는 본 발명의 일실시예에 따른 금속배선 형성 공정도.2A to 2D are metal wiring forming process diagrams according to one embodiment of the present invention.
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940037679A KR960026192A (en) | 1994-12-28 | 1994-12-28 | Metal wiring formation method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940037679A KR960026192A (en) | 1994-12-28 | 1994-12-28 | Metal wiring formation method of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
KR960026192A true KR960026192A (en) | 1996-07-22 |
Family
ID=66769743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940037679A KR960026192A (en) | 1994-12-28 | 1994-12-28 | Metal wiring formation method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR960026192A (en) |
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1994
- 1994-12-28 KR KR1019940037679A patent/KR960026192A/en not_active Application Discontinuation
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