KR960024602A - Thin film transistor liquid crystal display device and manufacturing method - Google Patents

Thin film transistor liquid crystal display device and manufacturing method Download PDF

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KR960024602A
KR960024602A KR1019940035629A KR19940035629A KR960024602A KR 960024602 A KR960024602 A KR 960024602A KR 1019940035629 A KR1019940035629 A KR 1019940035629A KR 19940035629 A KR19940035629 A KR 19940035629A KR 960024602 A KR960024602 A KR 960024602A
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forming
source
silicon layer
amorphous silicon
black matrix
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KR1019940035629A
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KR0139375B1 (en
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김진관
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김광호
삼성전자 주식회사
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/1368Active matrix addressed cells in which the switching element is a three-electrode device
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136209Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136286Wiring, e.g. gate line, drain line
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film

Abstract

이 발명은 박막트랜지스터 액정 디스플레이 소자 및 제조방법에 관한 것으로서, 스토리지 캐패시터를 복층화시키기 위한, 유리판 위에 각 화소에 독립된 블랙 매트릭스를 형성하는 단계와 ; 상부 배선간의 쇼트를 방지하기 위하여 절연막을 형성하는 단계와 ; 양극 산화가 가능한 물질로 게이트메탈을 형성하는 단계와 ; 1차 양극 산화막을 형성하는 단계와 ; 아몰퍼스 실리콘층 및 n+아몰퍼스 실리콘층을 연속적으로 적층하는 단계와 ; 액티브 패턴을 형성하는 단계와 ; 컨택트 패턴을형성하는 단계와 ; 소오스/드레인 메탈을 형성하는 단계와 ; 소오스/드레인 패턴을 형성하는 단계와 ; n+아몰퍼스실리콘층을 소오스/드레인 패턴 마스크로 하여 식각하는 단계와 ; 상기 소오스 메탈을 포토 레지스트로 마스킹하고 양극 산화하는 단계와 ; 화소 전극을 형성하는 단계와 ; 상기 화소전극을 사진 및 식각 기법으로 화소 전극 패턴을 형성하는 단계로 이루어진 것을 특징으로 하는 액정 디스플레이의 박막트랜지스터 소자 및 그 제조 방법에 관한 것이다.The present invention relates to a thin film transistor liquid crystal display device and a manufacturing method, comprising: forming an independent black matrix on each pixel on a glass plate for multilayering a storage capacitor; Forming an insulating film to prevent a short between the upper wirings; Forming a gate metal from a material capable of anodizing; Forming a primary anodic oxide film; Sequentially depositing an amorphous silicon layer and an n + amorphous silicon layer; Forming an active pattern; Forming a contact pattern; Forming a source / drain metal; Forming a source / drain pattern; etching the n + amorphous silicon layer using a source / drain pattern mask; Masking and anodizing the source metal with a photoresist; Forming a pixel electrode; A thin film transistor element of a liquid crystal display, and a method of manufacturing the same, comprising the steps of forming a pixel electrode pattern on the pixel electrode by photo and etching techniques.

Description

박막트랜지스터 액정 디스플레이 소자 및 제조방법Thin film transistor liquid crystal display device and manufacturing method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 이 발명의 바람직한 실시예에 따른 박막트랜지스터 액정 디스플레이 소자의 화소를 나타낸 평면도이고, 제4도의 (가)∼(자) 는 이 발명의 바람직한 실시예에 따른 박막트랜지스터 액정 디스플레이 소자의 공정 순서도이다.2 is a plan view showing a pixel of a thin film transistor liquid crystal display device according to a preferred embodiment of the present invention, Figure 4 (a) to (i) is a process flow chart of a thin film transistor liquid crystal display device according to a preferred embodiment of the present invention to be.

Claims (7)

유리판 위에 각 화소에 독립된 블랙매트릭스를 형성하는 단계와 ; 상기 독립된 블랙매트릭스와 상부 배선간의 쇼트를 방지하기 위하여 절연막을 형성하는 단계와 ;상기 절연막 위에 양극 산화가 가능한 물질로 게이트메탈을 형성하는 단계와 ; 상기 게이트메탈 위에 1차 양극 산화막을 형성하는 단계와 ; 상기 1차 양극산화막 위에 아몰퍼스실리콘층, n+아몰퍼스실리콘층을 연속적으로 적층하는 단계와 ; 상기 아몰퍼스실리콘층을 사진 및 식각 기법으로 액티브패턴을형성하는 단계와 ; 상기 독립된 블랙매트릭스와 연결하기 위해서 사진 및 식각 기법으로 콘택패턴을 형성하는 단계와 ;상기 n+아몰퍼스실리콘층 위에 소오스/드레인 메탈을 형성하는 단계와 ; 상기 소오스/드레인 메탈을 사진 및 식각 기법으로 소오스/드레인 패턴을 형성하는 단계와 ; 상기 n+아몰퍼스실리콘층을 소오스/드레인 패턴 마스크로하여 식각하는 단계와 ; 상기 소오스/드레인 메탈을 포토 레지스트로 마스킹하고 소오스/드레인 양극산화막을 형성하는 단계와 ; 상기 소오스/드레인 메탈 위에 화소전극을 형성하는 단계와 ; 상기 화소전극을 사진 및 식각 기법으로 화소전극 패턴을 형성하는단계로 이루어지는 것을 특징으로 하는 액정 디스플레이의 박막트랜지스터 소자의 제조 방법.Forming an independent black matrix on each pixel on the glass plate; Forming an insulating film to prevent a short between the independent black matrix and the upper wiring; forming a gate metal with a material capable of anodizing on the insulating film; Forming a primary anodic oxide film on the gate metal; Sequentially depositing an amorphous silicon layer and an n + amorphous silicon layer on the primary anodization film; Forming an active pattern on the amorphous silicon layer by a photo and etching technique; Forming a contact pattern by a photo and etching technique to connect with the independent black matrix; forming a source / drain metal on the n + amorphous silicon layer; Forming a source / drain pattern on the source / drain metal by photo and etching; Etching the n + amorphous silicon layer using a source / drain pattern mask; Masking the source / drain metal with a photoresist and forming a source / drain anodization film; Forming a pixel electrode on the source / drain metal; And forming a pixel electrode pattern on the pixel electrode by a photo and etching technique. 제1항에 있어서, 상기 블랙매트릭스는 크롬 또는 광차단 효과가 뛰어난 금속으로 이루어진 것을 특징으로하는 박막트랜지스터 액정 디스플레이 제조방법The method of claim 1, wherein the black matrix is made of chromium or a metal having excellent light blocking effect. 제1항에 있어서, 상기 블랙매트릭스 절연막은 SiNx, 또는 TaOx, SiOx 등으로 이루어진 것을 특징으로 하는박막트랜지스터 액정 디스플레이 제조방법.The method of claim 1, wherein the black matrix insulating film is formed of SiNx, TaOx, SiOx, or the like. 제1항에 있어서, 상기 게이트메탈은 알루미늄(Al)등으로 이루어진 것을 특징으로 하는 박막트랜지스터 액정 디스플레이 제조방법.The method of claim 1, wherein the gate metal is made of aluminum (Al), or the like. 제 1항에 있어서, 상기 아몰퍼스 실리콘층 및 n+아몰퍼스실리콘층은 플라즈마 화학 기상 성장기법(PlasmaEnhanced Chemical Vapor Deposition : PE CVD)으로 적층되는 것을 특징으로 하는 박막트랜지스터 액정 디스플레이 제조방법.The method of claim 1, wherein the amorphous silicon layer and the n + amorphous silicon layer are deposited by a plasma enhanced chemical vapor deposition (PE CVD) method. 블랙매트릭스와, 상기 블랙매트릭스 위에 형성된 블랙매트릭스 절연막과, 블랙매트릭스 절역막위에 형성된게이트 메탈과, 상기 게이트메탈 위에 형성된 1차 양극산화막과, 상기 1차 양극 산화막 위에 형성된 게이트 절연막과, 상기 게이트 절연막 위에 형성되고, 상기 게이트메탈과 콘택되는 아몰퍼스실리콘층 및 n+아몰퍼스 실리콘층과,상기 n+아몰퍼스 실리콘층 위에 형성되고 게이트 메탈의 게이트라인에 직교되게 형성된 소오스/드레인 메탈과, 상기 소오스/드레인 메탈 위에 형성된 소오스/드레인 양극 산화막과 상기 소오스/드레인 양극 산화막 위에 형성된 화소전극을 포함하고, 상기 게이트메탈과 블랙매트릭스의 사이에 캐패시터가 형성되고 상기 게이트메탈과 화소전극 사이에 캐패시터가형성된 것을 특징으로 하는 박막트랜지스터 액정 디스플레이 소자.A black matrix, a black matrix insulating film formed on the black matrix, a gate metal formed on the black matrix switching film, a primary anodized film formed on the gate metal, a gate insulating film formed on the first anode oxide film, and a gate insulating film formed on the black matrix An amorphous silicon layer and an n + amorphous silicon layer formed in contact with the gate metal, a source / drain metal formed on the n + amorphous silicon layer and orthogonal to a gate line of a gate metal, and on the source / drain metal And a pixel electrode formed on the formed source / drain anodic oxide film and the source / drain anodic oxide film, wherein a capacitor is formed between the gate metal and the black matrix, and a capacitor is formed between the gate metal and the pixel electrode. Transistor liquid crystal di Splay element. 제6항에 있어서, 상기 캐패시터는 전단게이트 접지방식을 취한 것을 특징으로 하는 박막트랜지스터 액정 디스플레이 소자.The thin film transistor liquid crystal display device of claim 6, wherein the capacitor has a shear gate grounding method. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940035629A 1994-12-21 1994-12-21 Thin film transistor liquid crystal display element and its manufacturing method KR0139375B1 (en)

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