KR960024414A - Semiconductor circuit test jig temperature measuring device - Google Patents

Semiconductor circuit test jig temperature measuring device Download PDF

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Publication number
KR960024414A
KR960024414A KR1019940035168A KR19940035168A KR960024414A KR 960024414 A KR960024414 A KR 960024414A KR 1019940035168 A KR1019940035168 A KR 1019940035168A KR 19940035168 A KR19940035168 A KR 19940035168A KR 960024414 A KR960024414 A KR 960024414A
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KR
South Korea
Prior art keywords
semiconductor circuit
test
temperature
test jig
temperature measuring
Prior art date
Application number
KR1019940035168A
Other languages
Korean (ko)
Other versions
KR0144830B1 (en
Inventor
예충일
Original Assignee
양승택
재단법인 한국전자통신연구소
조백제
한국전기통신공사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 양승택, 재단법인 한국전자통신연구소, 조백제, 한국전기통신공사 filed Critical 양승택
Priority to KR1019940035168A priority Critical patent/KR0144830B1/en
Publication of KR960024414A publication Critical patent/KR960024414A/en
Application granted granted Critical
Publication of KR0144830B1 publication Critical patent/KR0144830B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/01—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using semiconducting elements having PN junctions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

본 발명은 반도체회로의 전기적특성 시험시 DUT(Device Under Test : 시험 대상인 반도체 회로)와 거의 인접된 주변의 온도를 측정하여 주어진 온도에 따른 반도체회로의 전기적 특성을 알아보기 위한 반도체 회로 시험지그 온도측정장치에 관한 것이다.The present invention is a semiconductor circuit test jig temperature measurement to determine the electrical characteristics of the semiconductor circuit according to a given temperature by measuring the temperature of the ambient close to the DUT (Device Under Test) in the electrical characteristics test of the semiconductor circuit Relates to a device.

상기 시험대상인 반도체 회로의 온도를 측정하기 위해 반도체 회로에 근접되고 상기 ATE의 전압인가-전류측정 모듈 및 접지(Ground)사이에 역방향으로 연결된 다이오드를 부가한다.In order to measure the temperature of the semiconductor circuit under test, a diode is added close to the semiconductor circuit and connected in a reverse direction between the voltage-applied-current measuring module and the ground of the ATE.

Description

반도체 회로 시험지그 온도 측정장치Semiconductor circuit test jig temperature measuring device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명에 의한 시험지그 온도측정장치의 전체적인 구성을 나타낸 도면이다, 제2도는 본 발명에 따른 웨이퍼 온도측정장치의 개략적인 구성을 나타낸 도면이다.1 is a view showing the overall configuration of the test jig temperature measuring apparatus according to the present invention, Figure 2 is a view showing a schematic configuration of a wafer temperature measuring apparatus according to the present invention.

Claims (3)

ATE(Automatic Test Equipment)의 헤드상에 시험대상인 반도체 회로를 장착한 시험지그를 부착하여 온도변화에 따라 반도체회로의 전기적 특성을 측정하는 장치에 있어서, 상기 시험대상인 반도체 회로의 온도를 측정하기 위해 반도체 회로에 근접되고 상기 ATE의 전압인가-전류측정 모듈 및 접지(Ground)사이에 역방향으로 연결된 다이오드를 부가한 것을 특징으로 하는 시험지그 온도측정장치.A device for measuring electrical characteristics of a semiconductor circuit according to temperature change by attaching a test jig equipped with a semiconductor circuit under test on a head of an automatic test equipment (ATE), the semiconductor circuit for measuring a temperature of the semiconductor circuit under test And a diode connected in a reverse direction between the voltage application-current measurement module and the ground of the ATE. 제1항에 있어서, 상기 시험대상이 웨이퍼인 경우 웨이퍼의 접지메탈과 패드사이에 역방향으로 연결된 다이오드를 설치한 것을 특징으로 하는 시험지그 온도측정장치.The test jig temperature measuring apparatus according to claim 1, wherein a diode connected in a reverse direction between a ground metal of the wafer and a pad is provided when the test object is a wafer. 제1항 또는 제2항에 있어서, 측정오차를 줄이기 위해 상기 다이오드가 역방향포화전류값이 큰 게르마늄 다이오드인 것을 특징으로 하는 시험지그 온도측정장치.The test jig temperature measuring apparatus according to claim 1 or 2, wherein the diode is a germanium diode having a large reverse saturation current value in order to reduce a measurement error. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940035168A 1994-12-19 1994-12-19 Apparatus for test-jig temperature measurement KR0144830B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940035168A KR0144830B1 (en) 1994-12-19 1994-12-19 Apparatus for test-jig temperature measurement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940035168A KR0144830B1 (en) 1994-12-19 1994-12-19 Apparatus for test-jig temperature measurement

Publications (2)

Publication Number Publication Date
KR960024414A true KR960024414A (en) 1996-07-20
KR0144830B1 KR0144830B1 (en) 1998-08-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940035168A KR0144830B1 (en) 1994-12-19 1994-12-19 Apparatus for test-jig temperature measurement

Country Status (1)

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KR (1) KR0144830B1 (en)

Also Published As

Publication number Publication date
KR0144830B1 (en) 1998-08-17

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