KR960019618A - 큐어장치 - Google Patents

큐어장치 Download PDF

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Publication number
KR960019618A
KR960019618A KR1019950038566A KR19950038566A KR960019618A KR 960019618 A KR960019618 A KR 960019618A KR 1019950038566 A KR1019950038566 A KR 1019950038566A KR 19950038566 A KR19950038566 A KR 19950038566A KR 960019618 A KR960019618 A KR 960019618A
Authority
KR
South Korea
Prior art keywords
sample
heat
side surfaces
heat block
cure device
Prior art date
Application number
KR1019950038566A
Other languages
English (en)
Other versions
KR100186873B1 (ko
Inventor
미츠오 아라이
Original Assignee
후지야마 겐지
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지야마 겐지, 가부시키가이샤 신가와 filed Critical 후지야마 겐지
Publication of KR960019618A publication Critical patent/KR960019618A/ko
Application granted granted Critical
Publication of KR100186873B1 publication Critical patent/KR100186873B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)

Abstract

각 히트블록의 온도를 확실하게 제어가능하고, 또 그 제어가 용이한 큐어장치를 제공한다. 시료를 가열하기 위한 복수개의 히트블록(29)은 히트블록 본체(32)의 하면, 시료반송방향의 양측면 및 시료반송방향과 직각방향의 양측면에 각각 단열판(34,35)을 고정하였다.

Description

큐어장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 큐어장치의 일실시예를 나타내는 정면도.

Claims (2)

  1. 리드프레임의 페이스트를 통하여 칩이 본딩된 시료의 시료반송방향으로 간극을 가지고 배열설치되고, 상기 시료를 가열하기 위한 복수개의 히트블록을 갖는 큐어장치에 있어서, 상기 각 히트블록은 히트블록 본체의 하면, 시료반송방향의 양측면 및 시료반송방향과 직각방향의 양측면에 각각 단열판을 고정한 것을 특징으로 하는 큐어장치.
  2. 제1항에 있어서, 상기 히트블록 본체의 상면에는 핫플레이트가 고정되어 있는 것을 특징으로 하는 큐어장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950038566A 1994-11-25 1995-10-31 큐어장치 KR100186873B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP06314281A JP3106341B2 (ja) 1994-11-25 1994-11-25 キュア装置
JP94-314281 1994-11-25

Publications (2)

Publication Number Publication Date
KR960019618A true KR960019618A (ko) 1996-06-17
KR100186873B1 KR100186873B1 (ko) 1999-04-15

Family

ID=18051481

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950038566A KR100186873B1 (ko) 1994-11-25 1995-10-31 큐어장치

Country Status (4)

Country Link
US (1) US5632617A (ko)
JP (1) JP3106341B2 (ko)
KR (1) KR100186873B1 (ko)
TW (1) TW305481U (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004286425A (ja) * 2003-03-06 2004-10-14 Ngk Insulators Ltd 線材を用いた搬送機構並びにそれを使用した熱処理炉及び熱処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3374995A (en) * 1965-12-20 1968-03-26 Selas Corp Of America Continuous heat treating furnace
US4310745A (en) * 1979-04-20 1982-01-12 Huebner Bros. Of Canada Ltd. Heating assemblies
US5154604A (en) * 1990-04-23 1992-10-13 Kabushiki Kaisha Shinkawa Curing apparatus
JP2841136B2 (ja) * 1991-10-15 1998-12-24 株式会社新川 キュア装置
JP2922726B2 (ja) * 1992-07-01 1999-07-26 株式会社フジタ 掘削機のバケット誘導システム

Also Published As

Publication number Publication date
KR100186873B1 (ko) 1999-04-15
TW305481U (en) 1997-05-11
US5632617A (en) 1997-05-27
JP3106341B2 (ja) 2000-11-06
JPH08148513A (ja) 1996-06-07

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