KR960019618A - 큐어장치 - Google Patents
큐어장치 Download PDFInfo
- Publication number
- KR960019618A KR960019618A KR1019950038566A KR19950038566A KR960019618A KR 960019618 A KR960019618 A KR 960019618A KR 1019950038566 A KR1019950038566 A KR 1019950038566A KR 19950038566 A KR19950038566 A KR 19950038566A KR 960019618 A KR960019618 A KR 960019618A
- Authority
- KR
- South Korea
- Prior art keywords
- sample
- heat
- side surfaces
- heat block
- cure device
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 claims abstract 2
- 238000009413 insulation Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Sampling And Sample Adjustment (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
Abstract
각 히트블록의 온도를 확실하게 제어가능하고, 또 그 제어가 용이한 큐어장치를 제공한다. 시료를 가열하기 위한 복수개의 히트블록(29)은 히트블록 본체(32)의 하면, 시료반송방향의 양측면 및 시료반송방향과 직각방향의 양측면에 각각 단열판(34,35)을 고정하였다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 큐어장치의 일실시예를 나타내는 정면도.
Claims (2)
- 리드프레임의 페이스트를 통하여 칩이 본딩된 시료의 시료반송방향으로 간극을 가지고 배열설치되고, 상기 시료를 가열하기 위한 복수개의 히트블록을 갖는 큐어장치에 있어서, 상기 각 히트블록은 히트블록 본체의 하면, 시료반송방향의 양측면 및 시료반송방향과 직각방향의 양측면에 각각 단열판을 고정한 것을 특징으로 하는 큐어장치.
- 제1항에 있어서, 상기 히트블록 본체의 상면에는 핫플레이트가 고정되어 있는 것을 특징으로 하는 큐어장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP06314281A JP3106341B2 (ja) | 1994-11-25 | 1994-11-25 | キュア装置 |
JP94-314281 | 1994-11-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960019618A true KR960019618A (ko) | 1996-06-17 |
KR100186873B1 KR100186873B1 (ko) | 1999-04-15 |
Family
ID=18051481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950038566A KR100186873B1 (ko) | 1994-11-25 | 1995-10-31 | 큐어장치 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5632617A (ko) |
JP (1) | JP3106341B2 (ko) |
KR (1) | KR100186873B1 (ko) |
TW (1) | TW305481U (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004286425A (ja) * | 2003-03-06 | 2004-10-14 | Ngk Insulators Ltd | 線材を用いた搬送機構並びにそれを使用した熱処理炉及び熱処理方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3374995A (en) * | 1965-12-20 | 1968-03-26 | Selas Corp Of America | Continuous heat treating furnace |
US4310745A (en) * | 1979-04-20 | 1982-01-12 | Huebner Bros. Of Canada Ltd. | Heating assemblies |
US5154604A (en) * | 1990-04-23 | 1992-10-13 | Kabushiki Kaisha Shinkawa | Curing apparatus |
JP2841136B2 (ja) * | 1991-10-15 | 1998-12-24 | 株式会社新川 | キュア装置 |
JP2922726B2 (ja) * | 1992-07-01 | 1999-07-26 | 株式会社フジタ | 掘削機のバケット誘導システム |
-
1994
- 1994-11-25 JP JP06314281A patent/JP3106341B2/ja not_active Expired - Fee Related
-
1995
- 1995-10-31 KR KR1019950038566A patent/KR100186873B1/ko not_active IP Right Cessation
- 1995-11-21 US US08/561,401 patent/US5632617A/en not_active Expired - Fee Related
-
1996
- 1996-02-24 TW TW085217106U patent/TW305481U/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR100186873B1 (ko) | 1999-04-15 |
TW305481U (en) | 1997-05-11 |
US5632617A (en) | 1997-05-27 |
JP3106341B2 (ja) | 2000-11-06 |
JPH08148513A (ja) | 1996-06-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69012745D1 (de) | Wärmeübertragungsblatt. | |
DE3675337D1 (de) | Druckmaterial fuer uebertragung durch waerme. | |
DE3580945D1 (de) | Waermetransportvorrichtung. | |
ATE238639T1 (de) | Ptc-heizvorrichtung mit klebstoff | |
IT1280150B1 (it) | Combinazione di componenti per piastre elettriche di riscaldamento, dispositivi di accensione, sensori di temperatura o simili | |
KR960019618A (ko) | 큐어장치 | |
NO164210C (no) | Elektrisk radiator for oppvarmingsformaal. | |
DE69512969D1 (de) | Aufzeichnungsblatt für die Wärmeübertragung von Heissschmelztinte | |
DE69003925D1 (de) | Wärmeübertragungsblatt. | |
NO913669D0 (no) | Prefabrikert plateelement for et flateklimatiseringsanlegg | |
DE68906533D1 (de) | Heizungsvorrichtung mit waermeaustauschvorrichtung. | |
DE69814209D1 (de) | Wärmeerzeuger mit viskoser Flüssigkeit mit Mitteln zur Verbesserung des Wärmeübergangs | |
IT1239317B (it) | Dispositivo formante guarnizione di tenuta per piastra di scambiatore di calore dotato di piastre aventi tale dispositivo. | |
DE3772564D1 (de) | Plattenwaermetauscher mit identischen rahmenplatten und druckplatten. | |
IT8820975A0 (it) | Dispositivo per il raffreddamento di zone con superficie di scambio termico limitata, in particolareper componenti elettronici. | |
DE69017689D1 (de) | Plattenwärmetauscher. | |
DE3772562D1 (de) | Waermehaerthare harzzusammensetzung. | |
ATE325242T1 (de) | Wärmedämmplatte | |
ZA835822B (en) | Heat transfer panel and an underfloor heating or cooling system employing the same | |
NO894572D0 (no) | Platevarmeveksler. | |
DK622284A (da) | Pladevarmeveksler til opvarmning eller koeling af flydende stoffer | |
AR232043A1 (es) | Mejoras en radiadores de calefaccion por liquido electrocalentado | |
KR970067807A (ko) | 체이스 예열장치(chase preheater) | |
KR910007569U (ko) | 전기식 간접열 교환에 의한 난방장치 | |
KR960019185U (ko) | 압전기판 열경화장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
G170 | Re-publication after modification of scope of protection [patent] | ||
FPAY | Annual fee payment |
Payment date: 20011206 Year of fee payment: 6 |
|
LAPS | Lapse due to unpaid annual fee |