KR960011265B1 - 노운 굳 다이 어레이용 테스트 소켓 - Google Patents

노운 굳 다이 어레이용 테스트 소켓 Download PDF

Info

Publication number
KR960011265B1
KR960011265B1 KR1019930011670A KR930011670A KR960011265B1 KR 960011265 B1 KR960011265 B1 KR 960011265B1 KR 1019930011670 A KR1019930011670 A KR 1019930011670A KR 930011670 A KR930011670 A KR 930011670A KR 960011265 B1 KR960011265 B1 KR 960011265B1
Authority
KR
South Korea
Prior art keywords
socket
lead frame
test
leads
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019930011670A
Other languages
English (en)
Korean (ko)
Other versions
KR950001971A (ko
Inventor
김일웅
최시돈
Original Assignee
삼성전자 주식회사
김광호
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자 주식회사, 김광호 filed Critical 삼성전자 주식회사
Priority to KR1019930011670A priority Critical patent/KR960011265B1/ko
Priority to FR9407822A priority patent/FR2707013A1/fr
Priority to JP6144920A priority patent/JP2960649B2/ja
Priority to US08/266,533 priority patent/US5479105A/en
Publication of KR950001971A publication Critical patent/KR950001971A/ko
Application granted granted Critical
Publication of KR960011265B1 publication Critical patent/KR960011265B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Environmental & Geological Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1019930011670A 1993-06-25 1993-06-25 노운 굳 다이 어레이용 테스트 소켓 Expired - Fee Related KR960011265B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1019930011670A KR960011265B1 (ko) 1993-06-25 1993-06-25 노운 굳 다이 어레이용 테스트 소켓
FR9407822A FR2707013A1 (en) 1993-06-25 1994-06-24 Apparatus for testing microchips regarded as serviceable
JP6144920A JP2960649B2 (ja) 1993-06-25 1994-06-27 Ｋｇｄアレイ用テストアセンブリ
US08/266,533 US5479105A (en) 1993-06-25 1994-06-27 Known-good die testing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019930011670A KR960011265B1 (ko) 1993-06-25 1993-06-25 노운 굳 다이 어레이용 테스트 소켓

Publications (2)

Publication Number Publication Date
KR950001971A KR950001971A (ko) 1995-01-04
KR960011265B1 true KR960011265B1 (ko) 1996-08-21

Family

ID=19358007

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930011670A Expired - Fee Related KR960011265B1 (ko) 1993-06-25 1993-06-25 노운 굳 다이 어레이용 테스트 소켓

Country Status (4)

Country Link
US (1) US5479105A (enExample)
JP (1) JP2960649B2 (enExample)
KR (1) KR960011265B1 (enExample)
FR (1) FR2707013A1 (enExample)

Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6525555B1 (en) * 1993-11-16 2003-02-25 Formfactor, Inc. Wafer-level burn-in and test
EP1251550B1 (en) * 1994-04-18 2005-03-30 Micron Technology, Inc. Method and apparatus for automatically positioning electronic die within component packages
US5880591A (en) * 1996-04-16 1999-03-09 Teradyne, Inc. System for circuit modules having a plurality of independently positionable probes
KR0175268B1 (ko) * 1996-05-10 1999-04-01 김광호 수평 하향식 접속 방식의 베어 칩 테스트 장치
KR100291382B1 (ko) * 1997-04-30 2001-06-01 박주천 반도체소자 검사용 트레이
US6140827A (en) 1997-12-18 2000-10-31 Micron Technology, Inc. Method and apparatus for testing bumped die
WO2000011487A1 (en) * 1998-08-19 2000-03-02 Eles Equipment S.R.L. Equipment for performing electrical and environmental tests on semiconductor electronic devices
KR100495091B1 (ko) * 1998-09-21 2005-09-02 삼성전자주식회사 노운 굳 다이 캐리어
US6214716B1 (en) 1998-09-30 2001-04-10 Micron Technology, Inc. Semiconductor substrate-based BGA interconnection and methods of farication same
US6392427B1 (en) 1998-12-21 2002-05-21 Kaitech Engineering, Inc. Testing electronic devices
KR100327335B1 (ko) 1999-07-22 2002-03-06 윤종용 칩크기 반도체 패키지의 제조방법
US6560735B1 (en) * 1999-08-03 2003-05-06 Agere Systems Inc Methods and apparatus for testing integrated circuits
JP2001116791A (ja) * 1999-10-20 2001-04-27 Fujitsu Ltd 電子部品試験装置及び電気接続体
US6476629B1 (en) * 2000-02-23 2002-11-05 Micron Technology, Inc. In-tray burn-in board for testing integrated circuit devices in situ on processing trays
US6754866B1 (en) * 2001-09-28 2004-06-22 Inapac Technology, Inc. Testing of integrated circuit devices
US6812726B1 (en) * 2002-11-27 2004-11-02 Inapac Technology, Inc. Entering test mode and accessing of a packaged semiconductor device
US7240254B2 (en) * 2000-09-21 2007-07-03 Inapac Technology, Inc Multiple power levels for a chip within a multi-chip semiconductor package
US7444575B2 (en) * 2000-09-21 2008-10-28 Inapac Technology, Inc. Architecture and method for testing of an integrated circuit device
US6732304B1 (en) * 2000-09-21 2004-05-04 Inapac Technology, Inc. Chip testing within a multi-chip semiconductor package
US8001439B2 (en) 2001-09-28 2011-08-16 Rambus Inc. Integrated circuit testing module including signal shaping interface
US20040019841A1 (en) * 2002-07-25 2004-01-29 Ong Adrian E. Internally generating patterns for testing in an integrated circuit device
US7313740B2 (en) * 2002-07-25 2007-12-25 Inapac Technology, Inc. Internally generating patterns for testing in an integrated circuit device
US8166361B2 (en) 2001-09-28 2012-04-24 Rambus Inc. Integrated circuit testing module configured for set-up and hold time testing
US8286046B2 (en) 2001-09-28 2012-10-09 Rambus Inc. Integrated circuit testing module including signal shaping interface
US7061263B1 (en) 2001-11-15 2006-06-13 Inapac Technology, Inc. Layout and use of bond pads and probe pads for testing of integrated circuits devices
US20040094828A1 (en) * 2002-01-16 2004-05-20 Delphi Technologies, Inc. Double-sided multi-chip circuit component
US6776662B2 (en) * 2002-09-27 2004-08-17 Agilent Technologies, Inc. Discrete connector termination adapter
US8063650B2 (en) 2002-11-27 2011-11-22 Rambus Inc. Testing fuse configurations in semiconductor devices
US6881074B1 (en) * 2003-09-29 2005-04-19 Cookson Electronics, Inc. Electrical circuit assembly with micro-socket
US7371459B2 (en) 2004-09-03 2008-05-13 Tyco Electronics Corporation Electrical devices having an oxygen barrier coating
US7656173B1 (en) * 2006-04-27 2010-02-02 Utac Thai Limited Strip socket having a recessed portions in the base to accept bottom surface of packaged semiconductor devices mounted on a leadframe for testing and burn-in
US8310060B1 (en) 2006-04-28 2012-11-13 Utac Thai Limited Lead frame land grid array
US8461694B1 (en) 2006-04-28 2013-06-11 Utac Thai Limited Lead frame ball grid array with traces under die having interlocking features
US8460970B1 (en) 2006-04-28 2013-06-11 Utac Thai Limited Lead frame ball grid array with traces under die having interlocking features
US8487451B2 (en) 2006-04-28 2013-07-16 Utac Thai Limited Lead frame land grid array with routing connector trace under unit
US8492906B2 (en) 2006-04-28 2013-07-23 Utac Thai Limited Lead frame ball grid array with traces under die
US8013437B1 (en) 2006-09-26 2011-09-06 Utac Thai Limited Package with heat transfer
US8125077B2 (en) 2006-09-26 2012-02-28 Utac Thai Limited Package with heat transfer
WO2008042403A2 (en) 2006-10-03 2008-04-10 Inapac Technologies, Inc. Memory accessing circuit system
US9761435B1 (en) 2006-12-14 2017-09-12 Utac Thai Limited Flip chip cavity package
US9711343B1 (en) 2006-12-14 2017-07-18 Utac Thai Limited Molded leadframe substrate semiconductor package
US7602201B2 (en) * 2007-06-22 2009-10-13 Qualitau, Inc. High temperature ceramic socket configured to test packaged semiconductor devices
US7888955B2 (en) * 2007-09-25 2011-02-15 Formfactor, Inc. Method and apparatus for testing devices using serially controlled resources
US7977959B2 (en) * 2007-09-27 2011-07-12 Formfactor, Inc. Method and apparatus for testing devices using serially controlled intelligent switches
US7790512B1 (en) 2007-11-06 2010-09-07 Utac Thai Limited Molded leadframe substrate semiconductor package
US20090164931A1 (en) * 2007-12-19 2009-06-25 Formfactor, Inc. Method and Apparatus for Managing Test Result Data Generated by a Semiconductor Test System
US20090224793A1 (en) * 2008-03-07 2009-09-10 Formfactor, Inc. Method And Apparatus For Designing A Custom Test System
US8122309B2 (en) * 2008-03-11 2012-02-21 Formfactor, Inc. Method and apparatus for processing failures during semiconductor device testing
US7888688B2 (en) * 2008-04-29 2011-02-15 Bridgelux, Inc. Thermal management for LED
US8063470B1 (en) 2008-05-22 2011-11-22 Utac Thai Limited Method and apparatus for no lead semiconductor package
US8080827B2 (en) * 2008-07-31 2011-12-20 Bridgelux, Inc. Top contact LED thermal management
US8095841B2 (en) * 2008-08-19 2012-01-10 Formfactor, Inc. Method and apparatus for testing semiconductor devices with autonomous expected value generation
US9947605B2 (en) 2008-09-04 2018-04-17 UTAC Headquarters Pte. Ltd. Flip chip cavity package
US7859190B2 (en) * 2008-09-10 2010-12-28 Bridgelux, Inc. Phosphor layer arrangement for use with light emitting diodes
US7944225B2 (en) 2008-09-26 2011-05-17 Formfactor, Inc. Method and apparatus for providing a tester integrated circuit for testing a semiconductor device under test
US8334764B1 (en) 2008-12-17 2012-12-18 Utac Thai Limited Method and apparatus to prevent double semiconductor units in test socket
US8367476B2 (en) 2009-03-12 2013-02-05 Utac Thai Limited Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide
US20100332177A1 (en) * 2009-06-30 2010-12-30 National Tsing Hua University Test access control apparatus and method thereof
US9449900B2 (en) * 2009-07-23 2016-09-20 UTAC Headquarters Pte. Ltd. Leadframe feature to minimize flip-chip semiconductor die collapse during flip-chip reflow
US8368189B2 (en) 2009-12-04 2013-02-05 Utac Thai Limited Auxiliary leadframe member for stabilizing the bond wire process
US9355940B1 (en) 2009-12-04 2016-05-31 Utac Thai Limited Auxiliary leadframe member for stabilizing the bond wire process
US8575732B2 (en) 2010-03-11 2013-11-05 Utac Thai Limited Leadframe based multi terminal IC package
US8871571B2 (en) 2010-04-02 2014-10-28 Utac Thai Limited Apparatus for and methods of attaching heat slugs to package tops
CN102565652A (zh) * 2010-12-30 2012-07-11 展晶科技(深圳)有限公司 发光二极管封装结构检测装置及检测方法
US9029198B2 (en) 2012-05-10 2015-05-12 Utac Thai Limited Methods of manufacturing semiconductor devices including terminals with internal routing interconnections
US9449905B2 (en) 2012-05-10 2016-09-20 Utac Thai Limited Plated terminals with routing interconnections semiconductor device
US9006034B1 (en) 2012-06-11 2015-04-14 Utac Thai Limited Post-mold for semiconductor package having exposed traces
US10242953B1 (en) 2015-05-27 2019-03-26 Utac Headquarters PTE. Ltd Semiconductor package with plated metal shielding and a method thereof
US10242934B1 (en) 2014-05-07 2019-03-26 Utac Headquarters Pte Ltd. Semiconductor package with full plating on contact side surfaces and methods thereof
US9922843B1 (en) 2015-11-10 2018-03-20 UTAC Headquarters Pte. Ltd. Semiconductor package with multiple molding routing layers and a method of manufacturing the same
US10276477B1 (en) 2016-05-20 2019-04-30 UTAC Headquarters Pte. Ltd. Semiconductor package with multiple stacked leadframes and a method of manufacturing the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4329642A (en) * 1979-03-09 1982-05-11 Siliconix, Incorporated Carrier and test socket for leadless integrated circuit
US4644269A (en) * 1983-05-31 1987-02-17 Pylon Company Test fixture having full surface contact hinged lid
US5008615A (en) * 1989-11-03 1991-04-16 Motorola, Inc. Means and method for testing integrated circuits attached to a leadframe
US5177439A (en) * 1991-08-30 1993-01-05 U.S. Philips Corporation Probe card for testing unencapsulated semiconductor devices
US5175491A (en) * 1991-09-18 1992-12-29 Sgs-Thomson Microelectronics, Inc. Integrated circuit testing fixture
US5180974A (en) * 1992-05-26 1993-01-19 Micron Technology, Inc. Semiconductor testing and shipping system
KR960000793B1 (ko) * 1993-04-07 1996-01-12 삼성전자주식회사 노운 굳 다이 어레이 및 그 제조방법
KR100935769B1 (ko) * 2008-05-02 2010-01-06 소리젠 주식회사 피드백 제어를 갖는 주파수 특성 보상형 능동형 소음 제어장치 및 방법

Also Published As

Publication number Publication date
JPH0755878A (ja) 1995-03-03
FR2707013A1 (en) 1994-12-30
US5479105A (en) 1995-12-26
JP2960649B2 (ja) 1999-10-12
FR2707013B1 (enExample) 1997-12-12
KR950001971A (ko) 1995-01-04

Similar Documents

Publication Publication Date Title
KR960011265B1 (ko) 노운 굳 다이 어레이용 테스트 소켓
KR960000793B1 (ko) 노운 굳 다이 어레이 및 그 제조방법
US4992849A (en) Directly bonded board multiple integrated circuit module
US4992850A (en) Directly bonded simm module
KR100370308B1 (ko) 반도체웨이퍼의탐침검사방법
US5677569A (en) Semiconductor multi-package stack
US6777798B2 (en) Stacked semiconductor device structure
US6218202B1 (en) Semiconductor device testing and burn-in methodology
JP2765823B2 (ja) ３次元積層型パッケージ素子
US5998865A (en) Loc simm
US5280193A (en) Repairable semiconductor multi-package module having individualized package bodies on a PC board substrate
US6249052B1 (en) Substrate on chip (SOC) multiple-chip module (MCM) with chip-size-package (CSP) ready configuration
US6680212B2 (en) Method of testing and constructing monolithic multi-chip modules
KR960008514B1 (ko) 테스트 소켓 및 그를 이용한 노운 굳 다이 제조방법
US20010006828A1 (en) Stacked chip packaging
USRE36325E (en) Directly bonded SIMM module
JP2004138391A (ja) 半導体装置の製造方法
KR0141453B1 (ko) 노운 굳 다이의 제조장치와 제조방법
KR0125970B1 (ko) 노운 굳 다이 어레이용 테스트 소켓
KR950012291B1 (ko) 테스트 소켓 및 그를 이용한 노운 굿 다이 제조방법
US6365437B2 (en) Method of connecting a die in an integrated circuit module
WO1999026288A1 (en) Semiconductor device and method for manufacturing the same
JP2870115B2 (ja) ピングリッドアレイパッケージ型半導体装置
JP2898396B2 (ja) メモリ・アレイ
KR930011117B1 (ko) 반도체 패키지 및 그 실장방법

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

St.27 status event code: A-2-2-Q10-Q13-nap-PG1605

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

FPAY Annual fee payment

Payment date: 20080729

Year of fee payment: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20090822

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20090822

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000