KR960010902A - 폴리 카보네이트 및 폴리 카보네이트가 다량 함유된 수지 제품의 전자파 차폐를 위한 무전해 도금 방법 - Google Patents

폴리 카보네이트 및 폴리 카보네이트가 다량 함유된 수지 제품의 전자파 차폐를 위한 무전해 도금 방법 Download PDF

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KR960010902A
KR960010902A KR1019940022514A KR19940022514A KR960010902A KR 960010902 A KR960010902 A KR 960010902A KR 1019940022514 A KR1019940022514 A KR 1019940022514A KR 19940022514 A KR19940022514 A KR 19940022514A KR 960010902 A KR960010902 A KR 960010902A
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polycarbonate
plating
solution
hydrochloric acid
acid
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KR1019940022514A
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KR0120943B1 (ko
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조정제
한광희
김순택
박종육
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김순택
호진산업 주식회사
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Abstract

본 발명은 엔진니어링 플라스틱중 최근 산업 전반에 걸쳐 그 사용 용도가 점차 확대 되어 가고 있는 폴리카보네이트(PC) 및 폴리카보네이트(PC)가 70%이상 함유되어 있는 복합수지 제품의 전자파를 차폐하기 위한 무전해 도금방법에 관한 것으로서, 폴리카보네이트(PC) 및 폴리카모네이트(PC) 수지의 성분이 다량 함유된 피도금물의 표면을 1,3-다이클로로-2-프로판올(1,3-dichloro-2-propanol)과 소디움 알킬나프탈렌인 셀페이트(sodium alkyl naphtalene sulfonate)를 혼합한 용액으로 부풀린 후, 무수 크롬산 400g/l과 황산 200-250g/l으로 에칭하여 회수 및 수세한 후 하이드록실아민 설페이트(hydrox ylamine sulfate)와 염산을 혼합한 용액을 사용하여 중화하는 공정과, 에틸렌 다이아민(ethylene diamine)과 염산으로 도금물의 표면에 친수성과 극성을 부여하는 공정과, 염과 파라듐(PdCl2) 및 염화제일주석(SnCl2)을 각각 0.2g/l,5-20g/l를 혼합한 촉매 부여액과 염산 100㏄/l로 활성처리후 수세하고 재차 부피농도 10-15% 활성처리후 수세하는 공정과, 1차로 염화동(CuCl2)l-2g/l, 호르말린(CH2O) 2.0-3.0g/l, 가성소다 6-7g/l, EDTA(Ethylen Diamine Tetra Acetic Acid)15-20g/l, 2,2-비피리딜(2,2-bipyridyl)을 혼합한 화학동을 도금하는 공정과, 2차로 황상니켈 30g/l, 차인산소다(NaH2PO2H2O)20g/l, 구연산소다 20g/l를 혼합한 도금액 속에서 무전해 니켈 도금을 행하는 것을 특징으로 한다.

Description

폴리카보네이트 및 폴리카보네이트가 다량 함유된 수지 제품의 전자파 차폐를 위한 무전해 도금방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (2)

  1. 폴리카보네이트(PC) 및 폴리카보네이트(PC)수지의 성분이 다량 함유된 복합 수지 제품의 피도금물을 표면을 1,3-다이클로로-2-프로판올(1,3-dichloro-2-propanol)과 소디움 알킬나프탈레인 셀페이트(sodium alkyl naphtalene sulfonate)를 혼합한 용액으로 부풀리고, 무수크롬산 400g/l과 황산 200~250g/l으로 예칭하여 회수 및 수세하는 공정과 하이드록실아민 설페이트(hydroxylamine sulfate)와 염산을 혼합한 용액을 사용해 중화하고, 에틸렌 다이아민(ethylene diamine)과 염산으로 도금물의 표면에 친수성과 극성을 부여하여 파라듐과의 흡착을 향상시키는 긋엉부여 공정과, 염화파라듐(PdCl2) 및 염화제일주석(SnCl2)을 각각 0.2g/l,5-20g/l를 혼합한 촉메 부여액과 염산 100㏄/l로써 활성처리후 수세하고 다시, 부피농도 10-15% 황산으로 활성처리후 수세하는 공정과 1차로 염화동(CuCl2)l-2g/l, 호르마린(CH2O)2.0-3.0g/l, 가성소다 6-7g/l, EDTA(Ethylene Diamine Tetra Acetic Acid)15-20g/l, 2,2-비피리딜(2,2-bipyridyl)을 혼합한 수용액으로써 화학동을 도금하는 공정과, 2차로 황상니켈 30g/l, 차인산소다(NaH2PO2H2O)20g/l, 구연산소다 20g/l를 혼합한 도금액 속에서 무전해 니켈 도금을 하는 것을 특징으로 하는 폴리카보네이트(PC) 및 폴리카보네이트(PC)수지 제품의 전자파 차폐를 위한 무전해 도금 방법.
  2. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940022514A 1994-09-07 1994-09-07 폴리카보네이트 및 폴리카보네이트가 다량 함유된 수지 제품의 전자파 차폐를 위한 무전해 도금시의 전처리방법 KR0120943B1 (ko)

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KR1019940022514A KR0120943B1 (ko) 1994-09-07 1994-09-07 폴리카보네이트 및 폴리카보네이트가 다량 함유된 수지 제품의 전자파 차폐를 위한 무전해 도금시의 전처리방법

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KR1019940022514A KR0120943B1 (ko) 1994-09-07 1994-09-07 폴리카보네이트 및 폴리카보네이트가 다량 함유된 수지 제품의 전자파 차폐를 위한 무전해 도금시의 전처리방법

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100839557B1 (ko) * 2006-12-04 2008-06-19 주식회사 갤트로닉스 코리아 도금 촉진잉크를 이용한 무선통신기기용 안테나의 제조방법및 그 안테나

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101980609B1 (ko) * 2018-03-22 2019-05-21 유주티엔씨(주) 스마트 자동차용, 모바일기기용 및 웨어러블기기용 소재의 전자파 차폐 코팅방법
CN110791752B (zh) * 2018-08-02 2022-01-11 维洲Tnc株式会社 电磁波屏蔽涂敷方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100839557B1 (ko) * 2006-12-04 2008-06-19 주식회사 갤트로닉스 코리아 도금 촉진잉크를 이용한 무선통신기기용 안테나의 제조방법및 그 안테나

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