KR960009081A - Manufacturing apparatus and manufacturing method of resin-sealed semiconductor device - Google Patents

Manufacturing apparatus and manufacturing method of resin-sealed semiconductor device Download PDF

Info

Publication number
KR960009081A
KR960009081A KR1019950028058A KR19950028058A KR960009081A KR 960009081 A KR960009081 A KR 960009081A KR 1019950028058 A KR1019950028058 A KR 1019950028058A KR 19950028058 A KR19950028058 A KR 19950028058A KR 960009081 A KR960009081 A KR 960009081A
Authority
KR
South Korea
Prior art keywords
resin
gate
cavity
runner
lead frame
Prior art date
Application number
KR1019950028058A
Other languages
Korean (ko)
Inventor
고우스께 아즈마
다께히또 이나바
아쯔히꼬 이즈미
Original Assignee
가네꼬 하사시
닛본덴기 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가네꼬 하사시, 닛본덴기 가부시끼가이샤 filed Critical 가네꼬 하사시
Publication of KR960009081A publication Critical patent/KR960009081A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

수비 패키지의 수지 성형 후에 런너부의 수지 부분을 분리할 때에 케이트부의 수지 부분이 불안정한 상태로 잔존하고, 이것이 최공 공정까지의 사이에 낙하되어 결합이 발생하는 것을 방지한 수지 밀봉형 반도체 장치의 제조 장치의 제조 방법을 제공한다.When the resin portion of the runner portion is separated after the resin molding of the defensive package, the resin portion of the gate portion remains in an unstable state, and this falls down to the highest process and prevents the occurrence of bonding. It provides a manufacturing method.

반도체 소자(1)을 탑재한 리드 프레임(30)을 수지 몰드하여 수지 패키지를 형성하기 위한 금형 장치에 있어서, 한쪽 금형(20)에 설치된 캐비티(21)에 연통되는 런너(22)에는 제1 및 제2게이트(23,24)를 형성하여 이들 게이트 간에 제l수지 체류부(25)를 형성하고, 다른쪽 금형(l0)의 캐비티(11)에는 제1수지 체류부(25)에 대향하는 제2수지 체류부(13)과, 이 제2수지 체류부(13)을 캐비티(11)에 연통시키는 제3게이트(12)를 형성하고, 또 이들 제1 및 제2수지 체류부(25,l2)는 리드 프레임(30)에 설치된 수지 유입홀(38)을 통하여 상호 연통되도록 구성한다.In the mold apparatus for resin-molding the lead frame 30 mounted with the semiconductor element 1 to form a resin package, the runner 22 communicated with the cavity 21 provided in one mold 20 includes a first and The second gates 23 and 24 are formed to form the first resin retention portion 25 between these gates, and the cavity 11 of the other mold 10 is opposed to the first resin retention portion 25. The second resin retaining portion 13 and the third gate 12 for communicating the second resin retaining portion 13 to the cavity 11 are formed, and these first and second resin retaining portions 25 and l2 are formed. ) Are configured to communicate with each other through the resin inlet hole 38 provided in the lead frame 30.

Description

수지 밀봉형 반도체 장치의 제조 장치 및 제조 방법Manufacturing apparatus and manufacturing method of resin-sealed semiconductor device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 수지 밀봉용 금형 장치의 한 실시예의 단면도.1 is a cross-sectional view of an embodiment of a resin device for sealing resin.

제2도는 반도체 소자를 탑재한 리드 프레임의 평면도.2 is a plan view of a lead frame on which semiconductor elements are mounted.

제3도는 수지 밀봉시의 수지의 흐름을 설명하기 위한 단면도.3 is a cross-sectional view for explaining the flow of resin during resin sealing.

Claims (4)

반도체 소자를 탑재한 리드 프레임을 1쌍의 금형 각각에 설치된 캐비티 사이에 세트하고, 한쪽 금형에 설치된 런너를 통하여 상기 각 캐비티에 수지를 압입하여 상기 반도체 소자를 수지 밀봉하도록 한 수지 밀봉형반도체 장치의 제조 장치에 있어서, 상기 한쪽 캐비티에 연통되는 런너에는 제1 및 제2게이트를 형성하여 이들 게이트 사이에 제1수지 체류부를 형성하고, 상기 다른쪽 캐비티에는 상기 제1수지 체류부에 대향하는 제2수지 체류부와, 상기 제2수지 체류부를 캐비티에 연통시키는 제3게이트를 형성하고, 또한 이들 제1 및 제2수지 체류부는 상기 리드 프레임에 설치된 수지 유입홀을 통하여 상호 연토되도록 구성한 것을 특징으로 하는 수지 밀봉형 반도체 장치의 제조 장치.A lead-sealed semiconductor device in which a lead frame on which semiconductor elements are mounted is set between cavities provided in each of a pair of molds, and a resin is pressed into each of the cavities through a runner provided in one mold to resin seal the semiconductor elements. In the manufacturing apparatus, first and second gates are formed in the runner communicating with one of the cavities to form a first resin retention portion between the gates, and the second cavity is opposed to the first resin retention portion. And a third gate through which the resin retaining portion and the second resin retaining portion communicate with the cavity, and the first and second resin retaining portions are mutually ground through the resin inflow hole provided in the lead frame. The manufacturing apparatus of a resin sealing semiconductor device. 제1항에 있어서, 런너 방향에 연하는 제2수지 체류부의 길이는 제1수지 체류부의 길이와 같거나, 그것보다도 크게하여 이루어지는 것을 특징으로 하는 수지 밀봉형 반도체 장치의 제조 장치.The manufacturing apparatus of the resin-sealed semiconductor device according to claim 1, wherein the length of the second resin retention portion extending in the runner direction is equal to or larger than the length of the first resin retention portion. 제1항 또는 제2항에 있어서, 런너 방향에 연하는 제1 및 제2수지 체류부의 길이는 리드 프레임에 설치된 수지 유입홀의 길이보다도 크게하여 이루어지는 것을 특징으로 하는 수지 밀봉형 반도체 장치의 제조 장치.The manufacturing apparatus of the resin-sealed semiconductor device according to claim 1 or 2, wherein the lengths of the first and second resin retention portions extending in the runner direction are larger than the lengths of the resin inlet holes provided in the lead frame. 일부에 수지 유입홀이 개설된 리드 프레임에 반도체 소자를 탑재하여 리드 프레임 구조체를 형성하는 공정과, 캐비티에 연통되는 런너에 제1 및 제2게이트를 설치하고 또한 이들 사이에 제1수지 체류부를 설치한 제1금형과, 상기 제1수지 체류부에 대향하는 위치에 제2수지 체류부를 설치하고 또한 상기 제2수지 체류부와캐비티와의 사이에 제3게이트를 설치한 제2금형과의 사이에 상기 리드 프레임 구조체를 세트하는 공정과, 상기 런너로부터 공급되는 수지를 상기 제2게이트, 제1수지 체류부, 제1게이트를 통하여 제1금형의 캐비티 내에 압입하고, 또 상기 제1수지 체류부로부터 상기 수지 유입홀을 통하여 제2수지 체류부, 게이트를 통하여 제2금형의 캐비티 내로 압입하고, 상기 반도체 소자를 수지 몰드하는 공정과, 상기 각 금형으로부터 수지 성형된 리드프레임을 이형하고, 상기 제2게이트 부분에서 런너부의 수지를 절단 분리하는 공정과, 그 후의 상기 제1게이트와 제3게이트 부분에서 상기 제1 및 제2수지 체류부의 수지를 절단 분리하는 공정을 포함하는 깃을 특징으로 하는 수지 밀봉형 반도체 장치의 제조 방법.A process of forming a lead frame structure by mounting a semiconductor element in a lead frame in which a resin inlet hole is partially formed, and installing a first and a second gate in a runner communicating with a cavity, and providing a first resin retention portion therebetween. Between a first mold and a second mold provided with a second resin stay in a position opposite to the first resin stay and a third gate provided between the second resin stay and the cavity; The step of setting the lead frame structure and the resin supplied from the runner are press-fitted into the cavity of the first mold through the second gate, the first resin retention part, and the first gate, and from the first resin retention part. A step of press-fitting into the cavity of the second mold through the second resin retention portion and the gate through the resin inflow hole, and resin molding the semiconductor element; Releasing the deframe, and cutting and separating the resin of the runner portion from the second gate portion, and then cutting and separating the resin of the first and second resin retention portions from the first and third gate portions thereafter. The manufacturing method of the resin sealing semiconductor device characterized by the feather containing. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950028058A 1994-08-31 1995-08-31 Manufacturing apparatus and manufacturing method of resin-sealed semiconductor device KR960009081A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6230435A JPH0878455A (en) 1994-08-31 1994-08-31 Manufacturing equipment of plastic molded type semiconductor device and its manufacture
JP94-230435 1994-08-31

Publications (1)

Publication Number Publication Date
KR960009081A true KR960009081A (en) 1996-03-22

Family

ID=16907862

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950028058A KR960009081A (en) 1994-08-31 1995-08-31 Manufacturing apparatus and manufacturing method of resin-sealed semiconductor device

Country Status (2)

Country Link
JP (1) JPH0878455A (en)
KR (1) KR960009081A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100970215B1 (en) * 2008-01-08 2010-07-16 주식회사 하이닉스반도체 Mold used fabricating of fine pitch ball grid array package

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5428903B2 (en) * 2010-02-03 2014-02-26 第一精工株式会社 Resin sealing mold equipment
JP7084341B2 (en) * 2019-03-06 2022-06-14 トヨタ自動車株式会社 Molding method of connector part
JP7314612B2 (en) * 2019-05-14 2023-07-26 富士電機株式会社 RESIN MOLDED PRODUCT AND METHOD FOR MANUFACTURING RESIN MOLDED PRODUCT

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2911906B2 (en) * 1989-01-12 1999-06-28 富士通株式会社 Method for manufacturing semiconductor device
JPH04293243A (en) * 1991-03-20 1992-10-16 Fujitsu Miyagi Electron:Kk Metal mold equipment for resin seal and cutting method of gate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100970215B1 (en) * 2008-01-08 2010-07-16 주식회사 하이닉스반도체 Mold used fabricating of fine pitch ball grid array package

Also Published As

Publication number Publication date
JPH0878455A (en) 1996-03-22

Similar Documents

Publication Publication Date Title
JP2526787B2 (en) Lead frame for semiconductor device
KR940004793A (en) Method for molding leadframe and integrated circuit package with slots
KR910001916A (en) A semiconductor device manufacturing method comprising a package
KR960009081A (en) Manufacturing apparatus and manufacturing method of resin-sealed semiconductor device
KR970024040A (en) BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a mold for resin encapsulation for manufacturing a semiconductor device,
US6696006B2 (en) Mold for flashless injection molding to encapsulate an integrated circuit chip
EP0130552B1 (en) Electronic device method using a leadframe with an integral mold vent means
KR970701429A (en) An integrated circuit package encapsulated by a fiber-containing molding material and its manufacturing method (AN INTEGRATED CIRCUIT PACKAGE ENCAPSULATED BY FIBER LADEN MOLDING MATERIAL AND ITS METHOD OF MANUFACTURING)
JP3165234B2 (en) Lead frame degate method and lead frame used therefor
JPH07214600A (en) Die for molding transparent resin sealing-type semiconductor device
JPS59169162A (en) Lead frame
JP2838981B2 (en) Resin sealing device and resin sealing method for semiconductor device
JPS63193814A (en) Mold for transfer molding
JP2600411B2 (en) Mold for semiconductor resin sealing
JPS5910251A (en) Lead frame
JPS61144033A (en) Method of molding resin for sealing semiconductor device
JPH0637231A (en) Lead frame and resin molded semiconductor device using the same
JP2003112335A (en) Method for manufacturing resin sealed type molded part and resin sealed type molded part
JPS6197955A (en) Lead frame
JPH03350Y2 (en)
JPS638130Y2 (en)
KR960019673A (en) Semiconductor package and manufacturing method
JP3499269B2 (en) Cover frame and resin sealing method
KR940003000A (en) Semiconductor Package Molding Device
JPS63265454A (en) Semiconductor device

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
NORF Unpaid initial registration fee