KR960006387U - 진공라인을 이용한 패키지 감속장치 - Google Patents

진공라인을 이용한 패키지 감속장치

Info

Publication number
KR960006387U
KR960006387U KR2019940017496U KR19940017496U KR960006387U KR 960006387 U KR960006387 U KR 960006387U KR 2019940017496 U KR2019940017496 U KR 2019940017496U KR 19940017496 U KR19940017496 U KR 19940017496U KR 960006387 U KR960006387 U KR 960006387U
Authority
KR
South Korea
Prior art keywords
reduction device
vacuum line
package reduction
package
vacuum
Prior art date
Application number
KR2019940017496U
Other languages
English (en)
Other versions
KR200157443Y1 (ko
Inventor
장정상
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019940017496U priority Critical patent/KR200157443Y1/ko
Publication of KR960006387U publication Critical patent/KR960006387U/ko
Application granted granted Critical
Publication of KR200157443Y1 publication Critical patent/KR200157443Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
KR2019940017496U 1994-07-14 1994-07-14 진공라인을 이용한 패키지 감속장치 KR200157443Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940017496U KR200157443Y1 (ko) 1994-07-14 1994-07-14 진공라인을 이용한 패키지 감속장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940017496U KR200157443Y1 (ko) 1994-07-14 1994-07-14 진공라인을 이용한 패키지 감속장치

Publications (2)

Publication Number Publication Date
KR960006387U true KR960006387U (ko) 1996-02-17
KR200157443Y1 KR200157443Y1 (ko) 1999-09-15

Family

ID=19388383

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940017496U KR200157443Y1 (ko) 1994-07-14 1994-07-14 진공라인을 이용한 패키지 감속장치

Country Status (1)

Country Link
KR (1) KR200157443Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100518458B1 (ko) * 2003-06-30 2005-10-04 김은주 반원형 배수로관의 연결용 거푸집

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101541038B1 (ko) * 2015-04-10 2015-08-03 티에스티(주) 기판 로딩 장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100518458B1 (ko) * 2003-06-30 2005-10-04 김은주 반원형 배수로관의 연결용 거푸집

Also Published As

Publication number Publication date
KR200157443Y1 (ko) 1999-09-15

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090526

Year of fee payment: 11

EXPY Expiration of term