KR960005381Y1 - Wafer expansion apparatus - Google Patents
Wafer expansion apparatus Download PDFInfo
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- KR960005381Y1 KR960005381Y1 KR92018826U KR920018826U KR960005381Y1 KR 960005381 Y1 KR960005381 Y1 KR 960005381Y1 KR 92018826 U KR92018826 U KR 92018826U KR 920018826 U KR920018826 U KR 920018826U KR 960005381 Y1 KR960005381 Y1 KR 960005381Y1
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- wafer
- expander
- expansion
- mylar
- expansion device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
내용없음.None.
Description
제1도는 본 고안에 관련되는 익스팬션의 사시도.1 is a perspective view of an expansion according to the present invention.
제2도는 본 고안에 의한 웨이퍼 익스팬션 장치의 구성을 나타내는 측단면도.2 is a side cross-sectional view showing the configuration of a wafer expansion device according to the present invention.
제3도는 본 고안의 익스팬션 장치의 작동상태를 나타내는 도면.3 is a view showing an operating state of the expansion device of the present invention.
제4도는 본 고안의 트레이 높이가 조절된 상태의 측단면도.Figure 4 is a side cross-sectional view of the tray height of the present invention is adjusted.
제5도는 종래 기술의 웨이퍼 익스팬션 장치의 구성을 나타내는 측단면도.Fig. 5 is a side sectional view showing the structure of a wafer expansion device of the prior art.
제6도는 종래 기술의 익스팬션 장치의 작동상태를 나타내는 도면이다.6 is a view showing the operating state of the expansion device of the prior art.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 무우빙 플레이트 6 : 익스팬더1: no moving plate 6: expander
10 : 마일러 11 : 웨이퍼10: mylar 11: wafer
20 : 높이 조절부재 21 : 장공20: height adjustment member 21: long hole
22 : 고정수단22: fixing means
본 고안은 웨이퍼 익스팬션 장치에 관한 것으로서, 보다 상세하게는 웨이퍼 사이즈(4,5,6)에 따라 익스팬션 되는 양을 조절할 수 있도록 익스팬더(Expander)의 높이를 조절할 수 있도록 한 웨이퍼 익스팬션 장치에 관한 것이다.The present invention relates to a wafer expansion device, and more particularly to a wafer expansion device that can adjust the height of the expander (Expander) to adjust the amount of expansion according to the wafer size (4, 5, 6).
일반적으로 반도체 제조공정에는 리이드 프레임이라고 하는 기판위에 칩을 올려놓은 후 고정 결합시키는 본딩공정과, 상기한 본딩공정에서 본딩된 칩과 리이드 프레임을 도선으로 연결시켜 주는 와이어 본딩공정, 그리고 프라스틱 혹은 세라믹을 이용하여 상기 조립 완료된 조립체의 파손방지 및 충격보호를 위하여 행하는 패키징 고정등이 일련의 작업공정으로 이루어지고 있다.In general, a semiconductor manufacturing process includes a bonding process in which a chip is placed on a substrate called a lead frame and then fixedly bonded, a wire bonding process in which the bonded chip and the lead frame are connected by wires in the bonding process, and plastic or ceramic A packaging fixture, etc., which is used to prevent damage and impact protection of the assembled assembly by using a series of work processes, is made.
이러한 작업공정에서 리이드 프레임과 같은 반도체 부품을 위한 기판 또는 반도체 칩이 리이드 프레임상에 고착된 미완성 반도체 부품들은 리이드 프레임이 각각의 단계에 공급되고, 그들로부터 꺼내어 쓰거나 그들 사이에 운송하기 위해서 매거진이라 불리는 상자형 지그에 격납된다.In this process, unfinished semiconductor components, in which a substrate or a semiconductor chip is fixed on the lead frame for a semiconductor component such as a lead frame, are called magazines for the lead frame to be supplied at each stage and taken out of them or transported between them. It is stored in a box jig.
상기한 공정 중에서 다이본딩이 행하여지기 위해서는 위이퍼를 절단하여 익스팬딩시키는 작업을 행하게 된다.In order to perform die bonding in the above-mentioned process, the operation of cutting and expanding the wiper is performed.
제5도는 종래 기술의 위이퍼 익스팬션 장치의 구성을 나타내는 측단면도로서, 도시되지 않은 구동수단에 의해 선택적으로 승강되는 무우빙 플레이트(1)의 상측에 후트형 푸싱 플레이트(2)를 진퇴시키는 실린더(3)가 제공되어 있다.5 is a side cross-sectional view showing the structure of a conventional wiper expansion device, and includes a cylinder for advancing and retracting the hute-type pushing plate 2 above the non-moving plate 1 selectively lifted by a driving means (not shown). 3) is provided.
상기한 무우빙 플레이트(1)의 가장자리에 익스팬션 부재(4)가 상측 방향으로 돌출되어 일체로 형성됨은 물론 중앙부에 홀(5)이 형성된 익스팬더(6)가 착탈 가능하게 설치되어 무우빙 플레이트(1)의 승강에 따라 후술하는 마일러를 익스팬딩시키도록 되어 있다.The expansion member 4 protrudes upward at the edge of the non-moving plate 1 to be integrally formed, and an expander 6 having a hole 5 formed at the center thereof is detachably installed. The mylar to be described later is expanded in accordance with the elevation of the c).
상기한 익스팬더(6)의 홀(5)에는 척킹 플레이트(7)가 슬라이드 가능하게 삽입되어 그 일측이 푸싱 플레이트(2)에 계지됨으로써 실린더(3)의 작동에 따라 연동되는 푸싱 플레이트(2)에 의해 진퇴되게 한다.The chucking plate 7 is slidably inserted into the hole 5 of the expander 6 so that one side thereof is locked to the pushing plate 2 to the pushing plate 2 interlocked according to the operation of the cylinder 3. To advance by
상기한 익스팬더(6)의 상측에는 척킹 플레이트(7)가 선택적으로 얹히는 척(8)을 보유하는 홀더(9)가 제공되어 있으며, 상기한 홀더(9)와 익스팬더(6) 사이에는 일정한 사이즈로 절단된 웨이퍼(10)가 본딩된 마일러(11)를 보유하는 웨이퍼 링(12)이 도시되지 않은 공급장치에 의해 공급되도록 되어 있다.On the upper side of the expander 6 is provided a holder 9 for holding the chuck 8 on which the chucking plate 7 is selectively placed, and a constant size between the holder 9 and the expander 6. The wafer ring 12 which holds the mylar 11 to which the wafer 10 cut | disconnected by this is bonded is made to be supplied by the supply apparatus which is not shown in figure.
이와 같이 구성되는 종래 기술의 웨이퍼 익스팬딩 장치는, 웨이퍼(10)가 본딩된 마일러(11)를 보유하는 웨이퍼 링(12)이 소정의 공급장치에 의해 익스팬더(6)의 익스팬션 부재(4)의 상측에 공급되면, 별도로 제공된 구동수단을 작동시켜 무우빙 플레이트(1)를 상승시킨다.In the conventional wafer expanding apparatus configured as described above, the wafer ring 12 holding the mylar 11 to which the wafer 10 is bonded has an expansion member 4 of the expander 6 by a predetermined supply device. When supplied to the upper side of the, the driving means provided separately to raise the non-moving plate (1).
상기한 무우빙 플레이트(1)가 소정거리 상승됨에 따라 웨이퍼 링(12)의 홀더(9)의 상측면에 접촉됨과 아울러 제6도에 도시한 바와 같이 더욱 상승됨에 따라 익스팬더(6)의 익스팬션 부재(4)에 의해 마일러(11)가 익스팬션되어 절단된 웨이퍼(10)가 분리되게 된다.As the non-moving plate 1 is raised by a predetermined distance, the expansion member of the expander 6 is brought into contact with the upper surface of the holder 9 of the wafer ring 12 and further raised as shown in FIG. The mylar 11 is expanded by (4), and the cut wafer 10 is separated.
이러한 상태에서 실린더(3)를 작동시키면 푸싱 플레이트(2)가 연동됨에 따라 이에 계지된 척킹 플레이트(7)가 익스팬더(6)의 홀(5)에 안내되어 제6도의 일전쇄선으로 도시한 바와 같이 홀더(9)의 척(8)에 척킹되게 된다.When the cylinder 3 is operated in this state, as the pushing plate 2 is interlocked, the chucking plate 7 held thereon is guided to the hole 5 of the expander 6, as shown in FIG. It is to be chucked to the chuck 8 of the holder 9.
이와 같이 익스팬더(6)가 척킹 플레이트(7)에 의해 홀더(9)의 척(8)에 얹혀 고정되면, 구동수단을 작동시켜 제6도의 이점쇄선으로 도시한 바와 같이 무우빙 플레이트(1)를 하강시킴으로써 일련의 공정이 완료되게 되지만, 웨이퍼(10)가 제공된 마일러(11)의 익스팬션이 익스팬더(6)의 익스팬션 부재(4)의 높이에 의해 결정되는 바, 익스팬더(6)에 일체로 형성된 익스팬션 부재(4)의 높이가 일정함에 기인하여 마일러(10)의 익스팬션 양이 일정하기 때문에 웨이퍼(10)의 사이즈 변경에 따른 마일러(11)의 익스팬션 양을 조절하기 위해 사이즈 별로 각각 마련된 익스팬더(6)를 교환해야 하므로 작업성이 저하됨은 물론 원가가 상승되는 제반 문제점이 내재되어 있다.In this way, when the expander 6 is fixed to the chuck 8 of the holder 9 by the chucking plate 7, the driving means is operated to move the moving plate 1 as shown by the double-dot chain line of FIG. By descending, a series of processes are completed, but the expansion of the mylar 11 provided with the wafer 10 is determined by the height of the expansion member 4 of the expander 6, which is formed integrally with the expander 6. Since the expansion amount of the mylar 10 is constant due to the constant height of the expansion member 4, expanders provided for each size to adjust the expansion amount of the mylar 11 according to the size change of the wafer 10. (6) Since there is a need to replace, there is a problem that not only the workability is lowered but also the cost is increased.
본 고안은 상기한 바와 같은 종래 기술의 문제점을 해결하기 위해 안출된 것으로서 본 고안의 목적은 웨이퍼의 사이즈(4,5,6)에 따라 익스팬션되는 양을 조절할 수 있도록 익스팬더(Expander)의 높이를 조절하여 작업성향상은 물론 원가를 절감할 수 있는 웨이퍼 익스팬션 장치를 제공하는데 있다.The present invention has been made to solve the problems of the prior art as described above, the object of the present invention is to adjust the height of the expander (Expander) to adjust the amount of expansion according to the size (4, 5, 6) of the wafer Therefore, the present invention provides a wafer expansion device that can improve work efficiency and reduce costs.
상기한 바와 같은 목적을 실현하기 위해 본 고안은, 무우빙, 플레이트의 가장자리에 익스팬더가 제공되어 마일러 상에 본딩된 웨이퍼를 익스팬션시키는 웨이퍼 익스팬션 장치에 있어서, 상기한 익스팬더의 내측에 밀착 제공됨은 물론 수개의 장공이 형성된 높이 조절부재가 고정수단에 의해 고정 설치됨을 특징으로 하는 웨이퍼 익스팬션 장치를 제공한다.In order to realize the above object, the present invention provides a wafer expansion device in which an expander is provided at an edge of a non-iced plate and a plate to expand a wafer bonded on the mylar. Provided is a wafer expansion device characterized in that the height adjustment member formed with several long holes is fixedly installed by the fixing means.
이하, 본 고안의 바람직한 실시예를 첨부한 도면에 따라 더욱 상세히 설명한다.Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.
제1도는 본 고안에 관련되는 익스팬더의 사시도이고, 제2도는 본 고안의 웨이퍼 익스팬션 장치의 구성을 나타내는 측단면도로서, 종래 기술의 구성과 동일한 부분의 구성은 생략하고 중요한 부분만 상세히 설명한다.1 is a perspective view of the expander according to the present invention, Figure 2 is a side cross-sectional view showing the configuration of the wafer expansion device of the present invention, the configuration of the same parts as the prior art configuration is omitted and only important parts will be described in detail.
무우빙 플레이트(1)의 가장자리에 착탈 가능하게 제공된 익스팬션(6)의 내측에 높이 조절부재(20)가 밀착 제공되어 있으며, 이 높이 조절부재(20)는 소정의 위치에 수개의 장공(21)이 형성되어 고정수단(22)에 의해 고정 설치됨으로써 웨이퍼(10)의 사이즈 변경에 따라 익스팬더(6)의 높이를 조절하여 마일러(11)의 익스팬션양을 조절하게 된다.The height adjusting member 20 is provided in close contact with the inside of the expansion 6 provided detachably to the edge of the non-moving plate 1, and the height adjusting member 20 has several holes 21 at predetermined positions. This is formed and fixed by the fixing means 22 to adjust the height of the expander 6 in accordance with the size change of the wafer 10 to adjust the expansion amount of the mylar 11.
상기한 장공(21)은 등간격으로 3 내지 4곳에 형성되고, 상하단부가 라운드 형성됨이 바람직하다.The long hole 21 is formed in three to four places at equal intervals, it is preferable that the upper and lower ends are formed round.
또한, 상기한 고정수단(22)은 익스팬션(6)에 탭(tap)을 내어 볼트로 고정하도록 되어 있다.In addition, the fixing means 22 is made to fix the bolt to the tap (6) in the expansion (6).
이와 같이 구성되는 본 고안의 웨이퍼 익스팬션 장치는, 웨이퍼(10)가 본딩된 마일러(11)를 보유하는 웨이퍼 링(12)이 소정의 공급장치에 의해 익스팬션(6)의 내측면에 고정 설치된 높이 조절부재(20)의 상측에 공급되면, 별도로 제공된 구동수단을 작동시켜 무우빙 플레이트(1)를 상승시킨다.The wafer expansion device of the present invention configured as described above has a height in which a wafer ring 12 holding a mylar 11 to which the wafer 10 is bonded is fixed to an inner surface of the expansion 6 by a predetermined supply device. When supplied to the upper side of the adjustment member 20, by operating the drive means provided separately to raise the non-ice plate (1).
상기한 무우빙 플레이트(1)가 상승하게 되면 웨이퍼 링(12)이 함께 상승하게 되므로 웨이퍼 링(12)은 홀더(9)의 상측면에 접촉되어 더 이상 승상하지 못하는 상태가 되지만, 제3도에 도시한 바와 같이 무우빙 플레이트(1)는 더욱 상승하게 되므로 마일러(11)는 늘어나게 된다(제3도 및 제4도와 같은 상태가 된다).When the non-moving plate 1 is raised, the wafer ring 12 is raised together, so that the wafer ring 12 is in contact with the upper side of the holder 9 and is no longer able to be lifted. As shown in the figure, since the non-moving plate 1 is further raised, the mylar 11 is extended (it is in the same state as in FIGS. 3 and 4).
그런데 이 마일러(11)에 부착되어 있는 웨이퍼(10)는 절단공정에서 이미 직교하는 그 방향으로 절단되어 실질적으로 다수개의 칩들이 마일러(11)에 부착되어 있는 것이므로 마일러(11)가 늘어나게 되면 각각의 칩들이 인접한 상태에서 인접한 거리가 점점 커지게 된다. 즉 웨이퍼가 익스팬션 된다.However, the wafer 10 attached to the mylar 11 is cut in the direction that is orthogonal to each other in the cutting process, so that the plurality of chips are attached to the mylar 11 so that the mylar 11 is extended. As a result, the adjacent distances of each chip are increased. In other words, the wafer is expanded.
이러한 상태에서 실린더(3)를 작동시키면 푸싱 플레이트(2)가 연동됨에 따라 이에 계지된 척킹 플레이트(7)가 익스팬더(6)의 홀(5)에 안내되어 제3도의 일점쇄선으로 도시한 바와 같이 홀더(9)의 척(8)에 척킹되게 된다.When the cylinder 3 is operated in this state, as the pushing plate 2 is interlocked, the chucking plate 7 held thereon is guided to the hole 5 of the expander 6, as shown by the dashed-dotted line in FIG. It is to be chucked to the chuck 8 of the holder 9.
이와 같이 익스팬더(6)가 척킹 플레이트(7)에 의해 홀더(9)의 척(8)에 얹혀 고정되면, 구동수단을 작동시켜 무우빙 플레이트(1)를 하강시킴으로써 일련의 공정이 완료되게 된다.When the expander 6 is mounted and fixed to the chuck 8 of the holder 9 by the chucking plate 7, a series of processes are completed by lowering the non-moving plate 1 by operating the driving means.
이러한 상태에서 웨이퍼(10)가 사이즈가 큰 사이즈를 분리하고자 할 때는, 제4도에 도시한 바와 같이 높이 조절부재(20)의 장공(21)에 고정 결합된 고정수단(22)을 해방시킨 다음, 높이 조절부재(20)를 소정 거리 상승시켜 웨이퍼(10)의 사이즈에 알맞게 높이를 조절한 후 고정수단(22)을 결합시킨다.In this state, when the wafer 10 is to be separated from the larger size, as shown in FIG. 4, the fixing means 22 fixedly coupled to the long hole 21 of the height adjusting member 20 is released. The height adjusting member 20 is raised by a predetermined distance to adjust the height to suit the size of the wafer 10, and then combines the fixing means 22.
이와 같이 웨이퍼(10)의 사이즈에 알맞도록 익스팬더(6)의 높이가 조절된 후 전기한 바와 같은 일련의 공정을 행함으로써 웨이퍼(10)의 익스팬션 양을 조절할 수 있게 된다.As such, after the height of the expander 6 is adjusted to suit the size of the wafer 10, the expansion amount of the wafer 10 can be adjusted by performing a series of processes as described above.
이상 설명한 바와 같이 본 고안의 웨치퍼 익스팬션 장치는, 웨이퍼의 사이즈에 따라 높이 조절부재르 조절하여 익스팬더의 높이를 조절할 수 있기 때문에 교환에 따른 작업시간을 단축시켜 작업성 향상을 도모함은 물론 원가를 절감할 수 있는 이점이 있다.As described above, the wafer expansion device of the present invention can adjust the height of the expander by adjusting the height adjusting member according to the size of the wafer, thereby reducing work time due to replacement and improving workability as well as cost. There is an advantage to this.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR92018826U KR960005381Y1 (en) | 1992-10-01 | 1992-10-01 | Wafer expansion apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR92018826U KR960005381Y1 (en) | 1992-10-01 | 1992-10-01 | Wafer expansion apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR940011103U KR940011103U (en) | 1994-05-27 |
| KR960005381Y1 true KR960005381Y1 (en) | 1996-06-28 |
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ID=19341102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR92018826U KR960005381Y1 (en) | 1992-10-01 | 1992-10-01 | Wafer expansion apparatus |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR960005381Y1 (en) |
-
1992
- 1992-10-01 KR KR92018826U patent/KR960005381Y1/en not_active IP Right Cessation
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| Publication number | Publication date |
|---|---|
| KR940011103U (en) | 1994-05-27 |
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