TWI823722B - Die ejector, and die suppying module and die bonding equipment including the same - Google Patents

Abstract

Embodiments of the invention provide a die ejector for effectively separating a die from a dicing tape and a die supplying module and a die bonding equipment including the same. The die ejector of the invention for separating the die from the dicing tape in the die bonding equipment includes: an ejector base formed with an opening portion having a certain area and vacuum holes formed adjacent to the opening portion and configured to absorb a lower face of the dicing tape by vacuum, an ejector body configured to move up and down through the opening portion to push away the die on the dicing tape, an up-down driving portion to move the ejector body up or down, and an illumination unit configured to move up and down in an inner space of the ejector body and the up-down driving portion and illuminate light to the dicing tape.

Description

Die ejectors and die supply modules and die bonding equipment equipped therewith

The present invention relates to a die ejector, a die supply module equipped with the same, and a die bonding equipment.

The semiconductor process is a process for manufacturing semiconductor products that can process electrical signals, including the process of forming patterns on the wafer through oxidation, exposure, etching, ion implantation, deposition and other processes (front-end process) and the processing of patterned wafers. The packaging process (back-end process) in which semiconductor packages are manufactured into finished products through processes such as cutting, die bonding, wiring, injection molding, marking, and testing.

Die bonding is a process of attaching die (die) individualized from a wafer by cutting (cutting) to a substrate (for example: PCB (Printed Circuit Board; printed circuit board)), and generally includes separating the die from the wafer. The process of bonding the die to the substrate. The process of separating the grains includes an expansion process to expand the distance between the grains and a push-out process to separate the grains from the cutting zone.

On the other hand, as the thickness of the crystal grain becomes thinner due to the development of semiconductor manufacturing technology, there are cases where the crystal grain cannot be smoothly separated from the dicing tape during the grain push-out process. Therefore, there is a need for techniques for efficient separation of grains from the dicing tape.

Therefore, embodiments of the present invention provide a die ejector for effectively separating die from a dicing tape, a die supply module and a die bonding apparatus provided with the same.

The problems to be solved by the present invention are not limited to those mentioned above, and those skilled in the art can clearly understand other problems to be solved that are not mentioned from the following description.

According to the present invention, a die ejector used to separate dies from a dicing tape in a die bonding equipment includes: an ejector fixed base formed with an opening with a certain area and formed around the opening for vacuum adsorption of the dicing tape. The vacuum hole on the lower surface of the ejector body; the ejector body is configured to push away the crystal grains on the cutting belt by lifting and lowering the opening; the lifting drive part makes the ejector body rise or fall; and a lighting unit is configured to The inner space of the ejector body and the lifting drive part can be raised and lowered, and the light can be irradiated toward the cutting tape.

According to an embodiment of the present invention, the lighting unit may be disposed in an internal space of a through hole formed in the center of the ejector body and the lifting drive unit.

According to an embodiment of the present invention, the lighting unit includes: a lifting shaft located in the inner space of the through hole and configured to lift; a lifting body fixedly coupled to the end of the lifting shaft; and a light emitting part coupled to the upper part of the lifting body.

According to an embodiment of the present invention, the light-emitting part may be configured to irradiate ultraviolet (ultra-violet, UV) light.

According to embodiments of the present invention, the light-emitting part may be composed of an LED (light emitting diode; light-emitting diode), a halogen lamp or a laser light source.

According to an embodiment of the present invention, the die pusher may further include a heating component disposed in an internal space of the through hole to apply thermal energy to the cutting belt.

According to an embodiment of the present invention, the inner wall of the through hole may be coated with a highly reflective substance for reflecting light of the lighting unit.

A die supply module for supplying dies for mounting to a substrate in a die bonding apparatus according to the present invention includes a wafer expander for supporting a dicing tape attached with a plurality of dies and expanding the plurality of dies. a space between the die; and a die pusher to separate the die from the cutting tape. The die ejector includes: an ejector fixed seat formed with an opening having a certain area, and a vacuum hole formed around the opening for vacuum adsorption of the lower surface of the cutting tape; an ejector body configured to pass through the opening The lifting part lifts and pushes away the die on the cutting belt; the lifting driving part makes the ejector body rise or fall; and the lighting unit is configured to be able to lift and lower in the internal space of the ejector body and the lifting driving part, and toward The cutting strip is illuminated with light.

The die bonding apparatus according to the present invention includes: a die supply module that supplies die for mounting to a substrate; a die transport module that transports die from the die supply module; and a die stage that is loaded from the die. The conveying module places the die; the die bonding module picks up the die from the die stage and joins the die to the substrate; and the bonding station transports the substrate and transfers the bonded substrate to the material box. The die supply module includes: a wafer expander, which is used to support a dicing belt attached with multiple dies and expand the distance between the multiple dies; and a die ejector, which separates the dies from the dicing tape. The die ejector includes: an ejector fixed base formed with an opening having a certain area, and a vacuum hole formed around the opening for vacuum adsorption of the lower surface of the dicing tape; an ejector body configured to pass through the opening The lifting part lifts to push away the die on the dicing belt; the lifting driving part makes the ejector body rise or fall; and the lighting unit is configured to be able to rise and fall in the internal space of the ejector body and the lifting driving part, and toward the The cutting tape is exposed to UV light.

According to the present invention, irradiation is performed by a lighting unit configured to be able to move up and down in the ejector body, thereby weakening the adhesion between the die and the dicing tape and allowing the die to be smoothly separated.

The effects of the present invention are not limited to those mentioned above, and those skilled in the art can clearly understand other unmentioned effects from the following description.

Hereinafter, embodiments of the present invention are described in detail with reference to the attached drawings so that those with ordinary knowledge in the technical field to which the present invention belongs can easily implement it. The invention can be implemented in various ways and is not limited to the embodiments described here.

In order to clearly explain the present invention, parts irrelevant to the description are omitted, and the same or similar components are given the same reference numerals throughout the entire specification.

In addition, in a plurality of embodiments, the same reference numerals are used for constituent elements having the same structure, and only representative embodiments are described. In other embodiments, only structures different from the representative embodiments are described.

Throughout this specification, when it is stated that a certain part is "connected (or combined)" to another part, it does not only mean "directly connected (or combined)", but also includes "indirect connection (or combined)" through other components. situation. In addition, when it is stated that a certain part "includes" a certain constituent element, as long as there is no special statement to the contrary, it means that other constituent elements may also be included rather than excluded.

Unless otherwise defined, all terms including technical or scientific terms used herein have the same meaning as commonly understood by a person of ordinary skill in the technical field to which this invention belongs. Terms such as terms defined in commonly used dictionaries should be interpreted to have meanings consistent with the meanings in the relevant technical context, and will not be ideally or excessively interpreted as formal meanings as long as they are not clearly defined in this application.

FIG. 1 shows a schematic layout of a die bonding equipment 1 to which the present invention can be applied. The die bonding apparatus 1 is an apparatus for performing a die bonding process of attaching dies (Dies) singulated from a wafer through a dicing process to a substrate (for example, a PCB (Printed Circuit Board; printed circuit board)). The wafer W composed of individualized dies is put into the die bonding equipment 1. After each die is bonded to the substrate S loaded in the magazine MZ1, the bonded substrate S is loaded into the magazine MZ2.

The die bonding apparatus 1 according to the present invention includes: a die supply module 10 that supplies die D for mounting to a substrate S; a die transport module 20 that transports the die D from the die supply module 10; The die stage 30 places the die D from the die transport module 20; the die bonding module 40 picks up the die D from the die stage 30 and joins it to the substrate S; and the bonding stage 50 transports the substrate S and attaches it to the substrate S. The bonded substrate S is transferred to the magazine MZ2.

Referring to FIG. 1 , a wafer W singulated into a plurality of die D is transported from a cassette (not shown) to a die supply module 10 , and a single die D is separated from the wafer W by the die supply module 10 . The die D separated from the wafer W is transported to the die stage 30 through the die transport module 20 . Here, the die transport module 20 can move along the horizontal direction (y direction) through the gantry 25 .

Through the video inspection module (not shown) located above or below, the inspection of the die D is performed on the die stage 30 . Through the die bonding module 40 , the die D is picked up from the die stage 30 and then bonded to the die stage 30 . The substrate S of the bonding stage 50 is bonded. Similarly, the die bonding module 40 is installed on the gantry 35 and is configured to be movable in the horizontal direction (y direction). In addition, in order to determine the precise joint position, the video unit (not shown) can be disposed above.

On the other hand, the die bonding apparatus 1 may include: a cassette loader 60 that loads a cassette MZ1 housing the substrate S and supplies the substrate S from the cassette MZ1 to the bonding stage 50; and a cassette unloader 70 that stores the substrate S. And remove the magazine MZ2 that stores the bonded substrate S. The substrate S is supplied from the cassette loader 60 to the bonding stage 50 , the bonding stage 50 moves in the horizontal direction (x direction) along the guide rail 45 , and the die D is bonded to the substrate S through the die bonding module 40 . The substrate S with all the dies D bonded is stored in the magazine MZ2.

Hereinafter, the detailed structure of the die supply module 10 will be described with reference to FIG. 2 .

FIG. 2 shows a schematic structure of a die supply module 10 to which the present invention can be applied. The die supply module 10 separates the die D singulated into a plurality of die D from the wafer W, and the die transport module 20 picks up the separated die D. The wafer W is singulated into a plurality of dies D through a dicing process, and is supplied to the die supply module 10 with a dicing tape DT attached to the lower part. Although not specifically shown in the figure, a crystal grain attachment film DAF may be attached to the lower part of the crystal grain D, and the crystal grain D may be temporarily attached to the dicing tape DT through the crystal grain attachment film DAF. Here, the outer contour of the dicing tape DT is supplied to the die supply module 10 in a fixed state by the wafer ring 260 . The die supply module 10 can separate the die D from the dicing tape DT so that the die transport module 20 can pick it up.

The die supply module 10 includes: a wafer expander 200 that supports a dicing tape DT attached with a plurality of die D and expands the intervals between the plurality of die D; and a die pusher 100 that allows the die D to Separate from cutting tape DT.

As shown in FIG. 2 , the wafer expander 200 may include: an expansion ring 270 that is fixedly coupled to the wafer ring 260 that fixes the outer contour of the dicing tape DT; and a base ring 280 that supports the expansion ring 270 and the dicing tape DT. the lower part.

The expansion ring 270 is coupled to the elevator 275 below and can be raised and lowered. When the expansion ring 270 is lowered, the dicing tape DT is extended together and the intervals between the die D are opened together. If the space between the die D is opened, the die D can be separated from the dicing tape DT by the die ejector 100 .

Figure 3 is a cross-sectional view of the die ejector 100 according to the present invention. The die ejector 100 is a device that separates the individualized die D from the dicing tape DT and is picked up by the die transport module 20 .

The die ejector 100 according to the present invention includes: an ejector fixed seat 110 formed with an opening 112A with a certain area, and a vacuum hole 112B formed around the opening 112A for vacuum adsorption of the lower surface of the cutting tape DT; The ejector body 120 is configured to move up and down through the opening 112A to push away the die D on the dicing tape DT; the lift drive unit 130 is configured to raise or lower the ejector body 120; and the lighting unit 140 is configured to be able to move the ejector body 120 up and down. 120 and the internal space of the lifting drive unit 130 rise and fall, and irradiate light toward the dicing tape DT. In addition, the die ejector 100 may include a cylindrical ejector housing 150 that accommodates the lifting driving part 130 , and the ejector fixing base 110 is combined with the ejector housing 150 .

The ejector holder 110 may have an inner space for receiving the ejector body 120 . The ejector holder 110 may include: an upper plate 112 formed with a through hole 122 and a vacuum hole 112B that enable the ejector body 120 to move in a vertical direction; and a holder housing 114 having a hole extending downward from the upper plate 112 lower part. In FIG. 3 , the ejector holder 110 is shown to be divided into an upper plate 112 and a holder housing 114 , but the ejector holder 110 may also be formed integrally.

The ejector body 120 selectively separates the die D located above the ejector body 120 by pushing upward among the die of the wafer W. The lifting driving part 130 may include: a head 132 coupled to the ejector body 120; and a driving shaft 134 for transmitting driving force to the head 132. Although not specifically shown, the drive shaft 134 may be coupled to a power supply unit (not shown) that provides driving force, and the power supply unit may include a motor, a cylinder, or the like.

The open lower part of the holder housing 114 can be combined with the ejector housing 150 , and the head 132 and the drive shaft 134 of the lifting driving part 130 can move in the vertical direction inside the ejector housing 150 . The upper portion of the ejector housing 150 can be inserted into the holder housing 114 . As an example, as shown in FIG. 3 , the upper outer surface of the ejector housing 150 may be provided with a clamping platform for limiting the insertion degree of the ejector housing 150 . In addition, the sealing member 172 may be interposed between the ejector body 120 and the head 132, and the sealing member 160 may be interposed between the holder housing 114 and the ejector housing 150.

The holder housing 114 and the ejector housing 150 may be provided in a cylindrical or tubular shape, but may be configured not only in a circular shape but also in a polygonal shape.

On the other hand, the inner surface of the holder housing 114 may be provided with a stopper 116 for restricting the downward movement of the ejector body 120 . The ejector body 120 accommodated in the ejector holder 110 is restricted from horizontal movement by the opening 112A provided in the upper plate 112 and can only move in the vertical direction. In particular, upward movement is restricted by the upper plate 112 . Movement downward is limited by blocker 116 . As a result, the ejector body 120 is allowed to move only a predetermined distance in the vertical direction within the ejector holder 110 , and the ejector body 120 and the ejector holder 110 can be replaced together when necessary.

According to embodiments of the present invention, when the ejector body 120 needs to be replaced in order to cope with the shape change of the die D, the ejector fixing base 110 and the ejector body 120 can be replaced together. A replacement kit composed of the ejector body 120 and the ejector holder 110 corresponding to the shape of each die D can be prepared in advance, and the ejector holder 110 and the ejector body 120 can be selected according to the shape of the corresponding die D.

As shown in FIG. 4 , the upper plate 112 of the ejector holder 110 can be configured in various styles according to the size and shape of the die D, and can be easily replaced as needed. The upper plate 112 may be provided with a square-shaped opening 112A having a mutually different size as shown in (a) and (b) of FIG. 4 , and may be configured to have an aspect ratio as shown in (c) and (d). The upper plate 112 of the opening portion 112A has a rectangular shape different from each other.

On the other hand, according to the embodiment of the present invention, the lighting unit 140 that irradiates light toward the cutting tape DT is configured to be able to move up and down in the internal space of the ejector body 120 and the lifting drive unit 130 . The adhesive of the dicing tape DT has the characteristic that the adhesion force is weakened by light of a specific wavelength. Therefore, the lighting unit 140 irradiates light toward the dicing tape DT, thereby weakening the adhesion force between the dicing tape DT and the die D. Therefore, the die D can be separated from the dicing tape DT more smoothly.

In addition, the lighting unit 140 according to the embodiment of the present invention is configured to be able to move up and down in the internal space of the ejector body 120 and the lifting drive part 130, so that the intensity of light applied to the cutting tape DT can be adjusted. As shown in FIG. 5 , the intensity of light applied to a specific position changes depending on the irradiation distance. According to material characteristics or process conditions, the lifting position of the lighting unit 140 can be adjusted to adjust the intensity of the light irradiated to the cutting tape DT.

In addition, since the lighting unit 140 is arranged to be able to move up and down, the lighting unit 140 can be replaced or maintained more easily from an operator's perspective.

According to an embodiment of the present invention, the lighting unit 140 may be disposed in the inner space of the through hole 122 formed at the center of the ejector body 120 and the lifting drive part 130 . As shown in FIG. 3 , the lighting unit 140 may be disposed in the through hole 122 formed at the center of the ejector body 120 and the lifting drive part 130 , and may move up or down along the inner space of the through hole 122 . The intensity of the light irradiated from the lighting unit 140 toward the cutting tape DT can be adjusted by raising and lowering driving.

According to an embodiment of the present invention, the lighting unit 140 may include: a lifting shaft 142 located in the inner space of the through hole 122 and configured to lift; a lifting body 144 fixedly coupled to the end of the lifting shaft 142; and a light emitting part 146, Combined with the upper part of the lifting body 144. Although not specifically shown, the lifting shaft 142 may be coupled to a power supply part (not shown) that provides driving force, and the power supply part may include a motor, a cylinder, etc. The lifting body 144 may be formed at an end of the lifting shaft 142 to provide a space for disposing the light emitting part 146 .

The light emitting part 146 may irradiate light to weaken the adhesion between the dicing tape DT and the die D. Although not specifically shown in the figure, the light-emitting unit 146 may receive power through a wire or use power from a built-in battery. In addition, a control device for adjusting on/off of light or light intensity by the light emitting unit 146 may be provided.

According to an embodiment of the present invention, the light emitting part 146 may be configured to irradiate ultraviolet (ultra-violet, UV) light. Experiments have proven that the adhesive of the dicing tape DT hardens under the irradiation of light with a wavelength corresponding to the ultraviolet band. Therefore, the light-emitting part 146 of the present invention can irradiate ultraviolet light to weaken the adhesion of the dicing tape DT, so that the die D can be removed from the dicing tape DT. The tape DT is separated smoothly to prevent damage (cracks) to the die D.

According to an embodiment of the present invention, the light emitting part 146 may be composed of an LED (light emitting diode; light emitting diode), a halogen lamp or a laser light source.

According to an embodiment of the present invention, a heating component 170 may be further included, which is disposed in the inner space of the through hole 122 to apply thermal energy to the cutting tape DT. For example, as shown in FIG. 6 , the heating member 170 may be composed of a coil-shaped hot wire in the inner space of the through hole 122 formed at the center of the ejector body 120 and the lifting drive unit 130 . The heating member 170 applies thermal energy to the cutting tape DT, so that the adhesive force of the cutting tape DT can be weakened together with the light of the lighting unit 140 .

According to an embodiment of the present invention, the inner wall of the through hole 122 may be coated with a highly reflective substance 180 for reflecting light from the lighting unit 140 . For example, as shown in FIG. 7 , a substance with a high reflectivity may be coated on the inner walls of the through holes 122 formed in the center portions of the ejector body 120 and the lifting drive unit 130 . The light from the lighting unit 140 can be transmitted to the cutting tape DT at a higher rate.

On the other hand, the die ejector 100 including the lighting unit 140 described above can be applied to the die supply module 10 and the die bonding equipment 1 of FIGS. 1 and 2 .

The die bonding apparatus 1 according to the embodiment of the present invention includes: a die supply module 10 that supplies the die D for mounting to the substrate S; and a die transport module 20 that transports the die from the die supply module 10 D; the die stage 30, to which the die D is mounted from the die transport module 20; the die bonding module 40, which picks up the die D from the die stage 30 and bonds it to the substrate S; and the bonding stage 50, which is transported substrate S, and transfer the bonded substrate S to the material box.

The die supply module 10 includes: a wafer expander 200 for supporting the dicing tape DT attached with a plurality of die D and expanding the intervals between the plurality of die D; and a die pusher 100 for making the die D is separated from the cutting tape DT.

The die ejector 100 includes: an ejector holder 110 formed with an opening 112A having a certain area and a vacuum hole 112B formed around the opening 112A for adsorbing the lower surface of the dicing tape DT; and an ejector body 120 configured In order to push the die D on the dicing tape DT upward and downward through the opening 112A; the lifting drive unit 130 raises or lowers the ejector body 120; The inner space is lifted and irradiated with light towards the cutting belt DT.

According to an embodiment of the present invention, the lighting unit 140 may be disposed in the inner space of the through hole 122 formed at the center of the ejector body 120 and the lifting drive part 130 .

According to an embodiment of the present invention, the lighting unit 140 may include: a lifting shaft 142 located in the inner space of the through hole 122 and configured to lift; a lifting body 144 fixedly coupled to an end of the lifting shaft 142; and a light emitting part 146 coupled to on the upper part of the lifting body 144.

According to an embodiment of the present invention, the light emitting part 146 may be configured to irradiate ultraviolet (UV) light.

According to embodiments of the present invention, the light emitting part 146 may be composed of an LED, a halogen lamp, or a laser light source.

According to the embodiment of the present invention, a heating component 170 may be further included, which is disposed in the inner space of the through hole 122 and applies thermal energy to the cutting tape DT.

According to an embodiment of the present invention, a highly reflective substance 180 for reflecting light from the lighting unit 140 may be coated on the inner wall of the through hole 122 .

The drawings attached to the present embodiment and the description only clearly illustrate a part of the technical concept included in the present invention. It is obvious that those skilled in the art can easily understand the technical concept included in the description and the drawings of the present invention. The derived modifications and specific embodiments are all included in the patentable scope of the present invention.

Therefore, the concept of the present invention should not be limited to the illustrated embodiments. Not only the appended patent scope, but also all concepts that are equivalent to or equivalent to the patent scope belong to the scope of the present invention.

1:Die bonding equipment 10: Die supply module 20:Die transport module 25:Gantry 30:Granule table 35:Gantry 40:Die bonding module 45: Guide rail 50:Jointing table 60:Box loader 70:Box unloader 100:Die ejector 110:Ejector holder 112A:Opening part 112B: Vacuum hole 112:On the board 114:Fixed seat shell 116:Blocker 120:Ejector body 122:Through hole 130:Lifting drive part 132:Head 134:Drive shaft 140:Lighting unit 142:Lifting shaft 144: Lifting body 146:Lighting Department 150:Ejector housing 160:Sealing parts 170: Heating parts 172:Sealing parts 180: Highly reflective material 200:Wafer expander 260:wafer ring 270: Expanding ring 275: Lift 280: base ring D: grain DT: cutting tape MZ1: Material box MZ2: Material box S:Substrate W:wafer

FIG. 1 shows a schematic layout of a die bonding equipment to which the present invention can be applied.

FIG. 2 shows the schematic structure of a die supply module to which the present invention can be applied.

Figure 3 shows a cross-sectional view of a die ejector according to the present invention.

Figure 4 illustrates a die chuck according to an embodiment of the invention.

FIG. 5 shows the distribution of light intensity based on the irradiation distance of the lighting unit.

Figure 6 shows a die ejector with a heating component according to an embodiment of the present invention.

FIG. 7 shows a die pusher in which a light reflective material is coated on the inner wall of a through hole according to an embodiment of the present invention.

100:Die ejector

110:Ejector holder

112A:Opening part

112B: Vacuum hole

112:On the board

114:Fixed seat shell

116:Blocker

120:Ejector body

122:Through hole

130:Lifting drive part

132:Head

134:Drive shaft

140:Lighting unit

142:Lifting shaft

144: Lifting body

146:Lighting Department

150:Ejector housing

160:Sealing parts

172:Sealing parts

Claims (17)

A die ejector used to separate die from a cutting belt in a die bonding equipment, wherein the die ejector includes: an ejector fixing seat formed with an opening having a certain area and an opening formed on the The periphery of the opening is used to vacuum holes on the lower surface of the dicing tape; the ejector body is configured to lift and push away the crystal grains on the dicing tape through the opening; and the lifting drive part makes the The ejector body rises or falls; and a lighting unit is configured to be able to rise and fall in the internal space of the ejector body and the lifting drive part, and to irradiate light toward the cutting belt, wherein the lighting unit includes: lifting The shaft is configured to lift; the lifting body is fixedly coupled to the end of the lifting shaft; and the light-emitting part is coupled to the upper part of the lifting body. The die ejector according to claim 1, wherein the lifting shaft is arranged in an internal space of a through hole formed in a center portion of the ejector body and the lifting driving part. The die ejector according to claim 1, wherein the light emitting part is configured to irradiate ultraviolet light. The die ejector according to claim 1, wherein the light-emitting part is composed of an LED, a halogen lamp or a laser light source. The die pusher according to claim 2, wherein, The die pusher further includes a heating component disposed in the inner space of the through hole to apply thermal energy to the dicing tape. The die ejector according to claim 2, wherein an inner wall of the through hole is coated with a highly reflective substance for reflecting light from the lighting unit. A die supply module for supplying die for mounting to a substrate in a die bonding apparatus, wherein the die supply module includes: a wafer expander for supporting a dicing die attached with a plurality of die belt, and expands the spacing between the plurality of grains; and a grain pusher to separate the grains from the cutting belt, the grain pusher including: a pusher fixed seat formed with a certain an opening of an area and a vacuum hole formed around the opening for vacuum adsorption of the lower surface of the cutting tape; the ejector body is configured to move up and down through the opening to push away all the parts on the cutting tape. the wafer; a lift drive unit that raises or lowers the ejector body; and a lighting unit that is configured to be movable up and down in the internal space of the ejector body and the lift drive unit, and to irradiate light toward the cutting tape , wherein the lighting unit includes: a lifting shaft configured to lift; a lifting body fixedly coupled to the end of the lifting shaft; and a light emitting part coupled to the upper part of the lifting body. The die supply module according to claim 7, wherein, The lifting shaft is arranged in an internal space of a through hole formed in the center portion of the ejector body and the lifting drive unit. The die supply module according to claim 7, wherein the light-emitting part is configured to irradiate ultraviolet light. The die supply module according to claim 7, wherein the light-emitting part is composed of an LED, a halogen lamp or a laser light source. The die supply module according to claim 8, wherein the die supply module further includes: a heating component disposed in the internal space of the through hole to apply thermal energy to the dicing tape. The die supply module according to claim 8, wherein the inner wall of the through hole is coated with a highly reflective substance for reflecting the light of the lighting unit. A die bonding equipment includes: a die supply module that supplies die for mounting to a substrate; a die transport module that transports the die from the die supply module; and a die stage that is loaded from the die supply module. The die transport module places the die; a die bonding module picks up the die from the die stage and bonds the die to the substrate; and a bonding station transports the substrate , and transfer the bonded substrate to the material box. The die supply module includes: a wafer expander, used to support the dicing tape with multiple die attached, and expand the gap between the multiple die. a spacer; and a die ejector to separate the die from the dicing tape, The die ejector includes: an ejector fixed seat formed with an opening with a certain area and a vacuum hole formed around the opening for vacuum adsorption of the lower surface of the dicing tape; an ejector body configured In order to push away the die on the dicing belt through the lifting and lowering of the opening; a lifting driving part to raise or lower the ejector body; and a lighting unit configured to be on the ejector body and the ejector body. The internal space of the lifting drive part can be lifted and lowered, and irradiated with ultraviolet light toward the cutting belt, wherein the lighting unit includes: a lifting shaft configured to lift; a lifting body fixedly coupled to the end of the lifting shaft; and a light emitting unit. part, combined with the upper part of the lifting body. The die bonding equipment according to claim 13, wherein the lifting shaft is arranged in an internal space of a through hole formed in a center portion of the ejector body and the lifting driving part. The die bonding equipment according to claim 13, wherein the light-emitting part is composed of an LED, a halogen lamp, or a laser light source. The die bonding equipment according to claim 14, wherein the die bonding equipment further includes: a heating member disposed in an internal space of the through hole to apply thermal energy to the dicing tape. The die bonding apparatus according to claim 14, wherein a highly reflective substance for reflecting light of the lighting unit is coated on an inner wall of the through hole.

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