KR950034016A - 발광다이오드램프 및 이를 이용한 매트릭스표시기 - Google Patents

발광다이오드램프 및 이를 이용한 매트릭스표시기 Download PDF

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Publication number
KR950034016A
KR950034016A KR1019950003395A KR19950003395A KR950034016A KR 950034016 A KR950034016 A KR 950034016A KR 1019950003395 A KR1019950003395 A KR 1019950003395A KR 19950003395 A KR19950003395 A KR 19950003395A KR 950034016 A KR950034016 A KR 950034016A
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South Korea
Prior art keywords
light emitting
emitting diode
lamp
present
matrix display
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KR1019950003395A
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English (en)
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KR100309623B1 (ko
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다다히로 오카자키
요시노리 고이케
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사또겐이찌로
롬 가부시끼가이샤
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Publication of KR100309623B1 publication Critical patent/KR100309623B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)

Abstract

1. 청구범위에 기재된 발명이 속한 기술분야
본 발명은 발광다이오드램프 및 이것을 이용한 매트릭스표시기.
2. 발명이 해결하려고 하는 기술적 과제
본 발명은 발광시의 콘트라스트가 양호하여 시각성이 높은 LED램프 및 매트릭스표시를 얻는 것을 목적으로 한다.
3. 발명의 해결방법의 요지
본 발명의 발광다이오드램프는 적어도 한조의 리드단자(1)(2)와, 상기 한조의 리드단자(1)의 한쪽선단부에 부착된 발광다이오드소자(3)와, 상기 발광다이오드소자(3)와 다른쪽리드단자(2)와를 접속하는 금속와이어(4)와, 발광다이오드소자(3)를 포함하는 리드선(1)(2)의 선단부를 투광성수지로 성형한 몰드부(5)로 이루어지는 발광다이오드램프(7)에 있어서, 상기 몰드부(5)의 저면에 흑색의 도료를 도포한 것을 특징으로 하는 발광다이오드램프을 특징으로 하는 것이다.
4. 발명의 중요한 용도
본 발명은 발광다이오드램프의 몰드부의 저면에 흑색의 도료를 도포하여 발광면의 배경을 어둡게 했기 때문에 비점등과 점등시의 콘트라스트가 양호하게 되어 밝은곳에서도 시각성이 향상되므로 고속도로에 있어서의 경고표시기나 선전광고를 위한 표시기에 주로 사용된다.

Description

발광다이오드램프 및 이를 이용한 매트릭스표시기
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 LED램프의 실시예를 나타내는 단면도, 제2도는 본 발명의 매트릭스표시기를 나타내는 정면도(A), 측면도(B) 및 주요부 단면도(C).

Claims (2)

  1. 적어도 한조의 리드단자(1)(2)와, 상기 한조의 리드단자(1)의 한쪽 선단부에 부착된 발광다이오드소자(3)와, 상기 발광다이오드소자(3)와 다른쪽 리드단자(2)와를 접속하는 금속와이어(4)와, 발광다이오드소자(3)를 포함하는 리드선(1)(2)의 선단부를 투광성수지로 성형한 몰드부(5)로 이루어지는 발광다이오드램프(7)에 있어서, 상기 몰드부(5)의 저면에 흑색의 도료를 도포한 것을 특징으로 하는 발광다이오드램프.
  2. 제1항에 있어서, 상기 발광다이오드램프(7)를 매트릭스상으로 복수개 배열한 제1프린트기판(8)과, 상기 발광다이오드램프(7)를 구동시키기 위한 전자부품을 탑재한 제2프린트기판(9)과, 상기 각 발광다이오드램프(7)를 삽입하기 위한 관통구멍을 매트닉스상으로 배열한 케이스(11)로 이루어지는 것을 특징으로 하는 매트릭스표시기.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950003395A 1994-02-28 1995-02-22 발광다이오드램프및이를이용한매트릭스표시기 KR100309623B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-29305 1994-02-28
JP2930594 1994-02-28

Publications (2)

Publication Number Publication Date
KR950034016A true KR950034016A (ko) 1995-12-26
KR100309623B1 KR100309623B1 (ko) 2002-04-24

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Country Status (2)

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US (1) US5656847A (ko)
KR (1) KR100309623B1 (ko)

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US5656847A (en) 1997-08-12
KR100309623B1 (ko) 2002-04-24

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