KR950032450A - 에폭시 수지용 변성제로서 유용한 n-알킬-n'-아릴-p-페닐렌디아민 - Google Patents
에폭시 수지용 변성제로서 유용한 n-알킬-n'-아릴-p-페닐렌디아민 Download PDFInfo
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- KR950032450A KR950032450A KR1019950004339A KR19950004339A KR950032450A KR 950032450 A KR950032450 A KR 950032450A KR 1019950004339 A KR1019950004339 A KR 1019950004339A KR 19950004339 A KR19950004339 A KR 19950004339A KR 950032450 A KR950032450 A KR 950032450A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
본 발명은 에폭시 수지와 성분(b)의 총 중량을 기준으로 2.5 내지 12.5중량%로 부가될때, 경화 후 에폭시 수지가 강도, 강성, 인상 및 가열/습윤 특성과 같은 물리적 특성면에서, 경화되었으나 비변성된 에폭시 수지의 특성에 비해 상당한 증가를 나타내는 N-알킬-N′-아릴-p-페닐렌디아민에 관한 것이다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (19)
- (a)에폭시 수지; (b)경화제 유효량; 및 (c)에폭시 수지 중량을 기준으로, 하기식 (Ⅰ)의 화합물을 2.5 내지 12.5중량% 포함하는, 경화 후에 증진된 물리적 특성을 갖는 경화성 변성 에폭시 수지 조성물.:(Ⅰ)상기식에서, E 및 T는 독립적으로 탄소 원자 5 내지 12의 알킬, 탄소 원자 5 내지 8의 시클로알킬, 탄소원자 7 내지 15의 페닐알킬, 탄소 원자 6 내지 10의 아릴 또는 탄소 원자 1 내지 4의 알킬 1 또는 2로 치환된 아릴이다.
- 제1항에 있어서, 성분(a)의 에폭시 수가 다가 페놀, 지방족 및 시클로지방족알코올, 4,4′-디히드록시디페닐 술폰, 디히드록시나프탈렌의 글리시딜 에테르; 포름알데히드와 페놀 및 크레졸과의 축합 생성물; 할로겐화된 모노-, 디- 및 다핵 페놀의 글리시딜 에테르; 글리시딜화된 아민, 아미노페놀 및 아미드; 글리시딜화된 다가산; 시클로헥산 및 시클로펜탄 고리에 부착된 에폭시기를 갖는 시클로지방족 에폭시 수지; 및 그의 혼합물로 이루어진 군으로부터 선정되는 조성물.
- 제1항에 있어서, 성분(a)의 에폭시 수지가 비스페놀 A의 디글리시딜 에테르, 비스페놀 F의 디글리시딜 에테르, 히드로퀴논, 레조르시놀, 카테콜, 2,5-디히드록시나프탈렌 또는 9,9-비스(4-히드록시페닐)플루오렌의 디글리시딜 에테르; 3,3,3′,3′-테트라메틸-1,1′-스피로비스인단-5,5′,6,6′-테트라올의 테트라글리시딜 에테르; 메틸렌 디아닐린, m-페닐렌디아민, 1,4-디(α,α-디메틸-4-아미노벤질)벤젠, 1,4-디(α,α-디메틸-3-메틸-4-아미노벤질)벤젠 또는 3,3′-디에틸-4,4′-디아미노페닐메탄의 테트라글리시딜 유도체;4-아미노페놀 또는 3-메틸-4-아미노페놀의 트리글리시딜 유도체; 아닐린의 디글리시딜 유도체; 디(2-글리시딜옥시-1-나프틸)메탄, 디(2,5-디글리시딜옥시-1-나프틸)메탄 또는 2-그릴시딜옥시-1-나프틸-2′,5′-디글리시딜옥시-1′-나프틸메탄인 조성물.
- 제3항에 있어서, 성분(a)의 에폭시 수지가 비스페놀 A의 디글리시딜 에테르, 비스페놀의 F의 디글리시딜에테르, 3,3′-디에틸-4,4′-디아미노디페닐메탄 또는 그의 혼합물인 조성물.
- 제1항에 있어서, 성분(b)가 지방족, 방향족 또는 시클로지방족 디-또는 폴리아민; 디사안디아미드; 구아니딘; 폴리카르복시산 무수물; 촉매적 경화제; 또는 2관능성 또는 다관능성 페놀인 조성물.
- 제1항에 있어서, 성분(b) 가 3,3′-디아미노디페닐 술폰; 4,4′-디아미노디페닐술폰; 4,4′-메틸렌디아닐린;4,4′-메틸렌비스(2-클로로아닐린); 4,4′-메틸렌비스(2-메틸아닐린); m-페닐렌디아민; p-페닐렌디아민; 1,4-디(α,α-디메틸-4-아미노벤질)벤질, 1,4-디(α,α-디메틸 -3-메틸-4-아미노벤질)벤젠; 3,3′-디에틸-4,4′-디아미노디페닐메탄; 2,2′-디메틸-5,5′-디아미노디페닐 술폰; 1,8-디아미노나프탈렌;4,4′-메틸렌비스(2,6-디에틸아닐린); 2,2-디메틸-2,3′-디히드로피리미딘; 1-(4-아미노페닐)-1,3,3-트리메틸-5(6)-아미노인단; 트리메틸렌 비스(4-아미노벤조에이트), 디에틸렌트리아민, N-아미노에틸피페라진,4,4′-디아미노디시클로헥실메탄, 2,4-디에틸-3,5-디아미노톨루엔 , 프탈산 무수물, 트리멜리트산 무수물;3차 아민, 이미다졸 또는 삼불화 붕소의 착물; 비스페놀 A,테트라브로모비스페놀A, 또는 페놀또는 크레졸 노볼락 수지인 조성물.
- 제1항에 있어서, 성분(b)가 3,3′-디아미노디페닐 술폰, 2,4-디에틸-3,5-디아미노톨루엔, 3,3′-디아미노디페닐 술폰 및 3,4-에폭시-시클로헥실메틸 3,4-에폭시시클로헥산카르복실레이트의 부가 생성물, 디에틸렌트리아민, 3,3′-디메틸-4,4′-디아미노디시클로헥산 또느 3-(2-메틸이미다졸-1-일)프로피온산인 조성물.
- 제7항에 있어서, 성분(b)가 2,4-디에틸-3,5-디아미노톨루엔인 조성물.
- 제1항에 있어서, 성분(c)의 일반식(Ⅰ)의 화합물에서, E가 탄소 원자 5 내지 12의 알킬 또는 탄소 원자 6내지 10 의 아릴인 조성물.
- 제9항에 있어서, E가 탄소 원자 6 내지 10의 아릴인 조성물.
- 제10항에 있어서, E가 페닐인 조성물.
- 제1항에 있어서, 성분(c)의 일빈식(Ⅰ)의 화합물에서, T가 탄소원자 6 내지 12의 알킬인 조성물.
- 제12항에 있어서, T가 탄소 원자6 내지 8의 알킬인 조성물.
- 제13항에 있어서, T가 1,3-디메틸부틸 또는 1,4-디메틸펜틸인 조성물.
- 제1항에 있어서, 성분(c)가 N-1,3-디메틸부틸-N′-페닐-p-페닐렌디아민 또는 N,N′-비스(1,4-디메틸펜틸)-p-페닐렌디아민인 조성물.
- 제1항에 있어서, 성분(c)의 양이 에폭시 수지및 성분(b)의 총 중량 기준으로 4 내지 11중량%인 조성물.
- 제16항에 있어서, 성분(c)의 양이 에폭시 수지 및 성분 (b)의 총 중량 기준으로 5 내지 10중량%인 조성물.
- 50 내지 120℃의 온도에서 성분(a),(b) 및 (c)을 혼합하는 것을 포함하는 제1항에 따른 조성물의 제조방법.
- 제1항에 따른 조성물로부터 제조되는 합성물, 라미네이트, 접착제, 캡슐화된 장치, 성형 제품 또는 피복제.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US20401994A | 1994-02-28 | 1994-02-28 | |
US08/204,019 | 1994-02-28 | ||
US08/204.019 | 1994-02-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950032450A true KR950032450A (ko) | 1995-12-20 |
KR100333171B1 KR100333171B1 (ko) | 2002-11-30 |
Family
ID=22756276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950004339A KR100333171B1 (ko) | 1994-02-28 | 1995-02-27 | 에폭시수지용변성제로서유용한n-알킬-n'-아릴-p-페닐렌디아민 |
Country Status (8)
Country | Link |
---|---|
US (1) | US5503936A (ko) |
EP (1) | EP0669357B1 (ko) |
JP (1) | JPH07258389A (ko) |
KR (1) | KR100333171B1 (ko) |
BR (1) | BR9500773A (ko) |
DE (1) | DE69513425T2 (ko) |
ES (1) | ES2139870T3 (ko) |
TW (1) | TW276261B (ko) |
Families Citing this family (17)
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BR9908120A (pt) | 1998-02-20 | 2000-10-24 | Vantico Ag | Filossilicatos organofìlicos |
SG93832A1 (en) * | 1999-05-07 | 2003-01-21 | Inst Of Microelectronics | Epoxy resin compositions for liquid encapsulation |
US6617399B2 (en) * | 1999-12-17 | 2003-09-09 | Henkel Loctite Corporation | Thermosetting resin compositions comprising epoxy resins, adhesion promoters, curatives based on the combination of nitrogen compounds and transition metal complexes, and polysulfide tougheners |
US6670430B1 (en) | 1999-12-17 | 2003-12-30 | Henkel Loctite Corporation | Thermosetting resin compositions comprising epoxy resins, adhesion promoters, and curatives based on the combination of nitrogen compounds and transition metal complexes |
AU2002344461B2 (en) * | 2001-11-07 | 2007-07-12 | Toray Industries, Inc. | Epoxy resin compositions for fiber-reinforced composite materials, process for production of the materials and fiber-reinforced composite materials |
US6893736B2 (en) * | 2001-11-19 | 2005-05-17 | Henkel Corporation | Thermosetting resin compositions useful as underfill sealants |
US6951907B1 (en) | 2001-11-19 | 2005-10-04 | Henkel Corporation | Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex |
DE10210457A1 (de) * | 2002-03-09 | 2003-09-25 | Inst Verbundwerkstoffe Gmbh | Zähe Duroplaste aus aminhärtenden Epoxidharzen mit einer Kombination aus aliphatischen, cycloaliphatischen und aromatischen Strukturen |
US6723763B2 (en) | 2002-03-15 | 2004-04-20 | Henkel Loctite Corporation | Cure accelerators for anaerobic adhesive compositions |
WO2007008199A1 (en) * | 2005-07-08 | 2007-01-18 | Henkel Corporation | Primer compositions for adhesive bonding systems |
DE102007062035A1 (de) * | 2007-12-21 | 2009-06-25 | Robert Bosch Gmbh | Reaktionsharzsystem |
US8512594B2 (en) * | 2008-08-25 | 2013-08-20 | Air Products And Chemicals, Inc. | Curing agent of N,N′-dimethyl-meta-xylylenediamine and multifunctional amin(s) |
US8501997B2 (en) * | 2008-08-25 | 2013-08-06 | Air Products And Chemicals, Inc. | Curing agent for low temperature cure applications |
US7951884B1 (en) | 2009-03-31 | 2011-05-31 | Loctite (R&D) Limited | Cure accelerators for anaerobic adhesive compositions |
US20120308831A1 (en) * | 2009-12-01 | 2012-12-06 | Nagase Chemtex Corporation | Epoxy resin composition |
CN101914196B (zh) * | 2010-08-12 | 2012-05-02 | 蓝星(北京)化工机械有限公司 | 一种环氧树脂用的固化组合物及其制备方法和应用 |
CA2954265C (en) * | 2014-08-15 | 2019-08-13 | Halliburton Energy Services, Inc. | Naphthol-based epoxy resin additives for use in well cementing |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3982975A (en) * | 1967-09-06 | 1976-09-28 | Hercules Incorporated | Propellants having improved resistance to oxidative hardening |
US3984265A (en) * | 1967-09-06 | 1976-10-05 | Hercules Incorporated | Composite propellants having improved resistance to thermal oxidation |
US4366108A (en) * | 1980-07-25 | 1982-12-28 | Ciba-Geigy Corporation | Liquid matrix system based on a mixture of epoxide resin and an amine curing agent for producing fibre-reinforced plastics components |
CA1243040A (en) * | 1982-08-12 | 1988-10-11 | Paul D. Mclean | Epoxy resin fortifiers based on aromatic amides |
CA1221192A (en) * | 1982-08-12 | 1987-04-28 | Andrew Garton | Epoxy resin fortification |
DD231455A1 (de) * | 1982-12-31 | 1985-12-24 | Manfred Helbig | Elektroden aus organischen polymeren fuer sekundaerbatterien |
CA1308420C (en) * | 1986-03-27 | 1992-10-06 | Paul D. Mclean | Epoxy fortifiers based on aromatic polyhydroxyl compounds |
US4767809A (en) * | 1986-10-14 | 1988-08-30 | Uniroyal Chemical Company, Inc. | Elastomeric composition having improved cut growth resistance |
CA1315430C (en) * | 1987-03-12 | 1993-03-30 | Andrew Garton | Fortifiers for anhydride-cured epoxy resins |
JPH01294727A (ja) * | 1988-02-17 | 1989-11-28 | Tonen Corp | エポキシ樹脂硬化剤 |
-
1995
- 1995-01-12 US US08/371,645 patent/US5503936A/en not_active Expired - Fee Related
- 1995-01-27 TW TW84100753A patent/TW276261B/zh active
- 1995-02-20 EP EP19950810111 patent/EP0669357B1/en not_active Expired - Lifetime
- 1995-02-20 DE DE1995613425 patent/DE69513425T2/de not_active Expired - Fee Related
- 1995-02-20 ES ES95810111T patent/ES2139870T3/es not_active Expired - Lifetime
- 1995-02-24 BR BR9500773A patent/BR9500773A/pt not_active IP Right Cessation
- 1995-02-27 KR KR1019950004339A patent/KR100333171B1/ko not_active IP Right Cessation
- 1995-02-28 JP JP6520295A patent/JPH07258389A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPH07258389A (ja) | 1995-10-09 |
DE69513425D1 (de) | 1999-12-30 |
TW276261B (ko) | 1996-05-21 |
US5503936A (en) | 1996-04-02 |
KR100333171B1 (ko) | 2002-11-30 |
EP0669357B1 (en) | 1999-11-24 |
EP0669357A2 (en) | 1995-08-30 |
EP0669357A3 (en) | 1996-02-21 |
BR9500773A (pt) | 1995-10-31 |
ES2139870T3 (es) | 2000-02-16 |
DE69513425T2 (de) | 2000-08-03 |
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