KR950021187A - Wafer cleaning method - Google Patents
Wafer cleaning method Download PDFInfo
- Publication number
- KR950021187A KR950021187A KR1019930030823A KR930030823A KR950021187A KR 950021187 A KR950021187 A KR 950021187A KR 1019930030823 A KR1019930030823 A KR 1019930030823A KR 930030823 A KR930030823 A KR 930030823A KR 950021187 A KR950021187 A KR 950021187A
- Authority
- KR
- South Korea
- Prior art keywords
- cleaning
- oxide film
- wafer
- impurities
- cleaning method
- Prior art date
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
본 발명은 불산(HF) 및 이소프로필 알콜(isopropyl alcohol)이 배합된 용액에서 웨이퍼 상의 자연 산화막 및 불순물을 제거하는 것을 특징으로 하는 웨이퍼 세정방법에 관한 것으로, 반도체 소자의 모든 세정공정에 적용되며, 열산화막 자연 산화막 제거 및 자연사화막 속에 함유된 불순물, 금속 이온 제거등에 뛰어난 효과가 있다. 특히, 반도체 제조공정에 세정 순서로 유기물을 제거하는 황산 세정 다음에 이 세정액을 사용하면 더 우수한 세정효과를 낼 수 있다.The present invention relates to a wafer cleaning method comprising removing a native oxide film and impurities on a wafer from a solution containing hydrofluoric acid (HF) and isopropyl alcohol, and is applied to all cleaning processes of semiconductor devices. The thermal oxide film has an excellent effect on removing the natural oxide film and removing impurities and metal ions contained in the natural desert film. In particular, the use of this cleaning solution after sulfuric acid cleaning in which organic matters are removed in the cleaning order in the semiconductor manufacturing process can produce a better cleaning effect.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제1A도 내지 제1F도는 본 발명이 적용되는 반도체 제조공정도.1A to 1F are semiconductor manufacturing process diagrams to which the present invention is applied.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019930030823A KR950021187A (en) | 1993-12-29 | 1993-12-29 | Wafer cleaning method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019930030823A KR950021187A (en) | 1993-12-29 | 1993-12-29 | Wafer cleaning method |
Publications (1)
Publication Number | Publication Date |
---|---|
KR950021187A true KR950021187A (en) | 1995-07-26 |
Family
ID=66853663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930030823A KR950021187A (en) | 1993-12-29 | 1993-12-29 | Wafer cleaning method |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR950021187A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100495653B1 (en) * | 1997-09-24 | 2005-09-30 | 삼성전자주식회사 | Process for clearing an wafer |
-
1993
- 1993-12-29 KR KR1019930030823A patent/KR950021187A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100495653B1 (en) * | 1997-09-24 | 2005-09-30 | 삼성전자주식회사 | Process for clearing an wafer |
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