KR960019538A - Etching method of layer formed over thickness - Google Patents

Etching method of layer formed over thickness Download PDF

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Publication number
KR960019538A
KR960019538A KR1019940031596A KR19940031596A KR960019538A KR 960019538 A KR960019538 A KR 960019538A KR 1019940031596 A KR1019940031596 A KR 1019940031596A KR 19940031596 A KR19940031596 A KR 19940031596A KR 960019538 A KR960019538 A KR 960019538A
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KR
South Korea
Prior art keywords
layer formed
formed over
etching method
thickness
etching process
Prior art date
Application number
KR1019940031596A
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Korean (ko)
Inventor
방철원
허상범
Original Assignee
김주용
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 김주용, 현대전자산업 주식회사 filed Critical 김주용
Priority to KR1019940031596A priority Critical patent/KR960019538A/en
Publication of KR960019538A publication Critical patent/KR960019538A/en

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Abstract

본 발명은 반도체 소자 제조 공정중 두께를 초과하여 형성된 층의 식각방법에 관한 것으로, 예정두께를 초과하여 과다증착된 부분을 산화시킨 후, 식각공정을 통해 제거함으로써 수율향상의 효과를 얻을 수 있다.The present invention relates to a method of etching a layer formed in excess of the thickness during the semiconductor device manufacturing process, by oxidizing a portion overdeposited over a predetermined thickness, it is possible to obtain the effect of improving the yield by removing through the etching process.

Description

두께를 초과하여 형성된 층의 식각방법Etching method of layer formed over thickness

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

Claims (4)

반도체 소자 제조 공정중 두께를 초과하여 형성된 막의 제거방법에 있어서, 예정두께를 초과하여 과다증착된 부분을 산화시킨 후, 식각공정을 통해 제거하는 것을 특징으로 하는 두께를 초과하여 형성된 층의 식각방법.A method of removing a film formed in excess of a thickness during a semiconductor device manufacturing process, comprising: oxidizing a portion that is overdeposited in excess of a predetermined thickness and then removing the film by an etching process. 제1항에 있어서, 상기 식각공정은 산화막 제거를 위한 습식식각공정인 것을 특징으로 하는 두께를 초과하여 형성된 층의 식각방법.The method of claim 1, wherein the etching process is a wet etching process for removing an oxide layer. 제1항에 있어서, 상기 두께를 초과하여 형성된 층은 폴리실리콘층인 것을 특징으로 하는 두께를 초과하여 형성된 층의 식각방법.The method of claim 1, wherein the layer formed over the thickness is a polysilicon layer. 제2항 또는 제3항에 있어서, 상기 식각제는 불화수소(HF)인 것을 특징으로 하는 두께를 초과하여 형성된 층의 식각방법.The method of claim 2 or 3, wherein the etchant is hydrogen fluoride (HF). ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940031596A 1994-11-28 1994-11-28 Etching method of layer formed over thickness KR960019538A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940031596A KR960019538A (en) 1994-11-28 1994-11-28 Etching method of layer formed over thickness

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940031596A KR960019538A (en) 1994-11-28 1994-11-28 Etching method of layer formed over thickness

Publications (1)

Publication Number Publication Date
KR960019538A true KR960019538A (en) 1996-06-17

Family

ID=66648876

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940031596A KR960019538A (en) 1994-11-28 1994-11-28 Etching method of layer formed over thickness

Country Status (1)

Country Link
KR (1) KR960019538A (en)

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