KR950015673A - Bump Formation Method for Flip Chip - Google Patents

Bump Formation Method for Flip Chip Download PDF

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Publication number
KR950015673A
KR950015673A KR1019930023584A KR930023584A KR950015673A KR 950015673 A KR950015673 A KR 950015673A KR 1019930023584 A KR1019930023584 A KR 1019930023584A KR 930023584 A KR930023584 A KR 930023584A KR 950015673 A KR950015673 A KR 950015673A
Authority
KR
South Korea
Prior art keywords
wafer
forming
size
metal
solder cream
Prior art date
Application number
KR1019930023584A
Other languages
Korean (ko)
Inventor
공병식
Original Assignee
김주용
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김주용, 현대전자산업 주식회사 filed Critical 김주용
Priority to KR1019930023584A priority Critical patent/KR950015673A/en
Publication of KR950015673A publication Critical patent/KR950015673A/en

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Abstract

본 발명은 플립칩용 범프 형성방법으로, 웨이퍼에 포토레지스트를 도포하여 와이어 본드 패드가 노출되도록 애칭하며, 애칭부에 메탈을 형성하고, 형성된 메탈부에 솔더크림을 포인트 도팅하여 리플로우하며, 잔류한 포트 레지스트를 제거하는 공정으로 이루어지며, 웨이퍼 천상에 솔더크림 도팅에 의해 솔더범프를 형성함으로써 공정의 싸이클 타임이 단축되고 크림형태의 솔더크림을 사용함으로써 디스펜싱 노즐 사이즈에 따라 미세한 피치의 범프를 형성할 수가 있고, 이에 따라 칩 사이즈를 축소시킬 수 있으며, 결국 웨이퍼의 칩수가 증가하여 칩 코스트다운 효과를 가져다 주며, 아울러 서브스트레이트의 패턴 피치나 폭이 미세하게 제작가능하여 시스템의 사이즈를 축소하거나, 동일 사이즈의 시스템에 대용량의 형성이 가능케 된다.According to the present invention, a bump forming method for flip chips includes applying a photoresist to a wafer to etch a wire bond pad to expose the metal, forming a metal on a nicking portion, and reflowing by soldering a point dot on the formed metal portion. This process consists of removing the pot resist, and shortening the cycle time of the process by forming solder bumps by solder cream dotting on the wafer cloth, and forming bumps of fine pitch according to the dispensing nozzle size by using cream solder cream. The chip size can be reduced accordingly, resulting in an increase in the number of chips in the wafer, resulting in a chip cost down effect, and a fine pattern pitch or width of the substrate can be manufactured to reduce the size of the system, Large capacity can be formed in the same size system.

Description

플립칩용 범프 형성방법Bump Formation Method for Flip Chip

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 본 발명의 공정도이다.2 is a process diagram of the present invention.

Claims (2)

플립칩용 범프를 형성함에 있어서, 웨이퍼의 와이어 본드패드에 배리어 메탈을 형성하고, 배리어 메탈에 솔더크림을 포인트 도팅하며, 이를 리플로우시켜 솔더크림에 의한 범프를 형성함을 특징으로 하는 플립칩형 범프형성방법.In forming bumps for flip chip, flip chip type bump formation, characterized in that a barrier metal is formed on the wire bond pad of the wafer, and the point metal is doped with solder cream on the barrier metal and reflowed to form bumps by solder cream. Way. 제1항에 있어서, 솔더크림은 와이어 본드 패드 부위에 대응하는 위치에 노즐이 형성된 디스펜서에 의해 포인트 도팅함을 특징으로 하는 플립칩용 범프형성방법.The bump forming method as claimed in claim 1, wherein the solder cream is dot-dotted by a dispenser having a nozzle formed at a position corresponding to a wire bond pad portion. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019930023584A 1993-11-08 1993-11-08 Bump Formation Method for Flip Chip KR950015673A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019930023584A KR950015673A (en) 1993-11-08 1993-11-08 Bump Formation Method for Flip Chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019930023584A KR950015673A (en) 1993-11-08 1993-11-08 Bump Formation Method for Flip Chip

Publications (1)

Publication Number Publication Date
KR950015673A true KR950015673A (en) 1995-06-17

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ID=66825365

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930023584A KR950015673A (en) 1993-11-08 1993-11-08 Bump Formation Method for Flip Chip

Country Status (1)

Country Link
KR (1) KR950015673A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100713912B1 (en) * 2005-07-07 2007-05-07 주식회사 하이닉스반도체 Flip chip package by wafer level process and manufacture method thereof
WO2015076591A1 (en) * 2013-11-21 2015-05-28 주식회사 루멘스 Light-emitting device package, backlight unit, lighting device, and method for manufacturing light-emitting device package
KR101524046B1 (en) * 2013-11-21 2015-06-01 주식회사 루멘스 Light emitting device package, backlight unit, illumination device and its manufacturing method
KR101524044B1 (en) * 2013-11-21 2015-06-02 주식회사 루멘스 Light emitting device package, backlight unit and illumination device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100713912B1 (en) * 2005-07-07 2007-05-07 주식회사 하이닉스반도체 Flip chip package by wafer level process and manufacture method thereof
WO2015076591A1 (en) * 2013-11-21 2015-05-28 주식회사 루멘스 Light-emitting device package, backlight unit, lighting device, and method for manufacturing light-emitting device package
KR101524046B1 (en) * 2013-11-21 2015-06-01 주식회사 루멘스 Light emitting device package, backlight unit, illumination device and its manufacturing method
KR101524044B1 (en) * 2013-11-21 2015-06-02 주식회사 루멘스 Light emitting device package, backlight unit and illumination device
US9831407B2 (en) 2013-11-21 2017-11-28 Lumens Co., Ltd. Light emitting device package, backlight unit, illumination apparatus, and method of manufacturing light emitting device package
US10074788B2 (en) 2013-11-21 2018-09-11 Lumens Co., Ltd. Light emitting device package, backlight unit, illumination apparatus, and method of manufacturing light emitting device package

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E601 Decision to refuse application