KR950015673A - Bump Formation Method for Flip Chip - Google Patents
Bump Formation Method for Flip Chip Download PDFInfo
- Publication number
- KR950015673A KR950015673A KR1019930023584A KR930023584A KR950015673A KR 950015673 A KR950015673 A KR 950015673A KR 1019930023584 A KR1019930023584 A KR 1019930023584A KR 930023584 A KR930023584 A KR 930023584A KR 950015673 A KR950015673 A KR 950015673A
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- forming
- size
- metal
- solder cream
- Prior art date
Links
Abstract
본 발명은 플립칩용 범프 형성방법으로, 웨이퍼에 포토레지스트를 도포하여 와이어 본드 패드가 노출되도록 애칭하며, 애칭부에 메탈을 형성하고, 형성된 메탈부에 솔더크림을 포인트 도팅하여 리플로우하며, 잔류한 포트 레지스트를 제거하는 공정으로 이루어지며, 웨이퍼 천상에 솔더크림 도팅에 의해 솔더범프를 형성함으로써 공정의 싸이클 타임이 단축되고 크림형태의 솔더크림을 사용함으로써 디스펜싱 노즐 사이즈에 따라 미세한 피치의 범프를 형성할 수가 있고, 이에 따라 칩 사이즈를 축소시킬 수 있으며, 결국 웨이퍼의 칩수가 증가하여 칩 코스트다운 효과를 가져다 주며, 아울러 서브스트레이트의 패턴 피치나 폭이 미세하게 제작가능하여 시스템의 사이즈를 축소하거나, 동일 사이즈의 시스템에 대용량의 형성이 가능케 된다.According to the present invention, a bump forming method for flip chips includes applying a photoresist to a wafer to etch a wire bond pad to expose the metal, forming a metal on a nicking portion, and reflowing by soldering a point dot on the formed metal portion. This process consists of removing the pot resist, and shortening the cycle time of the process by forming solder bumps by solder cream dotting on the wafer cloth, and forming bumps of fine pitch according to the dispensing nozzle size by using cream solder cream. The chip size can be reduced accordingly, resulting in an increase in the number of chips in the wafer, resulting in a chip cost down effect, and a fine pattern pitch or width of the substrate can be manufactured to reduce the size of the system, Large capacity can be formed in the same size system.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제2도는 본 발명의 공정도이다.2 is a process diagram of the present invention.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019930023584A KR950015673A (en) | 1993-11-08 | 1993-11-08 | Bump Formation Method for Flip Chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019930023584A KR950015673A (en) | 1993-11-08 | 1993-11-08 | Bump Formation Method for Flip Chip |
Publications (1)
Publication Number | Publication Date |
---|---|
KR950015673A true KR950015673A (en) | 1995-06-17 |
Family
ID=66825365
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930023584A KR950015673A (en) | 1993-11-08 | 1993-11-08 | Bump Formation Method for Flip Chip |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR950015673A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100713912B1 (en) * | 2005-07-07 | 2007-05-07 | 주식회사 하이닉스반도체 | Flip chip package by wafer level process and manufacture method thereof |
WO2015076591A1 (en) * | 2013-11-21 | 2015-05-28 | 주식회사 루멘스 | Light-emitting device package, backlight unit, lighting device, and method for manufacturing light-emitting device package |
KR101524046B1 (en) * | 2013-11-21 | 2015-06-01 | 주식회사 루멘스 | Light emitting device package, backlight unit, illumination device and its manufacturing method |
KR101524044B1 (en) * | 2013-11-21 | 2015-06-02 | 주식회사 루멘스 | Light emitting device package, backlight unit and illumination device |
-
1993
- 1993-11-08 KR KR1019930023584A patent/KR950015673A/en not_active Application Discontinuation
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100713912B1 (en) * | 2005-07-07 | 2007-05-07 | 주식회사 하이닉스반도체 | Flip chip package by wafer level process and manufacture method thereof |
WO2015076591A1 (en) * | 2013-11-21 | 2015-05-28 | 주식회사 루멘스 | Light-emitting device package, backlight unit, lighting device, and method for manufacturing light-emitting device package |
KR101524046B1 (en) * | 2013-11-21 | 2015-06-01 | 주식회사 루멘스 | Light emitting device package, backlight unit, illumination device and its manufacturing method |
KR101524044B1 (en) * | 2013-11-21 | 2015-06-02 | 주식회사 루멘스 | Light emitting device package, backlight unit and illumination device |
US9831407B2 (en) | 2013-11-21 | 2017-11-28 | Lumens Co., Ltd. | Light emitting device package, backlight unit, illumination apparatus, and method of manufacturing light emitting device package |
US10074788B2 (en) | 2013-11-21 | 2018-09-11 | Lumens Co., Ltd. | Light emitting device package, backlight unit, illumination apparatus, and method of manufacturing light emitting device package |
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Legal Events
Date | Code | Title | Description |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |