KR950005454B1 - Plastic encapsulated type semiconductor device - Google Patents

Abstract

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Description

Resin Sealed Semiconductor Device

1 (a) and 2 (a) are perspective views of a conventional resin sealed semiconductor device.

1 (b) and 2 (b) are plan views of lead frames used to fabricate the semiconductor devices of FIGS. 1 (a) and 2 (a).

3A is a plan view showing a mounting state of the resin-sealed semiconductor device of the present invention.

3 (b) is the completeness thereof.

* Explanation of symbols for main parts of the drawings

1,20: lead 2: frame part

3: slit 4,25: semiconductor pellet

5, 21, 23: bed part 6: metal connection part

22: support 24: support pin

26: fine metal wire 27: sealing resin layer

[Industrial use]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealed semiconductor device for use in AV equipment, OA / FA equipment, and the like, and more particularly, to a package thereof.

[Traditional Technology and Problems]

In recent years, with the expansion of the field of use of semiconductor devices, the demand for modular semiconductor devices using printed boards is increasing, and the surface mounting method is widely used in the assembly process. By the way, the mounter and the wire bonder are used like the conventional method in the method using the lead frame which is the mainstream of the assembly process of a semiconductor element.

In a modular semiconductor device, by mounting a resistor, an L component, and a semiconductor element constituting a necessary circuit on a printed board according to a conventional method, peripheral circuits other than the main circuit elements can be integrally formed to reduce expenses and spaces. This demand is increasing.

Here, the structure shown in FIG. 1 and FIG. 2 is known as a lead frame in which a plurality of semiconductor elements can be mounted. A plan view in which semiconductor elements are mounted on a lead frame is shown in FIGS. 1B and 2B. Fig. 1 is a perspective view of the semiconductor element after resin sealing in Figs. 1 (a) and 2 (a).

Although the lead frame has a different detailed structure depending on the type, the lead is formed from the metal package as a starting point, and in the DIP type of the drawing, the slit is formed in the frame portion 2 that is installed to cross the direction in which the lead 1 is drawn. 3) is formed, and the semiconductor pellet 4 is mounted in an island region (hereinafter referred to as a bed portion) provided near the end of each lead serving as the oil step. In the example of FIG. 1 (b), this bed part is fixed to the frame part 2 by the metal connection part 6 continuous to each lead and the bed part 5. However, as shown in Fig. 2 (b), the bed portion 5 is formed at the center of the package 2, which is wider than the lid 1 and has the same length in the same length and width. . The semiconductor pellets 4 assembled to the lead frame are covered with a package (hereinafter referred to as an envelope) made of the sealing resin layer 6 through a predetermined process, and the final state thereof is shown in FIG. And FIG. 2 (a). That is, the end of the outer lead 1 leading out of the sealing resin layer 6 is bent at a predetermined angle to prepare for connection with other equipment, but there is an example in which the surface mounting method has a special curved shape. The rounded part in the sealing resin layer 6 of FIG. 1 (b) serves as a mark.

Since the lead formed in the lead frame has a smaller diameter than the semiconductor pellets mounted on the bed, the bed must naturally have a smaller diameter, which is a basis for greatly improving the mounting density of the metal area in the sealing resin layer.

On the other hand, in order to form a semiconductor device having a high added value by mounting a plurality of semiconductor pellets, it is necessary to study the bed portion. That is, since the number of semiconductor pellets which can be mounted on a normal bed part is limited by the size, it must be formed in another place as a matter of course. However, since the semiconductor pellets mounted on the bed portion must be connected to each other by a thin metal wire between the leads by a so-called bonding method, when a plurality of semiconductor pellets are mounted, the end of the sealing resin layer The density of this circuit connection is large at the tip of the lead positioned corresponding to the vicinity. For this reason, the method of installing the bed part larger than the diameter and smaller than a normal bed part is known in the middle instead of the end of a lead. However, in order to prevent the semiconductor pellets mounted in the cut and bend processes carried out after the resin sealing step from scattering, support pins are usually formed in the lead frame.

In the lead frame of the type in which the semiconductor pellets are mounted on the plurality of bed portions, since there is no space for supporting pins, a predetermined semiconductor element cannot be formed and a high added value semiconductor device cannot be realized.

[Purpose of invention]

The present invention has been made in view of the above circumstances, and an object thereof is to realize a semiconductor device having a high added value for public welfare / industrial use.

[Configuration of Invention]

The present invention relates to a lead disposed to surround a maximum of a plurality of metal bed portions on which semiconductor elements are mounted in a relatively large and small relationship, and a metal bed portion and a metal bed formed in the middle of the lead and having a diameter smaller than the maximum metal bed portion. A thin metal wire connecting the electrode of the semiconductor element mounted in the portion to the small diameter lead, a sealing resin layer covering each component, an extension portion of the lead end and the largest metal bed portion drawn out from the sealing resin layer to face each other; Characterized in that the support pin is formed along the lead direction of the lead end.

Action

In the present invention configured as described above, in order to mount a plurality of semiconductor elements on the lead frame, it is necessary to form a plurality of metal bed portions, but it is necessary to be an intermediate place between each lead and the frame portion. In the lead cutting process, a support pin for connecting a lead frame and a hermetically sealed semiconductor element is formed at the end thereof to form a module product having an electronic circuit having a plurality of semiconductor elements, resistors, etc. by a hybrid method. It can be formed.

EXAMPLE

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

3 (a) and 3 (b) illustrate one embodiment according to the present invention. That is, as shown in Fig. 3 (a), a pressing process is performed on pure iron, iron alloy (Fe-Ni), copper or copper alloy to form a lead frame for a DIP type or a mixed type for a SIP type and a DIP type. The outline of the structure extends toward the center from a frame portion (not shown) disposed around and functions as an outer lead after the resin sealing process, and forms a plurality of leads 20,. . The leading directions of the leads 20, ... are two directions in the drawing, that is, directions facing each other. However, in the case where the frame portion is formed in four directions, the leading direction of the leads becomes four directions.

As shown in the figure, the leading end of each lead is made to be a stepped end, and the largest metal bed portion 21 is formed at a position close to that, i.e., almost a center position of the frame portion. In this figure, it is supported by the wide belt-shaped support stand 22, and the other metal bed part 23 ... is formed also in the middle of one part of the lead 20, .... However, although the support pins 24 and 24 are formed along the direction which leads each of these leads 20, ..., the place is naturally a part of the stage.

By the way, the metal bed portions 21 and 23 are each equipped with semiconductor pellets 25,..., With predetermined characteristics to form electronic circuits including interfaces required for AV equipment and the like. Therefore, the completeness of the ball bonding of the fine metal wires 26, ... between each semiconductor pellet 25, ... and each lead by thermocompression or ultrasonic thermocompression is shown in FIG. have. In this figure, although the connection diagram of the simple metal wires 26, ... is shown, in a complicated circuit, a so-called TOB which forms another metal wire by another loop and connects other circuit elements on the upper side of the metal wire once connected. (Turn Over Bonding) etc. may also be performed.

In the subsequent resin sealing step, the molten resin layer flows into the cavity from the gate through a curl and a runner formed in the mold, so that the metal thin wires 26,... Positioning the long direction of is undesirable.

Although not shown in Fig. 3 (a), so-called metal washes are provided to increase mechanical strength in the direction crossing each lead, but the frame parts are cut and removed together by mechanical means, that is, a pressing process. . However, the presence of the supporting pins 24 and 24 prevents the lead and the large and small metal bed portions 21, 23, ... from scattering, and furthermore, the lead frame having various semiconductor substrates 25, ... Since it is obtained, it is possible to proceed to the resin sealing step so that the polygonal sealing resin layer 27 can be formed.

FIG. 3 (b) shows a perspective view of a module product on which semiconductor pellets are mounted using a lead frame. The support pins 24 and 24 are cut and removed at the time of forming the outer lead 20, and have a polygonal shape. The support surface 22 of the outer lead and the metal bed part is formed in the lead-out surface 28 which comprises the thickness direction of the sealing resin layer 27 of this.

On the other hand, the reference numerals written along the components of the claims of the present application to facilitate the understanding of the present invention, not intended to limit the technical scope of the present invention to the embodiments shown in the drawings.

[Effects of the Invention]

As described above, the resin-sealed semiconductor device according to the present invention has high mounting density, can be formed with high added value, and is light, thin, short, small, and high reliability electronic devices at low cost without changing the conventional manufacturing process. It becomes possible to manufacture.

In addition, manufacturing a system-scale resin-sealed semiconductor device by mounting a plurality of semiconductor elements in a specific pattern, that is, a lead frame having a plurality of bed portions, can be made at a lower cost than using a circuit board. Withdrawal of the support pin can be realized without reducing the mounting density.

Claims (1)

The lead 20 arranged so as to surround the largest 21 among the plurality of metal bed portions on which the semiconductor element is mounted in a relatively large and small relationship, and formed in the middle of the lead 20, than the largest metal bed portion 21. A metal bed portion 23 having a small diameter, a fine metal wire 26 connecting the electrodes of the semiconductor element 25 mounted on the metal bed portion with a small diameter lead, a sealing resin layer 27 covering each component, A lead end 20 which is drawn out of the sealing resin layer 27 to face each other, an extension part 22 of the largest metal bed part, and a support pin 24 formed along the direction in which the lead end 20 is led. Resin-sealed semiconductor device, characterized in that.

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