KR950004826U - 열전소자를 이용한 열전 냉각장치 - Google Patents

열전소자를 이용한 열전 냉각장치

Info

Publication number
KR950004826U
KR950004826U KR2019930014591U KR930014591U KR950004826U KR 950004826 U KR950004826 U KR 950004826U KR 2019930014591 U KR2019930014591 U KR 2019930014591U KR 930014591 U KR930014591 U KR 930014591U KR 950004826 U KR950004826 U KR 950004826U
Authority
KR
South Korea
Prior art keywords
thermoelectric
cooling device
elements
thermoelectric elements
thermoelectric cooling
Prior art date
Application number
KR2019930014591U
Other languages
English (en)
Other versions
KR960000463Y1 (ko
Inventor
김영준
김경희
Original Assignee
김영준
김경희
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김영준, 김경희 filed Critical 김영준
Priority to KR2019930014591U priority Critical patent/KR960000463Y1/ko
Publication of KR950004826U publication Critical patent/KR950004826U/ko
Application granted granted Critical
Publication of KR960000463Y1 publication Critical patent/KR960000463Y1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38Cooling arrangements using the Peltier effect
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR2019930014591U 1993-07-31 1993-07-31 열전소자를 이용한 열전 냉각장치 KR960000463Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930014591U KR960000463Y1 (ko) 1993-07-31 1993-07-31 열전소자를 이용한 열전 냉각장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930014591U KR960000463Y1 (ko) 1993-07-31 1993-07-31 열전소자를 이용한 열전 냉각장치

Publications (2)

Publication Number Publication Date
KR950004826U true KR950004826U (ko) 1995-02-18
KR960000463Y1 KR960000463Y1 (ko) 1996-01-10

Family

ID=19360381

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930014591U KR960000463Y1 (ko) 1993-07-31 1993-07-31 열전소자를 이용한 열전 냉각장치

Country Status (1)

Country Link
KR (1) KR960000463Y1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030072714A (ko) * 2002-03-06 2003-09-19 은 택 이 팬티 및 그 제조방법
KR101154518B1 (ko) * 2009-07-15 2012-06-13 자동차부품연구원 차량용 냉난방 시트

Also Published As

Publication number Publication date
KR960000463Y1 (ko) 1996-01-10

Similar Documents

Publication Publication Date Title
DE59305980D1 (de) Thermoelektrische heiz- oder kühlvorrichtung
DE68906953D1 (de) Thermoelektrische kuehlvorrichtung.
DE69512622D1 (de) Thermoelektrische Kühleinheit
DE69530385D1 (de) Kühlungsvorrichtung
DE69104603D1 (de) Kühlungsvorrichtung.
NO961757D0 (no) Vacuumlöfte-anordning
NO924797D0 (no) Kompresjonskuldeanordning
DE69535235D1 (de) Thermoelektrische Vorrichtung
FI956294A0 (fi) Suntauslaite
DE69400694D1 (de) Halbleitervorrichtung
DE69321446T2 (de) Kühlungseinrichtung
DE69431099D1 (de) Pipettenreinigungseinheit
DE69411996D1 (de) Betrachtungsgerät
DE69423196D1 (de) Halbleiterlaservorrichtung
NO933753D0 (no) Roer-reperasjonsanordning
DE69413178T2 (de) Wärmekopfgerät
DE69314058D1 (de) Hochwirksame, wasserstoffbetriebene kühlvorrichtung
IT1261545B (it) Dispositivo singolarizzatore
DE4496282T1 (de) Halbleiter-Einrichtung
NO954863D0 (no) Halvlederanordning
TR199501397A2 (tr) Sogutma cihazi
DE69404942T2 (de) Halbleiterlaservorrichtung
DE59403540D1 (de) Kühlgerät
IT1271282B (it) Dispositivo termoaccoppiatore
KR950004826U (ko) 열전소자를 이용한 열전 냉각장치

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
LAPS Lapse due to unpaid annual fee