KR950001795A

KR950001795A - Manufacturing method of chip type electrolytic capacitor

Info

Publication number: KR950001795A
Application number: KR1019930011111A
Authority: KR
Inventors: 임복수
Original assignee: 윤종용; 삼성전기 주식회사
Priority date: 1993-06-17
Filing date: 1993-06-17
Publication date: 1995-01-03

Abstract

본 발명은 레디얼 타입(Radial Type)의 전해 콘덴서를 칩(Chip)화하여 다층 인쇄회로기판(PCB)에 표면실장이 가능하도록 한 칩형 전해 콘덴서의 제작 방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a chip type electrolytic capacitor in which a radial type electrolytic capacitor is chipped to enable surface mounting on a multilayer printed circuit board (PCB).

그 방법은, 전해 콘덴서의 전극 인출단자인 리드선을 전해 콘덴서로부터 인출시킨 후 이를 일정길이로 절단하는 리드선 절단공정과, 콘덴서 안치홈의 저부에 콘넥터가 양측으로 착설되고, 중앙에 두개의 리드선 삽입홀을 형성시킨 콘덴서 좌판을 제작하는 콘덴서 좌판 제작 공정과, 상기에서 마련된 전해 콘덴서를 콘덴서 좌판의 콘덴서 안치홈에 삽입하고, 콘덴서로 부터 인출되는 리드선을 리드선 삽입홀내에 삽착시켜 콘덴서 좌판 저부에 착설된 콘넥터와 리드선이 연결접속토록 되는 칩 형태의 전해 콘덴서 결합 공정을 통하여 전해 콘덴서를 제작한다.The method includes a lead wire cutting step of drawing a lead wire, which is an electrode lead terminal of an electrolytic capacitor, out of an electrolytic capacitor and cutting it to a predetermined length, and a connector is installed on both sides at the bottom of the capacitor settling groove, and two lead wire insertion holes are located at the center. A capacitor seat plate fabrication process for manufacturing a capacitor seat plate having a shape of a capacitor; The electrolytic capacitor is manufactured through a chip type electrolytic capacitor coupling process in which the lead wires are connected to each other.

따라서, 다층 인쇄회로기판상에 칩형 전해 콘덴서의 표면실장이 가능하게 됨은 물론, 전해 콘덴서의 제조시 발생되는 콘덴서의 특성변화 요인을 미연에 예방하고, 전해 콘덴서의 제조 공정을 단순화하여 작업성 및 생산성을 향상시킬 수 있는 것이다.Therefore, it is possible to mount the surface of the chip-type electrolytic capacitor on the multilayer printed circuit board, and to prevent the change of the characteristics of the capacitor generated during the manufacturing of the electrolytic capacitor, and to simplify the manufacturing process of the electrolytic capacitor. To improve.

Description

Manufacturing method of chip type electrolytic capacitor

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3도는 본 발명에 의해 제작된 전해 콘덴서의 요부 구성도, 제4도는 본 발명인 전해 콘덴서의 콘덴서 좌판을 도시한 정단면 구조도.FIG. 3 is a main configuration diagram of an electrolytic capacitor produced by the present invention, and FIG. 4 is a front sectional structural diagram showing a capacitor seat of the electrolytic capacitor according to the present invention.

Claims

In the manufacturing method of the electrolytic capacitor, a lead wire cutting step of drawing a lead wire, which is an electrode lead terminal of the electrolytic capacitor, from the electrolytic capacitor and cutting it into a predetermined length, and a connector is installed on both sides at the bottom of the capacitor settling groove, A capacitor seat plate manufacturing process for manufacturing a capacitor seat plate having lead wire insertion holes formed therein; the electrolytic capacitor prepared above is inserted into a capacitor settling groove of the capacitor seat plate, and a lead wire drawn from the capacitor is inserted into the lead wire insertion hole, A method of manufacturing a chip type electrolytic capacitor, comprising a step of coupling an electrolytic capacitor in the form of a chip in which an installed connector and a lead wire are connected to each other.

※ Note: The disclosure is based on the initial application.