JPH07254530A - Aluminum electrolytic chip capacitor - Google Patents

Abstract

PURPOSE:To obtain an aluminum electrolytic chip capacitor whose manufacturing process is composed of one system by a method wherein the aluminum electrolytic chip capacitor is set so as to be capable of being mounted in either the vertical direction or the horizontal direction with reference to an electric circuit board or the like by means of an identical aluminum electrolytic capacitor and an identical molded body for a chip. CONSTITUTION:Lead terminals 12 for a capacitor body 11 are inserted into through holes 23 for extraction, the lead terminals 12, as one pair, which are extracted to the outside from the through holes 23 are bent respectively to opposite directions along an outer wall part 22, and one pair of longitudinal setting lead terminals are formed. On the other hand, one pair of tilted housing grooves 29 are formed toward an orthogonal outer wall part 27 at right angles to the outer wall part 22, and one pair of housing grooves 30 which communicate with the housing grooves 29 are formed. The lead terminals 12 are extracted from the through holes 23, they are bent, and transverse setting lead terminals are formed in the housing grooves 29, 30. Thereby, it is possible to obtain the aluminum electrolytic chip capacitor whose manufacturing process is composed of one system and whose process can be rationalized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an aluminum electrolytic chip capacitor, and more specifically, when welding an aluminum electrolytic chip capacitor to an electric circuit board or the like, one or both of the height and the occupied area of the aluminum electrolytic chip capacitor are welded. The present invention relates to an aluminum electrolytic chip capacitor that can be used for each application by using the same aluminum electrolytic capacitor and the same molded body for a chip in the case of prioritizing.

[0002]

2. Description of the Related Art As is well known, as automatic mounting on electric circuit boards is progressing, aluminum electrolytic capacitors are rapidly being made into chips, and chips with pedestals (vertical type) and resin case insertion type are already being used. Two types of chips (horizontal type) have been developed and put into practical use. However, it is also true that there are cases where the height of electronic components is strictly limited in the circuit design, and there are designs where the height is not so limited, and in reality, both examples exist. By the way, generally used aluminum electrolytic capacitors have a cylindrical shape and lead terminals are drawn out from one side, and in many cases, the height is larger than the product diameter. It is necessary to make different products according to the purpose, for example, if the vertical type is used, the height of the product becomes a problem, while if the horizontal type is used, the occupied area of the product becomes large. So, in the past,
Although not particularly shown, although the aluminum electrolytic capacitors are the same, two types of molded chips are prepared, the vertical type and the horizontal type having completely different configurations. Was used properly.

[0003]

Therefore, the conventional aluminum electrolytic chip capacitor requires two types of vertical type and horizontal type, and the manufacturing method of each is completely different.
The manufacturing process requires at least two systems, which increases the manufacturing cost. Further, even in the manufacturing process, it is necessary to have two systems having different design members, which causes a problem that it takes man-hours.

The present invention has been made in view of the above problems of the prior art, and an object thereof is to use the same aluminum electrolytic capacitor and the same molded body for a chip to form an electric circuit board or the like. It is an object of the present invention to provide a vertical and horizontal aluminum electrolytic chip capacitor which can be welded to either the vertical or horizontal direction.

[0005]

The inventor of the present invention is to manufacture an aluminum electrolytic chip capacitor if a chip capacitor for both vertical and horizontal directions can be produced by using the same constituent elements (aluminum electrolytic capacitor and molded body for chip). I thought that the merits should be extremely large both in terms of performance and practical use. Then, as a result of repeated trial manufacture, the present invention could be completed. The aluminum electrolytic chip capacitor according to the present invention solves the above-mentioned problems and is as follows. That is, the present invention includes an aluminum electrolytic capacitor and a molded body for a chip, and the molded body for a chip is an integrally molded body having heat resistance and electrical insulation, and a part or all of the main body of the aluminum electrolytic capacitor is inserted. Insertion recess, a through hole through which a pair of lead terminals are led out, and a pair of lead groove for vertical installation formed by bending the lead terminals led out from the through hole in the radial direction of the aluminum electrolytic capacitor body. An orthogonal outer wall provided with an outer wall portion provided with and a pair of storage grooves for the horizontal placement lead terminals formed by being bent in a direction orthogonal to the storage groove for the pair of horizontal placement lead terminals in the outer wall portion. With the same section, the same aluminum electrolytic capacitor can be mounted vertically or horizontally on an electric circuit board, etc. by the same chip molding. The is characterized in configuration.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings and its operation. FIG. 1 is a perspective view illustrating an example of an aluminum electrolytic chip capacitor according to the present invention. The present chip capacitor includes an aluminum electrolytic chip capacitor and a chip molded body. The aluminum electrolytic capacitor 10 has a capacitor body 11 and a pair of lead terminals 12, and the capacitor 1
0 is a known one.

The chip molded body 20 into which the aluminum electrolytic capacitor 10 is inserted is a rectangular parallelepiped which is excellent in heat resistance and electrical insulation, for example, a single body of ceramic, glass or the like or an integrally molded product of these composite materials. There is an insertion recess 2 into which a part or all of the capacitor body 11 is inserted.
1 and a through hole 23 for leading out the pair of lead terminals 12 is provided in the outer wall portion 22 facing the insertion recess 21 in the axial direction. The pair of lead terminals 12 led out to the outside from the through hole 23 are oriented in opposite directions along the outer wall portion 22 (preferably, one of the two orthogonal outer wall portions 14 orthogonal to the outer wall portion 22 which is the radial direction of the capacitor body 11). , 25 direction) to form a pair of vertical lead terminals 13,
A pair of storage grooves 26 are provided in the outer wall portion 22 for storing the pair of vertical lead terminals 13. Also,
The outer wall portion 22 is provided with a pair of oblique storage grooves 29 toward one of the outer wall portions 22 (or 28) of the other outer wall portions 27 and 28 which are orthogonal to the outer wall portion 22. A pair of storage grooves 30 communicating with the storage groove 29 is provided at both end portions of the orthogonal outer wall portion 27 (or 28), and the lateral grooves formed through the through holes 23 and bent to form the storage grooves 29, 30. The placement lead terminal 14 is housed. In FIG. 1, reference numeral 31 denotes a contact prevention protrusion provided on the outer wall portion.

The aluminum electrolytic chip capacitor according to the above-mentioned structure has a structure as shown in FIG. 2 in which the chip molded body 20 is used when the aluminum electrolytic chip capacitor is welded to the electric circuit board 40 for vertical installation. The main body 11 of the aluminum electrolytic capacitor 10 is inserted into the insertion concave portion 21, the pair of lead terminals 12 is led out from the pair of through holes 23, and the led pair of lead terminals 12 are The lead terminals 13 are bent along the outer wall portion 22 to form a pair of vertical lead terminals 13, and the lead terminals 13 are housed in a pair of housing grooves 26. Then, when the capacitor body 11 is placed vertically, the pair of lead terminals 13 for vertical placement are welded to the electric circuit board 40 and the like.

When used for horizontal placement, the pair of lead terminals 12 led out from the through hole 23 of the chip forming body 20 are bent along the outer wall portion 22, and further the outer wall portion 22 and the outer wall orthogonal to the outer wall portion 22. The lead terminals 14 are bent along the line 27 to form a pair of horizontal placement lead terminals 14.
Are stored in the pair of storage grooves 29 and 30, respectively. Then, in a state in which the capacitor body 11 is placed horizontally,
The pair of horizontal lead terminals 14 is an electric circuit board 40.
Welded to etc.

In the embodiment shown in FIG. 4, a resin adhesive layer 32 is provided on the contact surface with the bottom of the capacitor body 11 in the insertion recess 21 of the molded chip body 20. The molded product for chips is made of a heat-resistant resin molded product such as PPS (polyphenylene sulfide) resin, imide resin or epoxy resin, and a composite material using an additive such as glass fiber in these resins. According to the present embodiment in which the resin adhesive layer 32 is hermetically interposed, the aluminum electrolytic capacitor 1
The stability of 0 and the airtightness are improved, and the heat resistance is further improved.

[0011]

According to the present invention, however, a vertical or horizontal aluminum electrolytic chip capacitor can be manufactured by changing the lead terminal bending method using the same aluminum electrolytic capacitor and the same chip molding. You can
Therefore, the manufacturing process which has conventionally required two systems of the vertical type and the horizontal type can be made into one system, and the manufacturing cost can be significantly reduced. Further, even in the production turn, it is not necessary to have two systems of members having different designs, and it is possible to greatly rationalize the process.

[Brief description of drawings]

FIG. 1 is a perspective view illustrating an example of an aluminum electrolytic chip capacitor according to the present invention.

FIG. 2 is a cross-sectional explanatory view in the case of vertical installation.

FIG. 3 is a cross-sectional explanatory view in the case of horizontal placement.

FIG. 4 is a cross-sectional explanatory view showing another example of the present invention.

[Explanation of symbols]

 10 Aluminum Electrolytic Capacitor 11 Capacitor Main Body 12 Pair of Lead Terminals 13 Pair of Vertical Lead Terminals 14 Pair of Horizontal Lead Terminals 20 Chip Molded Body 21 Insertion Recess 22 Outer Wall 23 Pair of Lead Terminal Lead Through Holes 24, 25 One orthogonal outer wall portion 26 A pair of storage grooves 27, 28 The other orthogonal outer wall portion 29, 30 A pair of storage grooves 32 A heat resistant resin adhesive layer

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display location H05K 1/18 H 8718-4E

Claims (3)

[Claims] 1. An aluminum electrolytic capacitor and a molded body for a chip, wherein the molded body for a chip is an integrally molded body having heat resistance and electrical insulation, and an insert into which the main body of the aluminum electrolytic capacitor is inserted. A recess, a through hole through which a pair of lead terminals are led out, an outer wall portion which is a lead terminal led out through the through hole and is bent in a radial direction of the aluminum electrolytic capacitor body to form a pair of vertical lead terminals, and The aluminum electrolytic capacitor has an orthogonal outer wall portion that is bent through the outer wall portion in a direction orthogonal to the outer wall portion to form a pair of laterally-mounting lead terminals, and the aluminum electrolytic capacitor is an electric circuit formed by the same chip forming body as the same aluminum electrolytic capacitor. Place vertically on the board,
Aluminum electrolytic chip capacitors featuring a structure that can be mounted in either direction. 2. The outer wall portion of the molded body for chips,
A pair of vertical lead terminal storage grooves and a pair of horizontal lead terminal storage grooves are provided, and a pair of horizontal placement lead terminals connected to the horizontal placement lead terminal storage groove on the orthogonal outer wall. The aluminum electrolytic chip capacitor according to claim 1, wherein the storage groove is provided. 3. The aluminum electrolytic chip capacitor according to claim 1, wherein a heat-resistant resin adhesive layer is hermetically interposed on the contact surface between the molded body for chips and the aluminum electrolytic capacitor. .