KR940016643A - 본딩와이어의 본딩위치 검사장치 - Google Patents

본딩와이어의 본딩위치 검사장치 Download PDF

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KR940016643A
KR940016643A KR1019930030368A KR930030368A KR940016643A KR 940016643 A KR940016643 A KR 940016643A KR 1019930030368 A KR1019930030368 A KR 1019930030368A KR 930030368 A KR930030368 A KR 930030368A KR 940016643 A KR940016643 A KR 940016643A
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우이치 미야하라
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사토 후미오
가부시키가이샤 도시바
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Abstract

본 발명은 본딩위치를 간단하면서 용이하게 인식하고, 검사결과의 신뢰성의 향상, 처리시간의 감소에 의한 검사비용의 절감을 도모하기 위한 것이다.
본 발명은 피사체(10) 위쪽에는 상기 피사체를 촬성하는 촬상장치(11)가 배치되어 있고, 이 촬상장치(11)에 일체화하여 피사체(10)에 광을 조사하는 낙사조명장치(12)가 배치되며, 피사체(10)의 아래쪽에는 상기 피사체에 광을 조사하는 배광조명장치(13)가 배치된다. 촬상장치(11)에 의해 촬상된 화상은 화상처리장치(14)의 메모리부(14a)에 취입되고, 조명처리장치(12,13)에는 전원(16,17)이 접속된다. 그리고, 화상처리장치(14) 및 전원(16,17)은 콘트롤러(15)에 의해 제어된다.

Description

본딩와이어의 본딩위치 검사장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명의 1실시예에 따른 본딩와이어의 본딩위치 검사장치의 구성을 나타낸 블록도.

Claims (5)

  1. 피사체 위쪽에 배치되면서 상기 피사체를 촬상하는 촬상수단(11)과, 상기 피사체의 위쪽에 배치되면서 상기 피사체에 광을 조사하는 제 1 조명수단(12), 상기 피사체의 아래쪽에 배치되면서 상기 피사체에 광을 조사하는 제 2 조명수단(13), 상기 촬상수단(11)에 의해 촬상된 화상을 기억하는 메모리부(14a) 및 상기 화상을 논리처리하는 처리부(14b)를 갖춘 화상처리수단(14), 상기 제 1 조명수단(12)의 점등 및 소멸을 위한 전원을 공급하는 제 1 전원수단(16), 상기 제 2 조명수단(13)의 점등 및 소멸을 위한 전원을 공급하는 제 2 전원수단(17) 및, 상기 화상처리수단(14)과 상기 제 1 전원수단(16) 및 상기 제 2 전원수단(17)의 동작을 각각 제어하는 제어수단(15)을 구비하여 구성된 것을 특징으로 하는 본딩와이어의 본딩위치 검사장치.
  2. 제 1 항에 있어서, 상기 피사체는 피본딩부재상에 본딩와이어가 본딩되어 있는 물체로 이루어지고, 상기 제어수단은, 논리처리의 횟수(X)를 미리 설정하여 두기 위한 데이터 입력수단과, 상기 제 1 전원을 투입하여 상기 촬상장치(11)에 의해 상기 피사체를 촬상하는 것에 의해 피본딩부재가 제 1 명도를 갖추면서 그외의 부분이 제 2 명도를 갖춘 제 1 화상을 얻는 수단, 상기 제 2 전원을 투입하여 상기 촬상장치(11)에 의해 상기 피사체를 촬상하는 것에 의해 피본딩부재 및 본딩와이어가 상기 제 2 명도를 갖추면서 그외의 부분이 제 1 명도를 갖춘 제 2 화상을 얻는 수단, 상기 제 2 화상에 대해 3×3의 화소의 중앙에 화소를 그 주위의 8화소에서 하나라도 제 1 명도의 것을 포함하면 상기 제 1 명도로 하는 논리처리를 X회만큼 수행하여 피본딩 부재만이 제 2 명도를 갖춘 제 3 화상을 얻는 수단, 상기 제 3 화상에 대해 3×3의 화소의 중앙에 화소를 그 주위의 8화소에서 하나라도 제 2 명도의 것을 포함하면 상기 제 2 명도로 하는 논리처리를 X회만큼 수행하여 제 4 화상을 얻는 수단, 상기 제 1 화상 및 상기 제 4 화상에 대해 논리합 부정처리 또는 논리적 부정처리를 수행하여 상기 피본딩부재상의 본딩와이어만이 제 1 명도를 갖춘 제 5 화상을 얻는 수단, 상기 제 5 화상에 대해 3×3의 화소의 중앙에 화소를 그 주위의 8화소에서 하나라도 제 2 명도의 것을 포함하면 상기 제 2 명도로 하는\ 논리처리를 X회만큼 수행하여 본딩와이어의 와이어찌그러짐부분만이 제 1 명도를 갖춘 제 6 화상을 얻는 수단 및, 상기 제 6 화상에 대해 3×3의 화소의 중앙의 화소를 그 주위의 8화소에서 하나라도 제 1 명도의 것을 포함하면 상기 제 1 명도로 하는 논리처리를 X회만큼 수행하여 제 7 화상을 얻는 수단을 구비하여 구성된 것을 특징으로 하는 본딩와이어의 본딩위치 검사장치.
  3. 제 2 항에 있어서, 상기 데이터 입력수단에 의해 미리 설정되는 논리처리 횟수(X)는 상기 논리처리를 X회만큼 수행함으로써 적어도 피본딩부재상 이외에 존재하는 본딩와이어의 화상이 제 2 명도로부터 제 1 명도로 변화하여 상기 제 3 화상이 얻어지는 정도로 설정되고, 또 적어도 와이어찌그러짐부분을 제외한 본딩와이어의 화상이 제 1 명도로부터 제 2 명도로 변화하여 상기 제 6 화상이 얻어지는 정도로 설정되어 있는 것을 특징으로 하는 본딩 와이어의 본딩위치 검사위치.
  4. 제 2 항에 있어서, 상기 화상처리수단은 명(백)과 암(흑)의 2치만을 갖춘 2치화상처리장치이고, 상기 제 1 명도는 밝고, 제 2 명도는 어두우며, 상기 제 1 화상 및 상기 제 4 화상은 논리합 부정처리에 의해 제 5 화상으로 변환되는 것을 특징으로 하는 본딩와이어의 본딩위치 검사장치.
  5. 제 2 항에 있어서, 상기 화상처리수단은 명(백)과 암(흑)의 2치만을 갖춘 2치화상처리장치이고, 상기 제 1 명도는 밝고, 제 2 명도는 어두우며, 상기 제 1 화상 및 상기 제 4 화상은 논리적 부정처리에 의해 제 5 화상으로 변환되는 것을 특징으로 하는 본딩와이어의 본딩위치 검사장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930030368A 1992-12-28 1993-12-28 본딩와이어의 본딩위치 감사장치 KR970011747B1 (ko)

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JP04361243A JP3105098B2 (ja) 1992-12-28 1992-12-28 ボンディングワイヤのボンディング位置の検査装置
JP92-361243 1992-12-28

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KR970011747B1 KR970011747B1 (ko) 1997-07-15

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DE19652124C2 (de) * 1996-12-14 2002-10-17 Micronas Gmbh Verfahren und Vorrichtung zum automatischen Überprüfen von Positionsdaten j-förmiger elektrischer Kontaktanschlüsse
KR20010080190A (ko) * 1998-10-15 2001-08-22 조셉 제이. 스위니 웨이퍼 가공 장치에서 웨이퍼 파편 검출 시스템 및 방법
JP4615117B2 (ja) * 2000-11-21 2011-01-19 パナソニック株式会社 半導体ウエハへのバンプ形成方法及びバンプ形成装置
DE10146307A1 (de) * 2001-09-19 2003-05-08 Infineon Technologies Ag Verfahren zur optischen Kontrolle von Halbleiterbauelementgehäusen, Verfahren zur Herstellung des Halbleiterbauelements sowie entsprechendes Halbleiterbauelement
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US5745594A (en) 1998-04-28

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