KR940016602A - Polycrystalline Crystallization of Amorphous Silicon - Google Patents

Polycrystalline Crystallization of Amorphous Silicon Download PDF

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Publication number
KR940016602A
KR940016602A KR1019920024132A KR920024132A KR940016602A KR 940016602 A KR940016602 A KR 940016602A KR 1019920024132 A KR1019920024132 A KR 1019920024132A KR 920024132 A KR920024132 A KR 920024132A KR 940016602 A KR940016602 A KR 940016602A
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South Korea
Prior art keywords
manufacturing
thin film
amorphous silicon
chamber
load lock
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KR1019920024132A
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Korean (ko)
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김원근
손정하
한정인
김철수
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김광호
삼성전자 주식회사
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Priority to KR1019920024132A priority Critical patent/KR940016602A/en
Publication of KR940016602A publication Critical patent/KR940016602A/en

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  • Recrystallisation Techniques (AREA)
  • Thin Film Transistor (AREA)

Abstract

본 발명은 반도체장치의 제조방법에 관한 것으로, 특히 인시츄어닐방식으로 비정질실리콘을 폴리실리콘화하는 방법으로 액정표시장치의 폴리실리콘 박막트랜지스터를 형성하기 위하여 비정질실리콘을 폴리실리콘으로 변형시키는 반도체장치의 제조방법에 있어서, 멀티챔버형 로드록시스템내의 동일한 진동상태에서 소정의 기판위에 비정실리콘을 증착하는 공정과 어닐공정이 차례로 인시튜방식으로 이루어지는 것을 특징으로 한다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device, and more particularly, to a method of manufacturing polysilicon thin film transistors in an insituilil method to form polysilicon thin film transistors of a liquid crystal display device. In the manufacturing method, a process of depositing amorphous silicon on a predetermined substrate in the same vibration state in a multi-chamber-type load lock system, and an annealing process are sequentially performed in situ.

따라서 상기한 본 발명에 의하여 진공을 깨트리지 않는 동일한 로드록 챔버내에서 비정질실리콘의 증착공정과 어닐공정을 차례로 수행함으로써 비정질실리콘의 표면에 자연산화막이 성장되지 않게하여 입자의 크기가 균일하고 만족할만한 폴리실리콘을 형성시킬 수 있어, 폴리실리콘에서의 전하이동도가 향상되어 박막트랜지스터의 동작속도가 빨라지게 되며, 동작속도가 빠른 박막트랜지스터는 액정표시패널의 행과 열방향의 드라이버단, 또는 콘트롤러에 사용될 수가 있어서 액정표시패널의 폴리실리콘 박막트랜지스터를 동일 마스크 상에 설계할 수 있으므로 제조방법이 간단하고 제조비용이 저렴해지는 잇점이 있다.Therefore, according to the present invention, the deposition process of amorphous silicon and the annealing process are sequentially performed in the same load lock chamber that does not break the vacuum so that the natural oxide film is not grown on the surface of the amorphous silicon, so that the particle size is uniform and satisfactory. Since polysilicon can be formed, the charge mobility in polysilicon is improved, and the operation speed of the thin film transistor is increased, and the thin film transistor with high operation speed is applied to the driver stage or the controller in the row and column directions of the liquid crystal display panel. Since the polysilicon thin film transistor of the liquid crystal display panel can be designed on the same mask, the manufacturing method is simple and the manufacturing cost is low.

Description

비정질실리콘의 다결정화 방법Polycrystalline Crystallization of Amorphous Silicon

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제 2 도에 본 발명의 방법에 의해 비정질실리콘을 다결정화하기 위한 멀티 챔버형 로드록시스템을 나타내고 있다.2 shows a multi-chambered load lock system for polycrystallizing amorphous silicon by the method of the present invention.

Claims (4)

액정표시장치의 폴리실리콘 박막트랜지스터를 형성하기 위하여 비정질실리콘을 폴리실리콘으로 변형시키는 반도체장치의 제조방법에 있어서, 멀티챔버형 로드록시스템내의 동일한 진공상태에서 소정의 기판위에 비정질실리콘을 증착하는 공정과 어닐공정이 차례로 인시튜방식으로 이루어지는 것을 특징으로 하는 반도체장치의 제조방법.A method of manufacturing a semiconductor device that transforms amorphous silicon into polysilicon to form a polysilicon thin film transistor of a liquid crystal display device, comprising the steps of: depositing amorphous silicon on a predetermined substrate under the same vacuum in a multichamber load lock system; A method of manufacturing a semiconductor device, characterized in that the annealing step is performed in-situ in turn. 제 1 항에 있어서, 상기 반도체장치의 제조를 위한 멀티챔버형 로드록시스템은 로드록챔버를 통한 박막 증착용 챔버, 어닐 챔버 및 연속적인 박막증착이 요구되는 공정에 이용할 확장용챔버를 위한 공간을 구비하여 클러스터화하고, 챔버내의 표준화된 웨이퍼 운반용 로봇을 이용하여 동일한 진공상태의 시스템내에서 증착 및 어닐공정을 차례로 수행토록 하는 것을 특징으로 하는 반도체장치의 제조방법.The multichamber-type load lock system for manufacturing a semiconductor device according to claim 1, wherein the multi-chamber load lock system for manufacturing a semiconductor device has a space for a chamber for thin film deposition, an anneal chamber, and an expansion chamber to be used for a process requiring continuous thin film deposition through the load lock chamber. And clustering and sequentially performing deposition and annealing processes in the same vacuum system using a standardized wafer transport robot in a chamber. 제 1 항에 있어서, 상기 비정질실리콘은 저압화학기상증착, 또는 스퍼터링 방식 가운데 어느 하나를 선택적으로 이용하여 형성시키는 것을 특징으로 하는 반도체장치의 제조방법.The method of claim 1, wherein the amorphous silicon is formed by selectively using any one of low pressure chemical vapor deposition or sputtering. 제 1 항에 있어서, 상기 어닐공정은 열처리, 또는 레이저 방식 가운데 어느 하나를 선택적으로 이용하여 수행하는 것을 특징으로 하는 반도체장치의 제조방법.The method of claim 1, wherein the annealing process is performed by selectively using any one of a heat treatment and a laser method. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019920024132A 1992-12-14 1992-12-14 Polycrystalline Crystallization of Amorphous Silicon KR940016602A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100522643B1 (en) * 2001-02-22 2005-10-20 산요덴키가부시키가이샤 Method for manufacturing polycrystalline semiconductor layer, and laser annealing apparatus
KR100510001B1 (en) * 1996-05-31 2005-11-03 산요덴키가부시키가이샤 Manufacturing method of semiconductor device
US7077929B2 (en) 2003-04-29 2006-07-18 Samsung Electronics Co., Ltd. Apparatus for manufacturing a semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100510001B1 (en) * 1996-05-31 2005-11-03 산요덴키가부시키가이샤 Manufacturing method of semiconductor device
KR100522643B1 (en) * 2001-02-22 2005-10-20 산요덴키가부시키가이샤 Method for manufacturing polycrystalline semiconductor layer, and laser annealing apparatus
US7077929B2 (en) 2003-04-29 2006-07-18 Samsung Electronics Co., Ltd. Apparatus for manufacturing a semiconductor device

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