KR940010871A - Flexible film printed circuit board and manufacturing method - Google Patents

Flexible film printed circuit board and manufacturing method Download PDF

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Publication number
KR940010871A
KR940010871A KR1019920019272A KR920019272A KR940010871A KR 940010871 A KR940010871 A KR 940010871A KR 1019920019272 A KR1019920019272 A KR 1019920019272A KR 920019272 A KR920019272 A KR 920019272A KR 940010871 A KR940010871 A KR 940010871A
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KR
South Korea
Prior art keywords
flexible film
printed circuit
circuit board
manufacturing
metal material
Prior art date
Application number
KR1019920019272A
Other languages
Korean (ko)
Other versions
KR940010437B1 (en
Inventor
구본홍
Original Assignee
김주용
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 김주용, 현대전자산업 주식회사 filed Critical 김주용
Priority to KR1019920019272A priority Critical patent/KR940010437B1/en
Publication of KR940010871A publication Critical patent/KR940010871A/en
Application granted granted Critical
Publication of KR940010437B1 publication Critical patent/KR940010437B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

본 발명은 플렉시블 필름을 이용하여 인쇄회로기판을 제조하는 방법 및 그에 의해 제조된 인쇄회로기판으로, 본발명의 제조방법은 인쇄회로 기판을 제조함에 있어서, A)플렉시블 필름 일면에 금속매티리얼을 저온증착하고, B)증착된 매티리얼 위에 감광액 및 포토마스크를 이용 패턴을 형성하고, C)패턴위에 산화막을 도포하는 상기 A), B), C)의 순차공정을 적어도 1회 수행하는 제조방법이며, 또한 본 발명의 플렉시블 필름 인쇄 회로기판은 50-200μm의 플렉시블 필름에 2000-5000Å의 금속매티리얼을 증착한 다음 감광액을 이용하여 형성된 패턴이 적어도 1층 포함된 구조를 갖는 것으로, 플렉시블 필름을 이용하므로 기판이 경량 박형화가 가능해지고, 금속매티리얼을 저온증착시키므로 패턴형성의 오차가 없어 고주파 회로용으로 특히 우수하다.The present invention relates to a method for manufacturing a printed circuit board using a flexible film and a printed circuit board manufactured by the same. In the manufacturing method of the present invention, a method of manufacturing a printed circuit board includes: A) a metal material on one surface of a flexible film B) forming a pattern using a photoresist and a photomask on the deposited material, and C) applying at least one sequential process of A), B), and C) to apply an oxide film on the pattern. In addition, the flexible film printed circuit board of the present invention has a structure in which at least one layer of a pattern formed by using a photoresist is deposited after depositing a metal material of 2000-5000Å on a 50-200 μm flexible film. As a result, the substrate can be lightly thinned, and the metal material is deposited at low temperature, so that there is no error in pattern formation, which is particularly excellent for high frequency circuits.

Description

플렉시블 필름 인쇄회로 기판 및 제조방법Flexible film printed circuit board and manufacturing method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도 a)~e)는 본 발명의 제조공정도이다.1) a) to e) are manufacturing process diagrams of the present invention.

Claims (4)

인쇄회로기판을 제조함에 있어서, A)플렉시블 필름(10) 일면에 2000-5000Å의 금속매티리얼(20)을 저온 증착하고, B)증착된 금속매티리얼(20)위에 감광액(30) 및 포토마스크(40)를 이용 패턴(22)을 형성하고, C)패턴(22)위에 산화막(50)을 도포하는 상기 A), B), C)의 순차 공정을 적어도 1회 수행하여 제조됨을 특징으로 하는 플랙시블 필름 인쇄회로기판의 제조방법.In manufacturing a printed circuit board, A) a low-temperature deposition of 2000-500020 of the metal material 20 on one surface of the flexible film 10, and B) a photoresist 30 and a photomask on the deposited metal material 20. (40) is used to form a pattern 22, and C) is produced by performing at least one sequential process of the A), B), C) to apply the oxide film 50 on the pattern 22 Method of manufacturing a flexible film printed circuit board. 제1항에 있어서, 플렉시블 필름(10)은 일면과 그 이면에 상기 A), B), C) 순차공정이 각각 순차수행되며, 양면은 쓰루홀기법으로 연결되도록 제조함을 특징으로 하는 씬필름 인쇄회로기판의 제조방법.The thin film of claim 1, wherein the flexible film 10 is sequentially performed on one surface and the rear surface of the flexible film 10, and the both sides are manufactured to be connected by a through-hole method. Method of manufacturing a printed circuit board. 제1항에 있어서, 플렉시블 필름(10)은 그 이면에 A)공정에서 금속매티리얼(20)을 저온증착하고, 이어 B), C)의 순차공정이 수회 순차반복 수행하여 다층기판으로 제조함을 특징으로 하는 씬필름 인쇄회로기판의 제조방법.The method of claim 1, wherein the flexible film 10 is a low-temperature deposition of the metal material 20 on the back surface of the process A), and then the sequential process of B), C) is repeated several times to produce a multilayer substrate. Method of manufacturing a thin film printed circuit board, characterized in that. 50-200㎛의 플렉시블 필름(10)에 2000-5000Å의 금속매티리얼(20)을 증착한 다음 감광액을 이용 형성된 패턴(22)이 적어도 1층 포함된 구조를 가짐을 특징으로 하는 플렉시블 필름 인쇄회로기판.Flexible film printed circuit characterized by having a structure including at least one layer of a pattern 22 formed by using a photoresist after depositing a metal material 20 of 2000-5000 에 on a 50-200 μm flexible film 10. Board. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019920019272A 1992-10-20 1992-10-20 Flexible film pcb and manufacturing method thereof KR940010437B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019920019272A KR940010437B1 (en) 1992-10-20 1992-10-20 Flexible film pcb and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019920019272A KR940010437B1 (en) 1992-10-20 1992-10-20 Flexible film pcb and manufacturing method thereof

Publications (2)

Publication Number Publication Date
KR940010871A true KR940010871A (en) 1994-05-26
KR940010437B1 KR940010437B1 (en) 1994-10-22

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920019272A KR940010437B1 (en) 1992-10-20 1992-10-20 Flexible film pcb and manufacturing method thereof

Country Status (1)

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KR (1) KR940010437B1 (en)

Also Published As

Publication number Publication date
KR940010437B1 (en) 1994-10-22

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