KR940008679U - 수직 실장형 패키지 - Google Patents

수직 실장형 패키지

Info

Publication number
KR940008679U
KR940008679U KR2019920016695U KR920016695U KR940008679U KR 940008679 U KR940008679 U KR 940008679U KR 2019920016695 U KR2019920016695 U KR 2019920016695U KR 920016695 U KR920016695 U KR 920016695U KR 940008679 U KR940008679 U KR 940008679U
Authority
KR
South Korea
Prior art keywords
mount package
vertical mount
vertical
package
mount
Prior art date
Application number
KR2019920016695U
Other languages
English (en)
Other versions
KR0126660Y1 (ko
Inventor
손해정
김준식
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR92016695U priority Critical patent/KR0126660Y1/ko
Publication of KR940008679U publication Critical patent/KR940008679U/ko
Application granted granted Critical
Publication of KR0126660Y1 publication Critical patent/KR0126660Y1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
KR92016695U 1992-09-02 1992-09-02 수직 실장형 패키지 KR0126660Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR92016695U KR0126660Y1 (ko) 1992-09-02 1992-09-02 수직 실장형 패키지

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR92016695U KR0126660Y1 (ko) 1992-09-02 1992-09-02 수직 실장형 패키지

Publications (2)

Publication Number Publication Date
KR940008679U true KR940008679U (ko) 1994-04-21
KR0126660Y1 KR0126660Y1 (ko) 1998-10-01

Family

ID=19339491

Family Applications (1)

Application Number Title Priority Date Filing Date
KR92016695U KR0126660Y1 (ko) 1992-09-02 1992-09-02 수직 실장형 패키지

Country Status (1)

Country Link
KR (1) KR0126660Y1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990000698A (ko) * 1997-06-10 1999-01-15 윤종용 고방열 구조를 갖는 반도체 패키지

Also Published As

Publication number Publication date
KR0126660Y1 (ko) 1998-10-01

Similar Documents

Publication Publication Date Title
NO931286D0 (no) Foeringsroer-pakker
DE69326579D1 (de) Verpackungsstruktur
DE69332140D1 (de) Leiterrahmen-Kondensator
DE69303633D1 (de) Mehrchipmodul
FI944885A0 (fi) Tölkin perusosa
DE4394393T1 (de) Kühlkörper
DE69323915D1 (de) Klammeranordnung
FI934591A0 (fi) Vertikal formsprutmaskin
DE69322140D1 (de) Halbleiterpackung
DE59305563D1 (de) Mehrchipmodul
ATE162775T1 (de) Schwingfördereinrichtung
BR7300983U (pt) Container
KR940008679U (ko) 수직 실장형 패키지
DE69308628D1 (de) Klammer
KR950016109U (ko) 수직 실장 패키지
NO931249D0 (no) Ledekjegle-lysinnretning
DE59308065D1 (de) Verpackung
ATA193592A (de) Verpackung
KR940006479U (ko) 멀티 칩 패키지
KR940011118U (ko) 리드온칩 패키지
KR930024367U (ko) 반도체 패키지
KR940013675U (ko) 반도체 패키지
SE9200832L (sv) Förpackning
NO933608D0 (no) Forpakning
SE9301881L (sv) Förpackning

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20060630

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee