KR940006081Y1 - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- KR940006081Y1 KR940006081Y1 KR2019910011298U KR910011298U KR940006081Y1 KR 940006081 Y1 KR940006081 Y1 KR 940006081Y1 KR 2019910011298 U KR2019910011298 U KR 2019910011298U KR 910011298 U KR910011298 U KR 910011298U KR 940006081 Y1 KR940006081 Y1 KR 940006081Y1
- Authority
- KR
- South Korea
- Prior art keywords
- lead wire
- electronic component
- component body
- insulating case
- lead
- Prior art date
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 45
- 238000009413 insulation Methods 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 239000003990 capacitor Substances 0.000 description 9
- 238000005476 soldering Methods 0.000 description 7
- 238000007789 sealing Methods 0.000 description 5
- 238000002788 crimping Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000012999 compression bending Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
내용 없음.No content.
Description
제1도는 본 고안에 따른 전자부품의 사시도.1 is a perspective view of an electronic component according to the present invention.
제2도는 본 고안에 따른 전자부품의 정단면도.Figure 2 is a front sectional view of the electronic component according to the present invention.
제3도는 본 고안에 따른 전자부품의 일부를 절개하여 나타낸 측면도.Figure 3 is a side view showing a part of the electronic component in accordance with the present invention.
제4도는 본 고안에 다른 절연케이스의 수용전의 전자부품본체의 사시도.4 is a perspective view of an electronic component body before accommodating an insulation case according to the present invention.
제5도는 종래의 리드리스 칩(leadless chip)형, 알루미늄 전해콘덴서의 사시도.5 is a perspective view of a conventional leadless chip type aluminum electrolytic capacitor.
제6도는 알루미늄 전해콘덴서의 리드선 단면도.6 is a cross-sectional view of a lead wire of an aluminum electrolytic capacitor.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1e : 절곡부 3 : 절연케이스1e: bend portion 3: insulated case
3a : 탄성지지부 3b : 돌출부3a: elastic support 3b: protrusion
3d : 리드선 밀착부 3e : 중간바닥체3d: Lead wire contact portion 3e: Middle bottom body
3f : 오목부3f: recess
본 고안은 전자부품에 관한 것으로, 보다 상세하게는 인쇄회로 기판상에의 실장이 용이하도록 절연케이스를 사용하여 전자부품 본체를 지지 및 보호하도록 된 리드리스 칩(leadless chip)형 알루미늄 전해콘덴서에 관한 것이나 이러한 구조는 리드리드 칩형 알루미늄 전해콘덴서 뿐만 아니라 기타의 전자부품에 대해서도 동일하게 적용되는 것이다.The present invention relates to an electronic component, and more particularly, to a leadless chip type aluminum electrolytic capacitor which supports and protects an electronic component body using an insulating case to facilitate mounting on a printed circuit board. However, this structure is equally applicable to lead-lead chip type aluminum electrolytic capacitors as well as other electronic components.
일반적으로 이러한 종류의 리드리스 칩형 알루미늄 전해콘덴서는 제2도에서 나타낸 바와 같이 고순도 알루미늄박을 전기화학적으로 에칭(etching)한 후, 양극산화를 행하여 유전체 산화피막을 형성하여 만든 양극박과 에칭만을 행한 음극 알루미늄박과의 사이에 절연지를 넣어 감은 다음, 이 감은 물체에 음극 전기성을 띄게되는 구동용 전해액을 함침하여 구성시킨 콘덴서소자(1a)에 봉구부재(1b)를 장착하여 금속케이스(1c)의 개구부를 통하여 삽입한 후 봉입 가공하여 형성된 전자부품본체(1)에서 리드선(1d)을 인출한 면에 관통구멍(도시하지 않음)과 오목부(2a)를 가지는 절연판(2)을 밀착시켜 상기 절연판(2)의 관통구멍을 통해 인출된 리드선(1d)의 선단부를 압착 가공한 후 상기 절연판(2)의 오목부(2a)내에 절곡 가공하여 밀착시킨 구조로 되어 있으며, 이러한 전자부품은 제5도의 절연판(2)의 오목부(2a)에 압착 절곡된 리드선(1d)에의 납땜공정을 통하여 각종 전자기기의 인쇄회로 기판위에 장착된다.In general, this type of leadless chip type aluminum electrolytic capacitor is electrochemically etched from a high purity aluminum foil as shown in FIG. 2, followed by anodization to form only a dielectric foil to form a dielectric oxide film. Insulating paper is wrapped between the aluminum foil and the cathode, and then the sealing member 1b is attached to the capacitor element 1a formed by impregnating the wound object with a driving electrolyte that exhibits negative electrical conductivity. The insulating plate 2 having the through hole (not shown) and the concave portion 2a is brought into close contact with the surface from which the lead wire 1d is drawn out of the electronic component body 1 formed by inserting through the opening of the opening and sealing. The end portion of the lead wire 1d drawn out through the through hole of the insulating plate 2 is crimped, and then bent into the concave portion 2a of the insulating plate 2 to be in close contact. The electronic component is mounted on a printed circuit board of various electronic devices through the soldering process by the compression bending the lead wires (1d) in the recess (2a) of the fifth degree insulating plate (2).
이러한 리드리스 칩형 알루미늄 전해콘덴서는 제5도에서와 같이 절연판(2)전자부품본체(1)의 리드선(1d)을 인출한 면에 맞닿아 있기 때문에 납땜공정시 플럭스(flux)와 용융된 납이 모세관형상에 의하여 절연판(2)의 관통구멍을 따라 올라가 전자부품본체(1)의 봉구부재를 손상시킬 뿐만 아니라 양극단자와 음극단자 간의 단락 작용(short)을 일으키게 하여 콘덴서로써의 기능을 마비시킬 우려가 많으며, 절연판(2)의 관통구멍을 통해 인출된 리드선(1d)을 압착하여 편평하게 가공한 후 절곡함으로서 리드선(1d)의 압착부분과 절곡부분간의 강도가 약화되게 됨과 동시에 리드선(1d)의 압착가공으로 인하여 제6도와 같이 리드선(1d)의 납땜성향상을 위하여 철(1d1) 및 구리(1d2)의 적층체 표면상에 원래 피복되어 있던 납과 주석의 합금성분(1d3)의 변형으로 납땜성에 문제가 발생되어 세트(set)장착후 외부로부터의 충격 및 진동으로 인한 전자부품본체(1)의 탈락우려가 많으며, 또한 제5도에서의 전자 부품본체(1)는 절연판(2)에 의해 리드선(1d)의 인출 면부분만이 보호되고 있기 때문에 구동시 음극전기성을 띄게 되는 전자부품본체(1)의 금속케이스(1c) 측면과 외부회로와의 접촉 및 손상으로 인한 절연파괴의 우려가 많고, 또한 전자부품본체(1)와 절연판(2)이 압착절곡된 리드선만으로 밀착되어있기 때문에 전자부품본체(1)와 절연판이 서로로부터 떨어질 우려가 많다.Since the leadless chip-type aluminum electrolytic capacitor is in contact with the lead wire 1d of the insulating plate 2 and the electronic component body 1 as shown in FIG. 5, flux and molten lead are prevented during the soldering process. The capillary shape rises along the through-hole of the insulating plate 2 and not only damages the sealing member of the electronic component body 1, but also causes a short circuit between the positive electrode terminal and the negative electrode terminal, thereby paralyzing the function of the capacitor. There are many, and the lead wire 1d drawn out through the through hole of the insulating plate 2 is crimped to be flat and then bent to reduce the strength between the crimped portion and the bent portion of the lead wire 1d and at the same time, Due to the crimping process, soldering is performed by deformation of the alloy component 1d3 of lead and tin, which was originally coated on the surface of the laminate of iron 1d1 and copper 1d2 to improve the soldering property of the lead wire 1d as shown in FIG. Door to the castle There is a lot of concern that the electronic component main body 1 may fall off due to shock and vibration from the outside after the set is installed, and the electronic component main body 1 in FIG. Since only the surface of the lead surface of 1d) is protected, there is a risk of insulation breakdown due to contact and damage of the metal case (1c) side of the electronic component body (1), which exhibits negative electrical conductivity during operation, and external circuits. In addition, since the electronic component body 1 and the insulating plate 2 are brought into close contact with only the crimped lead wires, the electronic component body 1 and the insulating plate are likely to fall from each other.
따라서 본 고안의 목적은 납땜성의 향상과 함께 전자부품본체와 절연판간의 이탈방지, 납땜후의 기판으로부터의 탈락방지, 전자제품본체와 외부회로와의 접촉 및 손상 등을 방지할 수 있는 전자부품을 제공하는데 있다.Accordingly, an object of the present invention is to provide an electronic component capable of preventing the detachment between the electronic component body and the insulating plate, preventing falling off of the board after soldering, and contact and damage between the electronic product body and an external circuit together with improvement of solderability. have.
본 고안은 상기와 같은 목적을 달성하기 위하여 리드선의 소정부위에 돌기형 절곡부를 형성시킨 전자부품본체를 절연케이스의 내측 수용공간으로 삽입시키되 상기 절연케이스의 측면상에 형성된 탄성지지부의 내측벽 소정부위에 형성시킨 돌출부에 상기 전자부품본체의 소정부위가 걸리도록 하여 상기 전자부품본체의 리드선 인출면과 상기 절연케이스 내측 바닥면간에 소정 폭만큼의 간격이 형성되도록 하고, 상기 탄성지지부의 단부에, 내측면이 상기 졀연케이스 내측 바닥면과 동일 평면을 이루도록 연결 형성시킨 리드선 밀착부의 단부와 상기 절연케이스의 내측 바닥면을 형성하는 중간바닥체의 단부간에 형성된 틈새로 돌출시킨 상기 전자부품본체의 리드선을 상기 리드선 밀착부에 밀착시킨 후 상기 탄성지지부 및 리드선 밀착부간의 모서리부위에 형성시킨 리드선고정용 오목부상에 상기 리드선의 선단부를 절곡 고정시키도록 한 것이다.In order to achieve the above object, the present invention inserts an electronic component body having a protrusion-shaped bent portion at a predetermined portion of a lead wire into an inner receiving space of an insulating case, and a predetermined portion of an inner wall of an elastic support portion formed on a side surface of the insulating case. A predetermined portion of the electronic component main body is to be caught by a protrusion formed on the inner surface of the electronic component main body so that a predetermined width is formed between the lead wire lead-out surface of the electronic component main body and the inner bottom surface of the insulating case. A lead wire of the electronic component main body protruding into a gap formed between an end portion of the lead wire contact portion formed to have a side surface coplanar with the inner bottom surface of the insulation case and an end portion of the intermediate bottom body forming the inner bottom surface of the insulating case; The edge between the elastic support part and the lead wire contact part after closely contacting the lead wire contact part The leading end of the lead wire is bent and fixed on the lead wire fixing recess formed in the site.
이러한 본 고안을 첨부시킨 예시도면을 참고로 하여 상세히 설명하면 다음과 같다.When described in detail with reference to the exemplary drawings attached to the present invention as follows.
제1도는 본 고안에 따른 전자부품의 사시도, 제2도는 정단면도, 제3도는 본 고안에 따른 전자부품의 일부를 절개하여 나타낸 측면도, 그리고 제4도는 본 고안에 따른 절연케이스에의 수용전의 전자부품본체의 사시도로서 양 리드선(1d)의 소정부위에 돌기형 절곡부(1e)를 형성시킨 전자부품본체(1)를 상기 리드선(1d)의 인출면(1f)축부터 통형(통形) 절연케이스(3)의 상면 개구부를 통해 내측 수용공간으로 삽입시킨뒤 상기 절연케이스(3)의 양측면상에 형성된 탄성지지부(3a)의 내측벽 소정부위에 형성시킨 돌출부(3b)와 상기 전자부품본체(1)의 외주면상의 내용물 누설방지용 압착홈(1g)이 서로 맞물리도록 하여 상기 전자부품본체(1)의 리드선인출면(1f)과 상기 절연케이스(3)의 내측 바닥면(3c)간에 소정폭만큼의 간격(d)이 형성하되도록 하고, 상기 탄성지지부(3a)의 단부에, 내측면이 상기 절연케이스(3)의 내측 바닥면(3c)과 동일 평면을 이루도록 연결 형성시킨 양 리드선 밀착부(3d)의 단부와 상기 절연케이스(3)의 내측 바닥면(3c)을 형성하는 중간바닥체(3e)의 양 단부간에 형성된 틈새로 돌출시킨 상기 전자부품본체(1)의 각 리드선(1d)을 소정길이만큼 자른 다음 각 측면 외측방향으로 절곡하여 상기 각 리드선 밀착부(3d)에 밀착시킨 후 상기 양 탄성지지부(3a) 및 리드선 밀착부(3d)간의 모서리 부위에 형성시킨 리드선고정용 오목부(3f)상에 상기 각 리드선(1d)의 선단부를 절곡고정시키도록 한 것이다.1 is a perspective view of an electronic component according to the present invention, FIG. 2 is a front sectional view, FIG. 3 is a side view showing a part of the electronic component according to the present invention, and FIG. 4 is an electron before accommodating the insulating case according to the present invention. The electronic component body 1 in which the projection-shaped bent portion 1e is formed at predetermined portions of both lead wires 1d as a perspective view of the component body is cylindrical insulated from the lead surface 1f axis of the lead wire 1d. The protrusion 3b and the electronic component body which are inserted into the inner accommodating space through the upper opening of the case 3 and formed on predetermined portions of the inner wall of the elastic support 3a formed on both sides of the insulating case 3. The leakage leakage crimping grooves 1g on the outer circumferential surface of 1) are engaged with each other by a predetermined width between the lead wire lead-out surface 1f of the electronic component body 1 and the inner bottom surface 3c of the insulating case 3. The gap d is to be formed, the elastic support (3a) At the end portions of the lead wire contact portions 3d and the inner bottom surface 3c of the insulating case 3, the inner surface of which is formed so as to be coplanar with the inner bottom surface 3c of the insulating case 3. Cut each lead wire 1d of the electronic component body 1 protruded by a gap formed between both ends of the intermediate bottom body 3e forming a predetermined length by a predetermined length, and then bend outwards to each side to form a contact portion (3d) to bend and fix the leading end of each lead wire (1d) on the lead wire fixing recess (3f) formed at the corner portion between the two elastic support portions (3a) and the lead wire contact portion (3d). It is.
도면부호중 3g는 극성 표시부이다.3g in the drawing is a polarity indicator.
제1도 내지 제4도에서 나타낸 바와 같이 절연케이스(3)의 양측면상에 형성된 탄성지지부(3a)의 내측 벽 소정부위에 형성시킨 돌출부(3b)와 전자부품본체(1)의 외주면상의 내용물 누설방지용 압착홈(1g)이 서로 맞물리도록 하여 상기 전자부품본체(1)의 리드선 인출면(1f)과 상기 절연케이스(3)의 내측 바닥면(3c)간에 소정 폭만큼의 간격(d)이 형성되도록 함으로써 인쇄회로기판에 장착시키기 위한 납땜고정시 플럭스와 용융된 납이 상기 절연케이스(3)의 양리드선 밀착부(3d)의 단부와 중간바닥체(3e)의 양 단부간에 형성된 틈새를 타고 올라가더라도 상기 전자부품본체(1)의 봉구부재(1b)까지는 미치지 않게되어 상기 플럭스와 용융된 납에 의한 상기 봉구부재(1b)의 손상 및 양극단자와 음극단자간의 단락 등을 방지할 수 있게 되며, 리드선(1d)의 납땝부위를 압착하지 않고 돌기형태로 절곡가공하여 납땜부위의 표면적을 넓힘으로써 종래의 경우에서와 같은 리드선(1d)의 강도저하 및 납땜불량 등으로 인한 전자부품본체(1)의 탈락을 방지할 수 있게 되고, 또한 절연케이스(3)를 통형태(筒形態)로 구성하여 전자부품본체(1)가 상기 절연케이스(3)의 내측 수용공간에 수용되도록 함으로써 전자부품본체(1)와 외부회로와의 접촉 및 손상으로 인한 절연파괴의 위험성 등을 방지할 수 있게 된다.As shown in FIGS. 1 to 4, the protrusion 3b formed on a predetermined portion of the inner wall of the elastic support 3a formed on both sides of the insulating case 3 and the contents leakage on the outer circumferential surface of the electronic component body 1 are shown. A gap d of a predetermined width is formed between the lead wire lead surface 1f of the electronic component body 1 and the inner bottom surface 3c of the insulating case 3 so that the prevention crimping grooves 1g are engaged with each other. The flux and the molten lead during the fixing of the solder to be mounted on the printed circuit board rise up the gap formed between the ends of both lead wire contact portions 3d of the insulating case 3 and the ends of the intermediate bottom body 3e. Even if it does not extend to the sealing member (1b) of the electronic component body 1, it is possible to prevent damage to the sealing member (1b) and short circuit between the positive electrode terminal and the negative electrode terminal by the flux and molten lead, Crimp the lead wires of the lead wire 1d It is possible to prevent the electronic component body 1 from falling off due to the deterioration of the strength of the lead wire 1d and the poor soldering, as in the conventional case, by increasing the surface area of the soldering portion by bending it in the form of a protrusion. The insulating case 3 is formed in a cylindrical shape so that the electronic component body 1 is accommodated in the inner accommodating space of the insulating case 3, thereby contacting and damaging the electronic component body 1 with an external circuit. It is possible to prevent the risk of insulation breakdown.
이러한 본 고안은 리드리스 칩형 알루미늄 전해콘덴서 뿐만 아니라 기타의 전자부품에 대해서도 적용된다.This invention is applied to leadless chip type aluminum electrolytic capacitors as well as other electronic components.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019910011298U KR940006081Y1 (en) | 1991-07-19 | 1991-07-19 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019910011298U KR940006081Y1 (en) | 1991-07-19 | 1991-07-19 | Electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR930003514U KR930003514U (en) | 1993-02-26 |
| KR940006081Y1 true KR940006081Y1 (en) | 1994-09-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019910011298U KR940006081Y1 (en) | 1991-07-19 | 1991-07-19 | Electronic device |
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| Country | Link |
|---|---|
| KR (1) | KR940006081Y1 (en) |
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1991
- 1991-07-19 KR KR2019910011298U patent/KR940006081Y1/en not_active IP Right Cessation
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| Publication number | Publication date |
|---|---|
| KR930003514U (en) | 1993-02-26 |
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