JPS62186519A - Electronic parts - Google Patents
Electronic partsInfo
- Publication number
- JPS62186519A JPS62186519A JP2920986A JP2920986A JPS62186519A JP S62186519 A JPS62186519 A JP S62186519A JP 2920986 A JP2920986 A JP 2920986A JP 2920986 A JP2920986 A JP 2920986A JP S62186519 A JPS62186519 A JP S62186519A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- electronic component
- insulating plate
- conductor
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 description 21
- 229910052782 aluminium Inorganic materials 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000011888 foil Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Conductive Materials (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
２ 人
産業上の利用分野
本発明は電子部品に関するものであり、さらに詳しく言
えば、いわゆるリードレスの電子部品に関するものであ
る。以下の説明においてはアルミ電解コンデンサについ
て詳細に説明するが、本発明はアルミ電解コンデンサに
限定されるものではなく、他の電子部品についても全く
同様である。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to electronic components, and more particularly to so-called leadless electronic components. In the following description, aluminum electrolytic capacitors will be explained in detail, but the present invention is not limited to aluminum electrolytic capacitors, and the same applies to other electronic components.
従来の技術
従来のこの種のリードレスアルミ電解コンデンサは第４
図に示すように部品素子１１をケース１２内に収納する
ことにより構成されかつ前記部品素子１１に接続したリ
ード線１３を同一端面より引出してなる電子部品本体と
、この電子部品本体のリード線１３を引出した端面に当
接するように配設されかつ前記リード線１３が貫通する
貫通孔１４を備えた絶縁板１６とで構成し、前記絶縁板
１５の外表面に前記貫通孔１４につながる四部１θを設
け、かつ前記貫通孔１４を貫通したリード線１３の先端
部１３１Ｌを前記凹部１６内に収まるように折曲したも
のであった。Conventional technology This type of conventional leadless aluminum electrolytic capacitor is
As shown in the figure, an electronic component main body is constructed by housing a component element 11 in a case 12 and has lead wires 13 connected to the component element 11 drawn out from the same end surface, and a lead wire 13 of the electronic component main body. an insulating plate 16 provided with a through hole 14 that is disposed so as to come into contact with the end surface of the lead wire 13 and through which the lead wire 13 passes; was provided, and the tip 131L of the lead wire 13 that passed through the through hole 14 was bent so as to fit within the recess 16.
３ぺ−
発明が解決しようとする問題点
このようなリードレスのチップアルミ電解コンデンサは
、コンデンサ本体より引出した偏平状のリード線１３を
引出した端面に当接するように配設されかつリード線１
３が貫通する貫通孔１４を備えた絶縁板１５の外表面に
設けた四部１６内に収壕るよう折曲している。Page 3 - Problems to be Solved by the Invention Such a leadless chip aluminum electrolytic capacitor is arranged so that the flat lead wire 13 drawn out from the capacitor body comes into contact with the end surface thereof, and the lead wire 1
3 is bent so as to fit within a four part 16 provided on the outer surface of an insulating plate 15 provided with a through hole 14 passing through.
ところが、上記偏平状リード線１３を絶縁板１５に設け
た凹部１６内に収めるよう折曲すると、偏平状リード線
１３のみが電極となるため、電極面積が小さくなりコン
デンサをプリント基板に面実装する工程において、プリ
ント基板電極面とプリント基板電極面との位置決めが困
難になり、各電極面の接触面が少ないため、各電極相互
間に付着する溶融ハンダ量が少なくなるものが発生して
いる。However, when the flat lead wire 13 is bent to fit into the recess 16 provided in the insulating plate 15, only the flat lead wire 13 becomes an electrode, so the electrode area becomes smaller and the capacitor cannot be surface mounted on the printed circuit board. In the process, it becomes difficult to position the printed circuit board electrode surfaces and the contact surface between each electrode surface is small, resulting in a decrease in the amount of molten solder adhering between each electrode.
このように各電極面間のハンダ付着量が少ない状態でセ
ットに組み込まれると、取付強度的に弱くなりコンデン
サが脱落する危険性も考えられるものであった。If the capacitor is assembled into a set with a small amount of solder adhesion between each electrode surface, the mounting strength will be weakened and there is a risk that the capacitor may fall off.
問題点を解決するだめの手段
本発明はこのような問題点を解決するだめの手段として
、絶縁板の外表面の構造を改善するものであり、コンデ
ンサのリード線とプリント基板電極面とがずれても、絶
縁板の外表面が電極面になるように絶縁板のリード線貫
通孔内面及び貫通孔につながるように絶縁板外表面に導
電体をインサート成形したものである。As a means to solve the problem, the present invention improves the structure of the outer surface of the insulating plate, and prevents misalignment between the capacitor lead wire and the printed circuit board electrode surface. In this case, a conductor is insert-molded on the outer surface of the insulating plate so that the outer surface of the insulating plate becomes an electrode surface and is connected to the inner surface of the lead wire through-hole of the insulating plate and the through-hole.
作用
上記のように絶縁板の外表面に導電体をインサート成形
することで、プリント基板へ実装を行っても、絶縁板の
外表面が電極面であるため、プリント基板の電極面との
位置ズレが発生しても、コンデンサ電極面が広いため、
コンデンサをプリント基板にハンダ付実装する工程で溶
融したハンダが絶縁板のインサート成形した導電体部に
付着１２、絶縁板自体がハンダで覆われるため、前記問
題点が解消できる。Effect By insert-molding a conductor on the outer surface of the insulating board as described above, even if it is mounted on a printed circuit board, the outer surface of the insulating board is the electrode surface, so there is no misalignment with the electrode surface of the printed circuit board. Even if this happens, because the capacitor electrode surface is wide,
In the process of soldering and mounting the capacitor on a printed circuit board, the melted solder adheres to the insert-molded conductor portion 12 of the insulating plate, and the insulating plate itself is covered with solder, so that the above-mentioned problem can be solved.
実施例
以下、本発明の一実施例を第１図〜第３図の図面を用い
て説明する。EXAMPLE Hereinafter, an example of the present invention will be explained using the drawings of FIGS. 1 to 3.
６ベー／
図において、１はコンデンサ素子であり、高純度アルミ
ニウム箔を電気化学的に粗面化し、その後陽極酸化を行
って誘電体酸化皮膜を形成してなる陽極箔と、粗面化し
た陰極アルミニウム箔とを間に絶縁紙を介して巻回し、
そしてその巻回物に駆動用電解液を含浸することにより
構成されている。このコンデンサ素子１は有底筒状の金
属ケース２内に収納されている。寸だ、前記コンデンサ
素子１の陽極箔と陰極箔とにはリード線４が接続されて
いる。6B / In the figure, 1 is a capacitor element, which consists of an anode foil made by electrochemically roughening a high-purity aluminum foil and then anodizing it to form a dielectric oxide film, and a roughened cathode. Wrap around aluminum foil with insulating paper in between.
It is constructed by impregnating the wound material with a driving electrolyte. This capacitor element 1 is housed in a cylindrical metal case 2 with a bottom. A lead wire 4 is connected to the anode foil and the cathode foil of the capacitor element 1.
そして、金属ケース２の開放端は、弾性体３＆と非弾性
体３ｂとの二層構造からなる封口部材３を装着し、絞り
加工を施こすことにより封口されており、これにより電
子部品本体が構成されている。また、前記コンデンサ素
子１に接続したリード線４は、封口部材３を貫通して同
一端面より外部に引出されている。The open end of the metal case 2 is sealed by attaching a sealing member 3 having a two-layer structure of an elastic body 3& and an inelastic body 3b, and performing a drawing process, thereby sealing the electronic component body. It is configured. Further, the lead wire 4 connected to the capacitor element 1 passes through the sealing member 3 and is drawn out from the same end surface.
５は電子部品本体のリード線４を引出した端面に当接す
るように配設した絶縁板であり、この絶縁板６の外表面
には、２つの電気的に絶縁された６ベー。Reference numeral 5 denotes an insulating plate disposed so as to be in contact with the end surface from which the lead wire 4 of the electronic component main body is drawn out, and on the outer surface of this insulating plate 6, there are two electrically insulated 6 bases.
銅、鉄などのハンダ付可能な金属よりなる導電体６．７
がインサート成形によって設けられている。Conductor 6.7 made of solderable metals such as copper and iron
is provided by insert molding.
そして、この絶縁板５および導電体６，７には」−記リ
ード線４を貫通させる貫通孔８が設けられ、しかもこの
貫通孔８は電子部品本体側から外表面側に向って徐々に
小さくなるようなテーパ状孔となっており、導電体６．
７に設けられる貫通孔部の外表面側はリード線４の径ま
たは幅より小さくなるように形成されている。The insulating plate 5 and the conductors 6 and 7 are provided with a through hole 8 through which the lead wire 4 passes, and the through hole 8 gradually becomes smaller from the electronic component body side to the outer surface side. It has a tapered hole so that the conductor 6.
The outer surface side of the through hole portion provided in 7 is formed to be smaller than the diameter or width of lead wire 4 .
したがって、電子部品本体の端面にリード線４を突出さ
せた状態で絶縁板６を組込み、リード線４を貫通孔８に
圧入すれば、個々のリード線４が導電体６，７に電気的
に接続されることになる。Therefore, if the insulating plate 6 is assembled with the lead wires 4 protruding from the end surface of the electronic component body, and the lead wires 4 are press-fitted into the through holes 8, the individual lead wires 4 can be electrically connected to the conductors 6, 7. It will be connected.
また、絶縁板６と電子部品本体との結合には接着剤を用
いて補強することができ、しかもプリント基板に面実装
するときにハンダが貫通孔８に入りこんでリード線４と
導電体６．７との接続をより確実なものとする。Further, the connection between the insulating plate 6 and the electronic component main body can be reinforced using an adhesive, and when surface-mounting on a printed circuit board, solder may enter the through hole 8 and connect the lead wire 4 and the conductor 6. 7 to make the connection more reliable.
また、第３図に示すようにリード線４と絶縁板６の貫通
孔８の間及びインサート成形した導電体γ ・＼−。Further, as shown in FIG. 3, there is a conductor γ.
６，７に溶融ハンダが付き絶縁板全体にハンダが付くこ
とになる。Molten solder is applied to 6 and 7, and the entire insulating plate is soldered.
発明の効果
以上のように本発明の電子部品によれば、インサート成
形１〜た導電体を有する絶縁板を用い、この導電体にリ
ード線を固定させ導電体全体が電極面になるだめコンデ
ンサをプリント基板に実装する工程において、絶縁板外
表面全体にハンダが回り、取付強度の向上が図られると
共に、コンデンサ脱落の問題解消が可能となる。さらに
、電極面が広いことによりプリント基板電極面への位置
決めが安易になり、マウント機の動作の簡略化が計れる
。さらにリード線が絶縁板表面に突出していないため、
実装する際に傾きやぐらつきの防止、及び製品高さの短
縮化なども可能となる。Effects of the Invention As described above, according to the electronic component of the present invention, an insulating plate having an insert-molded conductor is used, and a lead wire is fixed to the conductor so that the entire conductor becomes an electrode surface. In the process of mounting on a printed circuit board, the solder spreads over the entire outer surface of the insulating plate, improving the mounting strength and solving the problem of capacitors falling off. Furthermore, since the electrode surface is wide, positioning on the printed circuit board electrode surface is easy, and the operation of the mounting machine can be simplified. Furthermore, since the lead wires do not protrude from the surface of the insulating plate,
It is also possible to prevent tilting and wobbling during mounting, and to shorten the product height.
第１図は本発明の実施例によるリードレスアルミ電解コ
ンデンサを示す半断面正面図、第２図同要部の拡大断面
図、第３図は同コンデンサを示す斜視図、第４図は従来
のリードレスアルミ電解コ正能
ンデンサを示す半一断面図である。
１・・・・・・コンデンサ素子、２・・・・・・金属ケ
ース、３・・・・・・封口部材、３ａ ・・・・弾性体
、３ｂ・・・・・・非弾性体、４・・・・・リード線、
５・・・・・・絶縁板、６．７・・・・・・導電体、８
・・・・・・貫通孔。
代理人の氏名 弁理上 中 尾 敏 男 ほか１名第３
図
第４図FIG. 1 is a half-sectional front view showing a leadless aluminum electrolytic capacitor according to an embodiment of the present invention, FIG. 2 is an enlarged sectional view of the main parts, FIG. 3 is a perspective view of the capacitor, and FIG. 4 is a conventional leadless aluminum electrolytic capacitor. FIG. 2 is a half cross-sectional view showing a leadless aluminum electrolytic capacitor. 1... Capacitor element, 2... Metal case, 3... Sealing member, 3a... Elastic body, 3b... Inelastic body, 4 ·····Lead,
5... Insulating plate, 6.7... Conductor, 8
......Through hole. Name of agent: Toshio Nakao and 1 other person (No. 3)
Figure 4
Claims (2)
れ、かつ前記部品素子に接続したリード線を同一端面よ
り引出してなる電子部品本体と、この電子部品本体のリ
ード線を引出した端面に当接するように配設され、かつ
前記リード線を貫通する貫通孔を備えた絶縁板とで構成
し、前記絶縁板の外表面にインサート成形により互いに
電気的に絶縁された導電体を施し、前記導電体をも貫通
した貫通孔にリード線の先端部を挿入し、リード線と導
電体が電気的に接続されるように固定したことを特徴と
する電子部品。(1) An electronic component body constructed by housing a component element in a case and having lead wires connected to the component element drawn out from the same end face, and an end face of the electronic component body from which the lead wire is drawn out. an insulating plate disposed in contact with each other and having a through hole passing through the lead wire, and a conductor that is electrically insulated from each other is applied to the outer surface of the insulating plate by insert molding, An electronic component characterized in that the tip of a lead wire is inserted into a through hole that also penetrates the body, and the lead wire and the conductor are fixed so as to be electrically connected.
で構成された封口部材を有していることを特徴とする特
許請求の範囲第１項記載の電子部品。(2) The electronic component according to claim 1, wherein the electronic component main body has a sealing member made of a rubber-like elastic body and a non-rubber-like elastic body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2920986A JPS62186519A (en) | 1986-02-13 | 1986-02-13 | Electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2920986A JPS62186519A (en) | 1986-02-13 | 1986-02-13 | Electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62186519A true JPS62186519A (en) | 1987-08-14 |
Family
ID=12269802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2920986A Pending JPS62186519A (en) | 1986-02-13 | 1986-02-13 | Electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62186519A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5880926A (en) * | 1996-04-19 | 1999-03-09 | Nichicon Corporation | Electronic device with mounting structure |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6110298A (en) * | 1984-06-25 | 1986-01-17 | 日本ケミコン株式会社 | Method of producing leadless electronic part |
-
1986
- 1986-02-13 JP JP2920986A patent/JPS62186519A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6110298A (en) * | 1984-06-25 | 1986-01-17 | 日本ケミコン株式会社 | Method of producing leadless electronic part |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5880926A (en) * | 1996-04-19 | 1999-03-09 | Nichicon Corporation | Electronic device with mounting structure |
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