JP3482507B2 - Electronic component and method of manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component and a method for manufacturing the same, and more particularly, to a lead wire of an electronic component with a lead wire by inserting a comb-shaped insulating plate having a plurality of grooves from the side. The work efficiency is improved by mounting the insulating plate as an insulating member when mounting and soldering to the substrate, and the lead wire is placed on the substrate when soldering along the insulating plate. The present invention relates to an extremely low-priced electronic component that can be bent into a chip parallel to the surface to be processed and can be mounted on a double-sided mounting substrate, and a manufacturing method thereof.

[0002]

2. Description of the Related Art An electronic component having a conventional lead wire, for example, an electrolytic capacitor 1 shown in FIGS. 10 and 11 has a surface area increased by etching an aluminum foil having a purity of about 99.99% to roughen it. Anodized electrode foil with a dielectric oxide film formed on the surface by anodic oxidation, and the same purity as 9
Cylindrical shape in which the lead wire 2 is fixed to the cathode electrode foil which is obtained by etching about 9.99% aluminum foil and is roughened, and the anode electrode foil, the cathode electrode foil and the separator paper are alternately stacked. After being wound up, the electrolytic solution is impregnated into the capacitor element 3.

Further, the capacitor element 3 is housed in a metal case 4 having a bottom, and the open end of the case 4 is sealed with a sealing material 5 such as rubber having elasticity to manufacture the electrolytic capacitor 1. It was

The sealing material 5 has two holes 5a formed therein. After inserting the lead wire 2 of the electrolytic capacitor 1 through the holes 5a, the sealing material 5 is inserted into the open end of a cylindrical case 4 having a bottom and sealed. Further, on the surface of the sealing material 5 that comes into contact with the substrate, the protrusion 5b is formed.
When the electrolytic capacitor 1 is mounted on a substrate, the electrolytic capacitor 1 is soldered in a state of floating from the substrate to facilitate discharge of gas generated during soldering, and flux cleaning after soldering. To facilitate.

However, in the above-described electrolytic capacitor 1, the shape of the sealing material 5 is complicated and the cost is high, and at the time of mounting the sealing material 5, the front and back sides are discriminated and mounted in the bottomed cylindrical case 4. When mounted on a substrate, the contact surface between the substrate and the electrolytic capacitor 1 has a convex portion 5b.
However, there is a drawback in that it is difficult to be stably mounted, and the mounting height is increased due to the convex portion 5b.

Another conventional electrolytic capacitor 6 is shown in FIG.
2, the electrode foil for anode, the electrode foil for cathode, and the separator paper produced as described above are alternately superposed and rolled up into a cylindrical shape, and then impregnated with an electrolytic solution to form a capacitor element,
Further, the capacitor element is housed in a metal case 8 having a bottomed cylindrical shape, and the open end of the case 8 is sealed with a sealing material 9 such as a flat rubber plate having two holes to manufacture the electrolytic capacitor 6. .

Then, in order to insert the lead wire 10 into the hole of the substrate, the straight portion 10 of 1.5 to 2.5 mm from the sealing material 9 is used.
Forming processing is performed in which a is provided and bending is performed in a crank shape to form the intervals of the lead wires 10 at the same intervals as the holes formed in the substrate.

Since the above-mentioned electrolytic capacitor 6 requires a complicated forming process, not only a lot of man-hours are required for the production but also the internal lead wire 1 is formed during the forming process.
0 may be stressed, which may adversely affect the tab-attached portion and deteriorate the electrical performance. Also, since the lead wire 10 is the only contact with the board during mounting, the mounting is not stable and the mounting height is high. There was a drawback that the cost was high.

Further, the chip type electrolytic capacitor 11 which is made into a chip for high-density mounting on a printed board and efficiency of mounting work is made of aluminum having a purity of about 99.99% in the same manner as described above in FIGS. 13 and 14. The foil is etched and roughened to increase the surface area, and the anode electrode foil with a dielectric oxide film formed on the surface by anodic oxidation and the aluminum foil with a purity of about 99.99% are also roughened by etching. Fix the lead wire 12 to the electrode foil for the cathode,
The electrode foil for the anode, the electrode foil for the cathode and the separator paper are alternately superposed and rolled up into a cylindrical shape, and then impregnated with an electrolytic solution to manufacture the capacitor element 13.

Further, after accommodating the capacitor element 13 in a metal case 14 having a bottomed cylindrical shape, the open end of the case 14 is sealed with a sealing material 15 such as rubber having elasticity to form an electrolytic capacitor 16. The lead wire 12 of the electrolytic capacitor 16 is drawn through the through hole 18a of the insulating plate 18 and bent at a right angle along the insulating plate 18, and the chip type electrolytic capacitor 11 is formed on a printed circuit board. It is mounted vertically and soldered for mounting.

The above-mentioned conventional chip type electrolytic capacitor 1
No. 1 is excellent in stability to the substrate, but since the lead wire 12 of the electrolytic capacitor 16 must be passed through the through hole 18a of the insulating plate 18, the space between the lead wires 12 prior to the assembly to the insulating plate 18 is required. There was a drawback that it took a lot of man-hours for production, such as the need for correction.

Further, since the lead wire 12 is manufactured by bending it along the insulating plate 18 so that it can be surface-mounted on the printed circuit board, mechanical stress acts on the capacitor element 13 when the lead wire 12 is bent and the sealing portion There is a possibility that the sealing performance may be deteriorated and the electrolyte may leak, or the electrical characteristics may be deteriorated and the life may be adversely affected.

[0013]

SUMMARY OF THE INVENTION The present invention has been made to eliminate the above-mentioned drawbacks of the prior art. The object of the present invention is to provide a groove in a lead wire of an electronic component with a lead wire. By mounting the comb-shaped insulating plate by inserting it from the side, you can solder electronic components with lead wires with the conventional inexpensive plate-shaped sealing material without using the expensive special-shaped sealing material. It is an object of the present invention to make it possible to easily and inexpensively manufacture an electronic component that can easily perform degassing and flux cleaning that occur in the case of, and has excellent stability in mounting on a substrate.

Another object of the present invention is to provide an electronic component having a short height, strong earthquake resistance, and excellent mountability on a printed circuit board by the above structure, and by incorporating the printed circuit board. It is to enable downsizing of the device.

Still another object is to seal the opening of the case with a plate-shaped sealing material, thereby eliminating the need to distinguish the front and back when mounting the sealing material and eliminate the need to mount it on the case. It is to be able to produce.

Another object of the present invention is to insert an insulating plate, which is provided with a groove and is formed in a comb shape, into a lead wire of an electronic component with a lead wire from the side, and then mount the lead wire along the insulating plate. By bending it into a shape, the length of the straight part of the lead wire can be made as short as the thickness of the insulating plate, and the height when mounted on the printed circuit board can be reduced by this. Is to be able to.

Still another object of the present invention is to allow the lead wire to be processed while receiving the force during the forming work of the lead wire with the insulating plate, and to prevent the lead wire from adversely affecting the tab-attached portion. To prevent deterioration of electrical performance.

Another object is to mount an insulating plate between the electronic component with lead wire and the substrate with the insulating plate interposed so that the case or the like of the electronic component with lead wire is surely insulated without coming into contact with the substrate. It is to be mounted in a state, and to be stably fixed on the substrate.

Still another object is to insert a lead wire of an electronic component with lead wires into a comb-shaped insulating plate having grooves and insert the lead wire from the side, and then solder the lead wire along the insulating plate. By bending it in parallel with the surface to be mounted on the board at the time of attachment, electronic components with lead wires can be easily and inexpensively performed without performing the complicated work of penetrating the lead wires into the through holes of the insulating plate. It is to be able to be made into a chip, and thereby to be able to provide an electronic component with a lead wire excellent in stability to a substrate at a low cost.

Still another object is to form a plurality of protrusions on a contact surface with a substrate on a lead wire of an electronic component with a lead wire,
Also, after inserting the comb-shaped insulating plate with grooves and inserting it from the side, bend the lead wire parallel to the surface to be mounted on the board when soldering along the insulating plate By doing so, the electronic component with lead wire can be made into a chip, and the electronic component with lead wire can be mounted in a state of being floated from the substrate by the protruding portion of the insulating plate. Is to facilitate exhaust of gas generated during soldering and easy cleaning of flux.

[0021]

SUMMARY OF THE INVENTION In summary, an electronic component according to the present invention (claim 1) is formed in a comb shape having at least the same number of grooves as the lead wires of the leaded electronic component. It is characterized in that an insulating plate is inserted from the side and attached.

In the method for manufacturing an electronic component according to the present invention (claim 2), the insulating plate is formed in a comb shape having at least the same number of grooves as the lead wires of the electronic component with lead wires. It is characterized by being inserted by inserting from the side.

An electronic component according to the present invention (claim 3)
Is mounted by inserting a comb-shaped insulating plate having at least the same number of grooves as the lead wires of the electronic component with lead wires from the side, and bending the lead wires into a crank shape. It is characterized in that the lead wire is soldered to the substrate with the insulating plate interposed between the processed electronic component with lead wire and the substrate.

An electronic component according to the present invention (claim 4)
Is installed by inserting a comb-shaped insulating plate having at least the same number of grooves as the number of the lead wires into the lead wires of the electronic component with lead wires from the side, and mounting the lead wires along the insulating plate. When soldering, the lead wire is soldered to the board by bending the board in parallel with the surface to be placed on the board and interposing the insulating plate between the electronic component with the lead wire and the board. It is characterized by being configured as described above.

An electronic component according to the present invention (claim 5)
The side surface of the lead wire of the electronic component with lead wire is a comb-shaped insulating plate having a plurality of protrusions on the contact surface with the substrate and having at least the same number of grooves as the lead wires. The lead wire along the insulating plate, and the lead wire is bent in parallel with the surface to be placed on the substrate when soldering, and the insulation is provided between the electronic component with the lead wire and the substrate. It is characterized in that the lead wire is soldered to the substrate with a plate interposed.

[0026]

The electronic component with a lead wire according to the present invention is manufactured by inserting a lead-shaped electronic component with a lead wire by inserting an insulating plate, which is provided with a groove and formed in a comb shape, from the side. After inserting a comb-shaped insulating plate provided with a groove into the lead wire of the electronic component from the side and mounting it,
The lead wire is manufactured by bending along the insulating plate in a crank shape or parallel to the surface to be mounted on the substrate when soldering, so that the lead wire is formed in accordance with the distance between the through holes of the insulating plate. The insulating plate can be easily attached without straightening the wire.

Further, when the electronic component with lead wires is mounted on the substrate, it is possible to surely insulate the parts other than the lead wires of the electronic component with lead wire by the insulating plate, and the insulating plate is interposed. It is possible to provide an electronic component that can be stably fixed to a board by acting as a stabilizer, has great earthquake resistance, and is excellent in mountability on a printed circuit board, and can downsize a device incorporating the board. In addition, a highly reliable electronic device can be manufactured.

[0028]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the embodiments shown in the drawings. 1 to 4, an electronic component 20 according to the first embodiment of the present invention includes an electrolytic capacitor 21 which is an example of an electronic component with a lead wire, and an insulating plate 22.

The electrolytic capacitor 21 has a purity of 99.99%.
The same degree of purity as the electrode foil (not shown) for anode (not shown) in which the aluminum foil is roughened by etching to increase the surface area and further anodized to form a dielectric oxide film on the surface.
A lead wire 23 composed of a tab for pole extraction and a CP wire is fixed to an electrode foil (not shown) for a cathode, which is formed by etching an aluminum foil of about 9.99% and is roughened. The electrode foil for the cathode and the separator paper (not shown) are alternately superposed and rolled up to be molded, and then impregnated with the electrolytic solution to manufacture the capacitor element 24.

Further, the capacitor element 24 is housed in a metal case 25 having a cylindrical shape with a bottom, and the lead wire 23 projecting from the opening 25a of the case 25 is passed through the through hole 26a of the sealing member 26. The opening 2 is formed by the sealing material 26.
It is manufactured by sealing 5a.

Here, the sealing material 26 is a circular plate made of an elastic material such as rubber in FIG.
It is a very ordinary sealing material without any special consideration such as protrusions.

The insulating plate 22 is a comb-shaped plate having a thickness of about 0.3 mm in which two grooves 22a are formed in the same number as the two lead wires 23 in FIG. It is made of a heat-resistant material such as glass fiber-containing epoxy resin, polycarbonate resin, polyethylene terephthalate resin, or the like.

The two grooves 22a are formed in a V shape or a wedge shape which becomes narrower as it goes deeper.
An electronic component 20 is manufactured by inserting a lead wire 23 into the two grooves 22a of the same as shown in FIG. 2 from a direction perpendicular to the lead wire 23. At the innermost portion of the groove 22a, the width of the groove is set to be slightly smaller than the diameter of the lead wire 23. At the innermost portion of the groove 22a, the lead wire 23 is press-fitted into the groove 22a and the elasticity of the insulating plate 22 is reduced. Thus, the lead wire 23 is held with frictional force so that the insulating plate 22 does not come off or fall out of the lead wire 23 even if the electronic component 20 is oriented in any direction after mounting.

Next, referring to FIG. 5, a second embodiment of the present invention will be described. An electronic component 2 of the second embodiment of the present invention will be described.
8 includes an electrolytic capacitor 21 and an insulating plate 22.

The electrolytic capacitor 21 has a lead wire 23 consisting of a tab for pulling out a pole and a CP wire fixedly attached to the electrode foil for the anode and the electrode foil for the cathode in the same manner as in the first embodiment. The electrode foil, the electrode foil for the cathode, and the separator paper (not shown) are alternately laminated and wound up to form a capacitor element, which is impregnated with an electrolytic solution to form a capacitor element. Stored in case 25, the case 2
The lead wire 23 protruding from the opening of No. 5 is penetrated through the through hole 26a of the sealing material 26 to seal the opening with the sealing material 26.

Then, the two grooves 22a of the V-shaped or wedge-shaped insulating plate 22 are inserted into the lead wire 23 from the direction perpendicular to the lead wire 23 to mount the electronic part 28, and then the lead wire 23 is manufactured. 23 is bent at a right angle along the insulating plate 22, and is further bent at a right angle. Forming processing is performed so that the distance between the lead wires 23 is matched with the distance between the lead wire holes (not shown) of the mounting board. There is.

The third embodiment of the present invention will be described with reference to FIGS. 6 to 8. The electronic component 29 of this embodiment is as follows.
An electrolytic capacitor 30, which is an example of an electronic component with a lead wire,
And an insulating plate 35.

The electrolytic capacitor 30 is the same as that of the first embodiment, in which the lead wire 31 consisting of the tab for pulling out the electrode and the CP wire is fixed to the electrode foil for the anode and the electrode foil for the cathode, and the electrode foil for the anode is fixed. Electrode foils, electrode foils for cathodes, and separators (not shown) are alternately laminated and rolled up to form a capacitor element, which is then impregnated with an electrolytic solution to form a capacitor element 32. The capacitor element 32 is a metal bottomed cylinder. It is housed in a cylindrical case 33, and the lead wire 31 protruding from the opening of the case 33 is penetrated through the through hole 34 a of the sealing material 34 to seal the opening with the sealing material 34.

Here, the tip of the lead wire 31 has a flat portion 3
The electronic component 2 formed as 1a and formed into chips
When the 9 is soldered to the substrate, it can be surely soldered to the substrate by cream solder, which is different from the electrolytic capacitors 21 of the first and second embodiments.

Then, the two grooves 35a of the insulating plate 35 are inserted into the lead wire 31 in a direction perpendicular to the lead wire 31, that is, from the side, to mount the electronic component 29, and then the lead wire 31 is attached to the insulating plate 35. It is manufactured by bending it along a surface parallel to the surface to be placed on the substrate during soldering, and the insulating plate 35 is provided between the electrolytic capacitor 30 and the substrate (not shown).
It is configured to be soldered by interposing. Groove 3
In contrast to the first embodiment, the width of the groove 5a is narrower in the front of the innermost portion in FIG. 8, and the width of the groove 35a is set to be much smaller than the diameter of the lead wire 31 in this portion. The innermost part is formed in an arc shape, and the diameter of the innermost arc is set to be slightly smaller than the diameter of the lead wire 31. Then, when the lead wire 31 passes through the narrow portion of the groove, the insulating plate 35 is once expanded, and when the lead wire 31 reaches the innermost portion, the lead wire 31 is press-fitted.
The lead wire 31 is held by the elastic force of 5, and the lead wire 31
The insulating plate 35 is configured so as not to come off or fall off. However, if the width of the narrow portion of the groove 35a is set to be much smaller than the diameter of the lead wire 31, the insulating plate 35 will not come off from the lead wire 31 after mounting, and therefore the diameter of the arc at the innermost portion is not always necessary. The lead wire 3
The diameter may not be set smaller than the diameter of 1, and may be set so that a gap is slightly formed on the outer circumference.

Further, in FIG. 8, a plurality of protrusions 35b are formed on the surface of the insulating plate 35 which contacts the substrate,
The height thereof is set to be equal to or slightly higher than the thickness of the flat portion 31a of the lead wire 31, and when mounted on the board, the protrusion 35b and the flat portion 31a soldered together are provided. It is firmly and stably fixed.

Next, referring to FIG. 9, in the fourth embodiment of the present invention, the shape of the insulating plate 36 is different, and the thickness is 0.3.
The insulating plate 36 made of a material such as epoxy resin containing glass fiber of about mm, polycarbonate resin, polyethylene terephthalate resin, or the like has the same V as in the two first embodiments.
A groove 36a having a V shape or a wedge shape is formed, and a protrusion 36 in the vertical direction is formed on a surface contacting the substrate when soldering.
A plurality of b are formed.

Then, the insulating plate is inserted into the lead wire 31 of the electrolytic capacitor 30 described in the third embodiment through the two grooves 36a of the insulating plate 36 at a right angle to the lead wire 31, and then mounted. 31 is bent along the insulating plate 36 in parallel with the surface to be mounted on the substrate when soldering, and the insulating plate 36 is interposed between the electrolytic capacitor 30 and the substrate (not shown). It is configured to be soldered.

According to the method of manufacturing an electronic component of the present invention (claim 2), the insulating plate is formed in a comb shape having at least the same number of grooves 22a as the number of the lead wires 23 in the lead wires 23 of the electrolytic capacitor 21. It is a method of inserting 22 by inserting it from the side.

The present invention is configured as described above,
The operation will be described below. In FIG. 1 and FIG. 2, the electronic component 20 is mounted by inserting the insulating plate 22 into the lead wire 23 of the electrolytic capacitor 21 through the groove 22 a, and simply inserting the insulating plate 22 from the side of the lead wire 23. The lead wire 23 can be held by the V-shaped or wedge-shaped groove 22a by a simple operation, and the electronic component 20 can be manufactured extremely easily and inexpensively.

When mounting the electronic component 20 on a substrate,
The gas generated by soldering can be exhausted from the groove 22a to perform highly reliable soldering, and the flux can be thoroughly cleaned after soldering.

Further, in the electronic component 20, a portion other than the lead wire 23 is surely insulated from the substrate by the insulating plate 22, and the electronic component 20 is stably fixed to the substrate and is highly quake-resistant and highly reliable. Can be manufactured.

Further, in the second embodiment of the present invention shown in FIG. 5, since the lead wire 23 is formed into a crank shape along the insulating plate 22 inserted from the direction perpendicular to the lead wire 23, it is formed into a crank shape. The stress does not extend to the tab attachment portion of the lead wire 23, and the electronic component 2 by the processing is processed.
The deterioration of the electrical characteristics of 0 is prevented and high reliability is secured.

6 and 7, the electronic component 29
After inserting the two grooves 35a of the insulating plate 35 into the lead wire 31 from the direction perpendicular to the lead wire 31, the lead wire 3
1 is bent along the insulating plate 35 in parallel with the surface to be mounted on the substrate when soldering, and is manufactured as a chip-shaped electronic component, so that it can be easily mounted on the substrate. Moreover, the packaging density can be increased.

Further, since a plurality of protrusions 35b having the same height as the thickness of the flat portion 31a of the lead wire 31 are formed on the surface of the insulating plate 35 which contacts the substrate, the protrusions 35b when mounted on the substrate. Since the portion 35b and the flat portion 31a soldered can be firmly and stably fixed, a highly reliable device can be manufactured.

In the above embodiments, the electronic component is described as an electrolytic capacitor, but it is not limited to the electrolytic capacitor, and any electronic component having a lead wire can be applied. Is. For example, it can be applied to various capacitors other than the electrolytic capacitor, and its application range is extremely wide.

[0052]

As described above, according to the present invention, a comb-shaped insulating plate provided with a groove is laterally inserted into a lead wire of an electronic component with a lead wire as described above, and the special shape having a high cost is mounted. It is possible to easily remove the gas and flux that are generated when soldering electronic components with lead wires with a conventional inexpensive plate-shaped sealing material without using the sealing material, and to stabilize the mounting on the board. There is an effect that an electronic component having excellent properties can be provided extremely easily and inexpensively.

Further, with the above structure, it is possible to provide an electronic component which is short, strong in earthquake resistance and excellent in mountability on a printed circuit board, and as a result, it is possible to miniaturize a device incorporating the printed circuit board.

Furthermore, since the opening of the case is sealed with the plate-shaped sealing material, it is possible to eliminate the need to distinguish the front and back when mounting the sealing material, and to eliminate the need to mount it on the case. The effect is that parts can be manufactured.

Further, a comb-shaped insulating plate provided with a groove is inserted into the lead wire of the electronic component with a lead wire from the side, and the lead wire is bent into a crank shape along the insulating plate. Since the length of the straight portion of the lead wire can be made as short as the thickness of the insulating plate, the height when mounted on the printed circuit board can be reduced. There is an effect.

Further, with the above-mentioned structure, there is an effect that the processing can be performed while receiving the force at the time of forming processing of the lead wire with the insulating plate, and as a result, the adverse effect on the tab attaching portion of the lead wire is prevented and the electrical performance is improved. There is an effect that deterioration can be prevented.

Also, since the insulating plate is interposed between the electronic component with lead wire and the substrate, the electronic component with lead wire is mounted in a state in which it is surely insulated without coming into contact with the substrate. There is an effect that it can be done and that it can be stably fixed on the substrate.

Further, when a comb-shaped insulating plate provided with a groove is inserted into the lead wire of the electronic component with a lead wire from the side and mounted, the lead wire is soldered along the insulating plate. Since it is bent in parallel with the surface to be mounted on the board, the electronic components with lead wires can be easily and inexpensively chipped without the complicated work of penetrating the lead wires into the through holes of the insulating plate. There is an effect that it can be realized, and as a result, an electronic component with a lead wire which is excellent in stability to the substrate can be provided at a low cost.

In addition, a lead wire of an electronic component with a lead wire is provided with a plurality of protrusions on the contact surface with the substrate, and a comb-shaped insulating plate provided with grooves is mounted from the side, and then the lead wire is attached. Since the wire is bent along the insulating plate in parallel with the surface to be placed on the substrate when soldering, there is an effect that the electronic component with lead wire can be made into a chip, and the protrusion of the insulating plate The electronic parts with lead wires can be mounted on the board in a state of being floated from the board. As a result, the gas generated during soldering can be easily exhausted and the flux can be easily cleaned. .

[Brief description of drawings]

1 to 4 relate to a first embodiment of the present invention, and FIG. 1 is a vertical sectional view of an electronic component.

FIG. 2 is a perspective view of an electronic component.

FIG. 3 is a perspective view of a sealing material of an electronic component.

FIG. 4 is a perspective view of an insulating plate.

FIG. 5 is a perspective view of an electronic component according to a second embodiment of the present invention.

6 to 8 relate to a third embodiment of the present invention, and FIG. 6 is a vertical sectional view of an electronic component.

FIG. 7 is a perspective view of an electronic component.

FIG. 8 is a perspective view of an insulating plate.

FIG. 9 is a perspective view of an insulating plate according to a fourth embodiment of the present invention.

10 and 11 relate to a first conventional example, and FIG. 10 is a vertical sectional view of an electronic component.

FIG. 11 is a perspective view of a sealing material.

FIG. 12 is a perspective view of an electronic component according to a second conventional example.

13 and 14 relate to a third conventional example, and FIG. 13 is a vertical sectional view of an electronic component.

FIG. 14 is a perspective view of an electronic component.

[Explanation of symbols]

20 electronic components 21 Electronic parts with lead wire 22 Insulation plate 22a groove 23 lead wire 28 Electronic components 29 Electronic components 30 Electronic parts with lead wires 31 lead wire 35 Insulation plate 35a groove 35b protrusion 36 Insulation plate 36a groove 36b protrusion

Continuation of the front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01G 9/10 H01G 9/00 321 H01G 9/008

Claims (5)

(57) [Claims] 1. An electronic component, characterized in that a comb-shaped insulating plate having at least as many grooves as the number of the lead wires is laterally inserted and attached to the lead wires of the lead-equipped electronic component. . 2. An electronic component having a lead wire of an electronic component with a lead wire, wherein a comb-shaped insulating plate having at least as many grooves as the number of the lead wires is laterally inserted and mounted. Manufacturing method. 3. A lead wire of an electronic component with a lead wire is attached by inserting a comb-shaped insulating plate having at least the same number of grooves as the lead wire from the side and inserting the lead wire into a crank shape. An electronic component, characterized in that the lead wire is soldered to the substrate with the insulating plate interposed between the electronic component with the lead wire and the substrate. 4. A lead wire of an electronic component with a lead wire is attached by inserting a comb-shaped insulating plate having at least the same number of grooves as the lead wires from the side. Bending along the plate in parallel with the surface to be mounted on the board at the time of soldering, interposing the insulating plate between the electronic component with lead wire and the board, and connecting the lead wire to the board An electronic component characterized by being configured to be soldered. 5. An insulating plate formed on a lead wire of an electronic component with a lead wire, wherein a plurality of protrusions are formed on a contact surface with a substrate and having at least the same number of grooves as the lead wires and formed in a comb shape. Between the lead-wired electronic component and the board by bending the lead wire parallel to the surface to be placed on the board when soldering along the insulating plate. An electronic component, wherein the lead wire is soldered to the substrate with the insulating plate interposed therebetween.