JP3080880B2 - Chip type solid electrolytic capacitor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type solid electrolytic capacitor having a resin exterior structure, and more particularly to a structure of two external terminals for electrically connecting a capacitor element to an external circuit. .

[0002]

2. Description of the Related Art A chip type capacitor has two external and positive and negative external connections so that it can be surface-mounted on a mounting substrate such as a printed wiring board when applied to electronic equipment. The terminals must be located on one side of the capacitor. However, the capacitor element usually has a columnar or prismatic shape. The anode lead wire that communicates with the anode electrode of the pair of counter electrodes that perform the charge storage action is in the shape of a round bar, and is led out from the center of one end face of the column in a direction perpendicular to the end face. I have. On the other hand, the cathode conductor layer communicating with the cathode electrode of the counter electrode is formed in a layer on the surface of the column. Therefore,
In the capacitor element, the anode lead wire and the cathode conductor layer are not on the same plane. For this reason, a technique for connecting the terminal for connection between the anode lead of the capacitor element and the outside (external anode terminal) and the terminal for connection between the cathode conductor layer and the outside (external cathode terminal) is absolutely necessary. . In view of such a need, various connection structures have been conventionally proposed.

FIG. 3A is a sectional view of an example of a conventional chip type solid electrolytic capacitor. FIG. 3B is a perspective view of the capacitor when viewed from the bottom side. The capacitor shown in FIG. 3 has a similar structure to the capacitor disclosed in Japanese Utility Model Laid-Open No. 48-133,
Capacitor element 2 with anode lead wire 1 implanted
And a strip-shaped external anode terminal 35 fixed to the anode lead wire, and a strip-shaped external anode terminal 35 fixed to a cathode conductor layer (not shown) formed on the element surface with a conductive adhesive 4. It comprises an external cathode terminal 33, and an exterior resin body 36 that covers the two external terminals 35, 33 and the capacitor element 2 except for predetermined portions of the external terminals. This capacitor is manufactured as follows, taking a tantalum solid electrolytic capacitor as an example.

First, fine metal tantalum powder is formed into a cylinder or a prism. At this time, a metal tantalum wire to be the anode lead wire 1 is planted on one end face of the pillar. Next, the column with the tantalum wire is sintered into a porous sintered body, and a tantalum oxide (Ta ₂ O ₅ ) film serving as a dielectric is formed on the surface of the sintered body excluding the tantalum wire. It is formed by using an anodic oxidation method or the like. Thereafter, a cathode conductor layer in which, for example, a graphite layer and a silver layer are sequentially formed in this order is provided on the tantalum oxide film, and the capacitor element 2 with the anode lead wire 1 is obtained.

Thereafter, an external cathode terminal 33 made of a metal strip is fixed to the cathode conductor layer of the capacitor element using a conductive adhesive 4. Also, an external anode terminal 35 made of a metal strip is welded to the anode lead wire 1. And the whole of the capacitor element 2 and the anode lead wire 1,
A predetermined portion of the external cathode terminal 33 and the external anode terminal 35 connected thereto are covered with an electrically insulating resin body 36 so as to be covered with a resin, and the two terminals 33 and 35 are connected to a horizontal axis (anode lead) from the end face of the resin body 36. Capacitors with shapes drawn in opposite directions along an axis (parallel to the lead line 1) are obtained.

Finally, the negative and positive external terminals 33 and 35 drawn out of the resin body 36 are bent vertically downward and horizontally inward from the end face of the resin body 36 along the bottom face. A chip type tantalum solid electrolytic capacitor having the structure shown in FIG. 3 is completed.

In this capacitor, both the negative and positive external terminals are bent along the resin body 36 in the last step, so that the mechanical shock at the time of bending causes the characteristics and reliability of the capacitor element to be reduced. To prevent damage, the position where the external terminal is bent from the capacitor element 2, that is, the distance over which the external terminals 33 and 35 are covered with the exterior resin body 36 is increased. And due to that,
The capacitor having this structure has a problem that displacement tends to occur when the capacitor is mounted on a mounting board when the capacitor is incorporated into an electronic device or the like.

That is, in the upper half of FIG. 4, the implanted surface of the anode lead wire 1 of this capacitor is viewed in a direction opposite to the direction in which the anode lead wire is projected.
FIG. 3A is a view of the capacitor viewed from the left to the right in FIG. The lower half of FIG. 4 shows a portion on the side of the external anode terminal in the bottom view of this capacitor. 3 and 4
In this capacitor, in this capacitor, the anode lead extraction center point (the center point in the width direction at the position where the external anode terminal 35 extends outward from the resin body 36 and is bent downward in FIG. 3) 35A to the external anode terminal Along 35, the distance to the bottom center point 35B of the external anode terminal is long.
Here, when the external anode terminal 35 is pulled out from the exterior resin body 36 and is bent at a substantially right angle toward the bottom surface, a deviation of an angle θ occurs between the bending direction and the external center line 35C of the capacitor. It shall be assumed. In this case, a deviation 35E occurs between the bottom center point 35B of the external anode terminal 35 and the external center line 35C of the capacitor in the finally completed capacitor. The magnitude d of the displacement 35E is substantially equal to d = L · sin θ (where L is the distance from the above-described anode lead extraction center point 35A to the bottom surface center point 35B of the external anode terminal along the external anode terminal 35). Distance).
When there is such a shift, the mounting position is determined in accordance with the center point 35B of the bottom surface of the external anode terminal 35 and the center point of the bottom surface of the external cathode terminal 33 when mounting on a mounting board such as a printed wiring board. Then, the mounting position of the capacitor is shifted. Such a displacement of the mounting position may cause contact with an adjacent electronic component or a failure to mount the component, and this is a serious problem, particularly in a situation where high-density mounting is being promoted as electronic devices are downsized. It is.

In order to prevent the mounting position from being shifted due to such a cause, the structure of the external terminal 35 must be a structure in which a portion immediately after drawn out of the exterior resin body 36 is a connection portion with the outside. Will be valid. The cause of the mounting position shift is the position of the lead-out from the exterior resin body (point 35 in FIG.
This is because the distance from A) to the external connection portion (point 35B) is long. One example of such a terminal structure is disclosed in Japanese Utility Model Laid-Open No. 55-139512. In the chip-shaped electrical component described in the above publication, a strip-shaped external terminal attached to the element is drawn out of the exterior resin body in the vicinity of the element, in a direction perpendicular to the element, and further bent along the exterior resin body, Device mounting surface (surface facing component mounting land on mounting board)
Is provided with a portion serving as a connection portion with the outside. According to this terminal structure, the portion immediately after being drawn out of the exterior resin body and bent is a connection portion with the outside,
Capacitor outline center line and terminal center point misalignment
(Corresponding to the distance 35E) is small, and the mounting position shift hardly occurs. In this electrical component, the strip-shaped external terminal is a portion inside the exterior resin body, that is, the portion from the element to the position where the external terminal is bent is thin, and is bent along the mounting surface of the exterior resin body. However, the portion to be connected to the outside is widened.

As another method of preventing the mounting position from being shifted in the conventional capacitor, the inside of the exterior resin body is kept in the conventional structure, and the bending direction is hardly disturbed when the terminal is bent. However, it is possible. For example,
This is a method in which a recess is formed on the end surface or the mounting surface of the exterior resin body, following the external shape of the terminal. An example of such a structure in which an external terminal is fitted into the recess of the exterior resin body is disclosed in
-137926. FIG. 5 is a perspective view of the chip-type solid electrolytic capacitor described in the above publication. Referring to FIG. 5, in the capacitor shown in FIG. 5, concave portions 42 are provided from the position where external terminals 43 and 45 are pulled out of the end surface of exterior resin body 46 to mounting surface 5. 43 and 45 are pushed into these concave portions 42. According to this structure, even if the direction is misaligned when the terminal is bent, the irregularity will be corrected by the concave portion 42 of the exterior resin body.

A terminal having a structure similar to this terminal structure is disclosed in Japanese Utility Model Publication No. 1-3737. FIG. 6 shows a perspective view of a chip-type solid electrolytic capacitor described in that publication. Referring to FIG. 6, in this capacitor, the upper side of the exterior resin body 56 opposite to the bending direction of the external anode terminal 55 and both sides of the terminal protrude so as to be flush with the terminal 55. ing. Even with this structure,
The same effect as in the '926 publication will be obtained.

However, in the case of the terminal structure shown in FIGS. 5 and 6, when the external dimensions of the capacitor, that is, the dimensions of the exterior resin body are reduced, there is a problem that the strength of the terminal is reduced. That is, in this terminal structure, the external terminals 4
3, 45 (in the case of FIG. 5, in FIG. 6, the terminal 55), a projecting portion 42 of the resin body for correcting the position of the terminal.
A (52A) is always required. This projecting part 4
2A and 52A require a minimum width which is more than a certain width. In general, a transfer molding method is used to form the exterior resin body 46 (same as above, 56). then,
The capacitor element was placed in a mold, but is to inject a molten resin material into the mold, the mold and the external terminals 43 and 45
This is because the resin does not enter unless the distance between the outer resin body 55 and the projecting portion 42A of the exterior resin body (the same as 52A) is at least a certain extent. Therefore,
When the outer shape of the exterior resin body 46 (same as 56) is reduced, the width of the external terminals 43A and 45A (same as 55A) must be reduced in order to secure the width of the projecting portion 42A (same as 52A). Because you don't get it.

In order to prevent a decrease in terminal strength due to such a cause, it is effective to use a terminal structure as shown in FIG. FIG. 7 is a perspective view of a chip-type solid electrolytic capacitor, which is the capacitor disclosed in Japanese Utility Model Publication No. 1-3737. Referring to FIG. 7, in this capacitor, the external anode terminal 65 pulled out from exterior resin body 66 is divided into two parts at a position beyond the drawing position. The exterior resin body 66 has a structure in which a portion corresponding to the forked portion of the external terminal 65 is dented and a portion between the forked portions protrudes. According to this terminal structure, misalignment in the direction of bending the external terminal 65 is corrected. Moreover, since there is no projecting portion of the exterior resin body 66 on both sides of the external terminal 65, it is not necessary to reduce the terminal width even when the capacitor is downsized, and the terminal strength does not decrease.

The aforementioned Japanese Utility Model Laid-Open Publication No. 55-139512
Japanese Patent Application Publication No. 63-137926 and Japanese Utility Model Application Publication No. 1-33277 do not directly aim at preventing displacement during mounting, but the terminal structure disclosed therein is It is expected to be effective in preventing displacement.

[0015]

The terminal structure shown in FIG. 7 of Japanese Utility Model Laid-Open Publication No. 55-139512 and Japanese Utility Model Publication No. 1-33273 described above is caused by deviation of the terminal bending direction in the solid electrolytic capacitor. This will be effective in preventing the mounting position shift. However, each of them has the following problems.

First, in the capacitor described in Japanese Utility Model Laid-Open Publication No. 55-139512, the band-shaped external terminal is narrow in a portion embedded in the exterior resin body, and is exposed outside the resin body. The front part is widened. Therefore, if the thickness of the exterior resin body does not exactly match the length of the portion where the width of the external terminal is narrow, an excessive bending force is required when bending the external terminal. As a result, if the exterior resin body is damaged or severe, processing becomes impossible. That is, it is difficult to form the terminal.

On the other hand, in the capacitor terminal structure shown in FIG. 7, the portion of the external terminal 65 extending from the exterior resin body 66 is branched into two parts. Therefore, the terminal width at the terminal lead-out portion is insufficient as compared with the capacitor shown in FIG. 3, and the terminal strength at the position where the terminal is drawn out and bent as indicated by the broken circle in FIG. 7 is reduced.

Accordingly, an object of the present invention is to provide a chip-type solid electrolytic capacitor having a resin exterior structure, which is free from displacement during mounting due to a displacement in the direction of bending of external terminals. It is.

Another object of the present invention is to bend the terminal,
It is an object of the present invention to provide a chip-type solid electrolytic capacitor which is easy to mold and has excellent connection reliability.

Another object of the present invention is to provide a chip type solid electrolytic capacitor having high terminal strength.

[0021]

DISCLOSURE OF THE INVENTION The chip-type solid state electronic device of the present invention
The solution capacitor is a solid electrolytic capacitor element and its element.
A strip-shaped external anode terminal for electrical connection with the outside
And the external cathode terminal are sealed with an insulating exterior resin body.
And the two terminals are pulled out of the exterior resin body.
Folded along the exterior resin body surface
Of plastic encapsulated chip-type solid electrolytic capacitors
Each of the external anode terminal and the external cathode terminal
The extension of the terminal from the position where the terminal is pulled out from the exterior resin body
The notch hole is formed in the part on the exterior resin body surface
Or a notch from the front end in the extension direction is provided,
To the external anode terminal and the external cathode terminal
At the position corresponding to the notch hole or notch,
It is characterized by having a convex part that fits into a hole or a notch.
You.

In the chip type solid electrolytic capacitor of the present invention,
Is the external terminal, the tip of which is pulled out of the exterior resin body,
In other words, after being bent along the end surface of the exterior resin body
At the part away from the drawer position. Exterior
The terminal width at the position where it is pulled out from the resin body is the full width of the original width.
Remains. Therefore, the strength at the position where the terminal is pulled out decreases.
There is no. Between the two parts where it was pulled out
The terminal portion is bent because the projecting part of the exterior resin body is sandwiched between
Even if the direction goes wrong at that time,
Be corrected.

Further , the chip type solid electrolytic capacitor of the present invention
Is the chip-type solid electrolytic capacitor described above,
Constant width of each of the external anode terminal and the external cathode terminal
Metal strips, and each metal strip
Outside the bottom of the exterior resin body at a position
And bend it along the bottom of the exterior resin body.
The part beyond the bending position is used as a terminal for connection to the outside.
It is characterized by having.

In this chip type solid electrolytic capacitor,
-Use a fixed width metal strip as the positive external terminal.
These strips are covered with an exterior resin
Attached to the element so that it is pulled out from the bottom of the body,
After the resin sheath is applied, fold it along the bottom of the resin body.
Can be bent. Therefore, the part inside the resin exterior body
The length does not exactly match the thickness of the resin exterior body in advance.
However, there is no obstacle at the time of bending. Moreover, the exterior
It is bent at the bottom of the resin body.
It is a connection part with the outside. In other words, from the bending position
The distance to the center point of the connection with the outside is shorter than before
Therefore, even if the direction is incorrect during bending,
The displacement during mounting is small.

The chip type solid electrolytic capacitor of the present invention comprises:
In the chip-type solid electrolytic capacitor described above,
The metal strip of the external anode terminal and the cathode external cathode terminal
Metal strips of the exterior resin body are pulled out
Bent along the surface that intersects the bottom
It is characterized by having been done.

The bottom surface of the above-mentioned negative and positive external terminals and
The bend to the intersecting surface allows this capacitor to be mounted on the mounting board.
When mounting, externally without expanding the low area of the resin body
Has the effect of increasing the connection area with
You. This structure is especially useful for small capacitors.
It is very effective in improving the reliability of the connection with.

[0027]

Next, an embodiment of the present invention will be described with reference to the drawings. First, an understanding of the present invention
For ease, a reference example of the present invention will be described.
FIG. 1A is a sectional view of a chip-type tantalum solid electrolytic capacitor according to a reference example of the present invention. Referring to FIG. 1A, this solid electrolytic capacitor includes a capacitor element 2 having an anode lead wire 1 led out from one end face,
An external cathode terminal 13 adhered and fixed to a cathode conductor layer (not shown) formed on the surface of the capacitor element 2 with a conductive adhesive 4; an external anode terminal 15 welded to the anode lead wire 1; The device comprises an element 2 and an insulating exterior resin body 16 which covers the external anode terminal 15 and the external cathode terminal 13 except for predetermined portions of the external terminals 13 and 15. This capacitor was manufactured as follows.

First, a fine powder of tantalum was added with a wire diameter of 0.2 mm.
Anode lead wire 1 made of tantalum wire
Next, it is press-formed and sintered to form a cube-shaped sintered body of 0.7 mm in length and 0.7 mm in length and 0.7 mm in length. A tantalum oxide film is formed on the surface of the sintered body as a dielectric layer.
Thereafter, a manganese dioxide layer, a graphite layer, and a silver paste layer are sequentially formed on the oxide film, and each of the manganese dioxide layer, the graphite layer and the silver paste layer has a thickness of 0.
Capacitor element 2 on a 9 mm, 0.9 mm long cube
Get.

Next, the cathode conductor layer on the side surface of the capacitor element 2 and the external cathode terminal 13 are conductively bonded with a conductive adhesive 4. The external cathode terminal 13 is formed of a metal strip having a constant width in the length direction, and has been processed in advance into a shape adapted to the outer surface of the capacitor element 2. When attached to the element 2, it has a shape extending downward on the paper along the right end face of the element 2.

On the other hand, an external anode terminal 15 is welded to the anode lead wire 1 of the capacitor element. External anode terminal 1
Numeral 5 is made of a metal strip having a constant width in the length direction, and is previously processed into an inverted L-shape. Then, the bottom of the inverted L-shape is welded along the anode lead wire 1, and in the welded state, it has a shape extending vertically downward on the paper perpendicular to the anode lead wire 1.

Thereafter, the whole (excluding the external cathode terminal 1)
3. Cover the portion of the external anode terminal 15 extending downward in the drawing with an appropriate length from the front end in the extending direction) with an insulating exterior resin body 16, and attach the two external terminals 13, 15 to the resin body 1.
6 is pulled out from the bottom surface (this bottom surface is the mounting surface of the completed capacitor). Finally, each external terminal 1
The capacitors 3 and 15 are bent along the mounting surface at the position where they are pulled out from the resin body 16, and further bent upward along the end surface of the resin body 16 to complete the capacitor.

The capacitor manufactured by the above-described manufacturing process and FIG.
Each of ten chip-type tantalum solid electrolytic capacitors having the conventional structure shown in FIG. 3 was manufactured, and the displacement 35E (see FIG. 4) on the bottom surface of the capacitor was measured. The result is shown by the histogram in FIG. FIG.
Referring to (b), it can be seen that the capacitor according to the present reference example has a positional displacement dimension of about 1/3 that of a capacitor having a conventional structure, and the positional displacement during mounting is greatly improved.

In this embodiment , the external terminals 1
Metal strips having a constant width are used as 3 and 15. These strips are attached to the element so as to be pulled out from the bottom surface of the exterior resin body at a position immediately adjacent to the capacitor element 2,
After the resin sheathing is applied, it is bent along the mounting surface of the exterior resin body 16. Therefore, even if the length of the portion inside the exterior resin body and the thickness of the exterior resin body do not exactly match in advance, there is no problem at the time of bending.

In this embodiment , the external terminals 1
3 and 15 were bent upward along the end surface of the exterior resin body 16, but it is clear from the description so far that the function and effect of the present invention would not be impaired without the bent portion above the end surface. It will be obvious. However, the bent portion above this end face
When mounting this capacitor on a mounting board, the resin body 1
6 has an effect that the effective connection area with the outside can be increased without increasing the bottom area of the capacitor 6. Therefore, particularly in a small-sized capacitor, it is very effective to enhance the reliability of the connection with the outside.

Next, an embodiment of the present invention will be described. FIG. 2A is a perspective view of the chip-type tantalum solid electrolytic capacitor according to one embodiment of the present invention as viewed from the bottom side. Referring to FIGS. 2A, 7 and 3, in the present embodiment, the internal structure of exterior resin body 26 is the same as the internal structure of the conventional capacitor shown in FIG. On the other hand, the external structure is such that the external anode terminal 25 and the external cathode terminal 23
A point in which a notch is formed from the end face to the bottom face at a corner which is bent along the end face after being drawn out of the exterior resin body 26 and is bent again from the end face of the resin body to the bottom face; The structure differs from the conventional capacitor shown in FIG. 7 in that the body 26 has a structure in which a convex portion 21 is provided from the end face to the bottom face so as to fit into the notch hole of the external terminal. The capacitor of the present embodiment was manufactured as follows.

First, the external anode terminal 2 is connected to the capacitor element.
5 and the external cathode terminal 23 are fixedly connected. Each of the two external terminals 23 and 25 is formed of a metal strip having a constant width in the length direction. In these external terminals 23 and 25, rectangular cutouts having a width of 0.7 mm and a length of 2.1 mm are previously formed in predetermined portions.

Next, the entire capacitor element and predetermined portions of the external terminals 33 and 35 connected thereto are covered with an electrically insulating resin body 26 and are covered with a resin. At that time, the exterior resin body 2
The protrusion 21 is formed from the end face to the bottom face of No. 6. By the above steps, the two terminals 23 and 25 are pulled out from the end face of the resin body 26 horizontally and in opposite directions along the horizontal axis (the axis parallel to the anode lead wire 1).
Then, a capacitor having a shape in which the protrusion 21 is provided from the end face to the bottom face is obtained.

Finally, the two external terminals 23 and 25, which are horizontally drawn out of the resin body 26, are bent vertically downward and horizontally inward from the end face of the resin body 26 along the bottom face. Process. At this time, on the end surface of the exterior resin body 26, the fitting proceeds while the cutout holes of the external terminals 23 and 25 are guided to the protrusions 21 of the resin body. Further, when the external terminals 23 and 25 are bent along the bottom surface of the resin body 26, the fitting proceeds while the protrusions 21 guide the cutout holes of the external terminals. When the bending of the external terminals is finally completed, the notch holes of the external terminals 23 and 25 and the convex portion 21 of the resin body are inserted and fitted to correct the terminal position. 25 is correctly arranged at a predetermined position.

Ten chip-type tantalum solid electrolytic capacitors according to the present embodiment and ten chip-type tantalum solid electrolytic capacitors having the terminal structure shown in FIG. 7 were manufactured, and the terminals at the positions where the external terminals were pulled out from the exterior resin body were manufactured. The strength was measured. The terminal strength was evaluated by a bending strength test of the terminal. That is, as shown in FIG. 2C, the direction of the terminal in the completed capacitor is defined as the X direction, and the direction at 90 degrees to the terminal is defined as the Y direction. Then, connect the external terminal to Y from the X direction.
The operation of opening 90 degrees in the direction (X → Y) and closing again 90 degrees in the X direction from the Y direction (Y → X) is repeated until the terminal is broken, and the number of times of opening and closing when the terminal is broken is defined as the terminal strength. The number of times of opening and closing is counted as one every time the direction of the terminal is changed by 90 degrees. That is, once in the operation of X → Y, Y
→ The X operation is repeated once. The above evaluation results are shown in FIG.
This is shown by the histogram in FIG. Referring to FIG. 2 (b), the terminal strength in the present embodiment is about nine times on average, whereas the conventional capacitor is about six times, showing the effect of improving the terminal strength according to the present invention. I understand.

In this embodiment, the convex portion 2 of the exterior resin body is used.
Although the structure 1 is continuous from the end face to the bottom face of the resin body 36, the present invention is not limited to this, and independent protrusions may be provided on the end face and the bottom face. Further, even if only one of the end face and the bottom face is provided with the convex portion, the effect of correcting the positional deviation with respect to the terminal can be obtained. However, as described above, the positional deviation at the time of terminal bending is determined mainly by the direction deviation that occurs when the terminal is bent in the bottom direction at the position where the terminal is pulled out from the exterior resin body. It is more effective to provide on the end face of the resin body.

Further, in the present embodiment, the external terminals 2
Although the cutout holes are formed in the external terminals 3 and 25, notches (not slits) may be formed from the front ends of the external terminals 23 and 25 (instead of the holes) in the extending direction. When soldering a chip-type component to a mounting board, usually, not only soldering the component mounting lands of the mounting board and the external terminals of the chip-type component to each other on the bottom surface of the component, but also soldering the component Solder so as to crawl over the terminal on the end face. Therefore, even if the portion on the mounting surface of the external terminal is divided into two, the bonding strength between the mounting board and the component does not decrease. The width of the external terminal in the present invention at least at the position where the external terminal is pulled out from the exterior resin body, that is, the position where the external terminal is bent in the direction of the mounting surface may be the same as the original width.

Although the present embodiment shows an example in which the present invention is applied to the conventional chip-type solid electrolytic capacitor shown in FIG. 3, the internal structure of the capacitor to which the present invention is applied is as follows. There is no particular limitation. The chip type solid electrolytic capacitor according to the reference example shown in FIG. 1 has a structure in which notches or notches are provided in the external terminals 13 and 15 and a protrusion is provided on the mounting surface of the exterior resin body 16. Similar effects can be obtained. The present invention can be applied to any capacitor having an external terminal having a structure in which a strip-shaped metal plate drawn from an exterior resin body is bent along the exterior resin body, regardless of the internal structure.

[0043]

As described above, the present invention provides an external
For each of the pole terminal and external cathode terminal,
Armored resin body in the direction of terminal extension
Make cutouts or cutouts in the extension direction
The external resin terminal and external anode terminal
And notches or cutouts provided in the external cathode terminal
The notch or the notch that fits into the notch
Part, so fold the terminal along the exterior resin body.
There is no deviation in the bending direction when bending. Only
The width of the terminal at the bending position is the full width as it is.
You. Thereby, according to the present invention, bending of the external terminal
The position deviation during mounting due to the direction deviation of
This can be prevented without sacrificing the strength at the position.

According to the present invention, further, the capacitor element is connected to the outside.
External anode terminal and external cathode terminal for electrical connection
The element is made of a metal strip with a constant width,
Pull out to the outside of the bottom surface of the exterior resin body at the position closest to the element,
Fold it along the bottom, and from the bending position
The terminal part for connection with the outside
Reduce the distance from the bending position to the connection to the outside.
You. Thereby, according to the present invention, bending of the external terminal
Misalignment during mounting due to misalignment
Can be stopped.

The external anode terminal and the external cathode terminal are
Since it is made of a fixed width metal strip,
Strictly match the length of the fat body and the thickness of the exterior resin body
No need, easy bending and excellent connection reliability
A chip-type solid electrolytic capacitor can be provided.

The above-mentioned external terminals are made of an exterior resin body.
Anode lead wire from the surface from which each terminal is drawn
Bending along a plane perpendicular to the axis along
Effective connection to the outside without increasing the sensor bottom area
The connection area can be increased, so the connection reliability
Can be even higher.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a chip type tantalum solid electrolytic capacitor according to a reference example of the present invention and the distribution of the displacement dimension of the external terminal in the capacitor, a chip-type tantalum solid electrolytic capacitor of the conventional chip type tantalum solid electrolyte according to Reference Example FIG. 4 is a diagram showing a comparison with a capacitor.

2 is a perspective view of a chip type tantalum solid electrolytic capacitor according to an embodiment of the present invention, the distribution of the intensity of the external terminals in a capacitor, conventional chip type tantalum solid electrolyte and the chip-type tantalum solid electrolytic capacitor according to the embodiment FIG. 3 is a diagram illustrating a comparison with a capacitor and a diagram illustrating a method of measuring external terminal strength.

FIG. 3 is a sectional view and a perspective view of an example of a conventional chip-type solid electrolytic capacitor.

FIG. 4 is a diagram showing a state in which a position shift of an external terminal occurs in a chip-type solid electrolytic capacitor.

FIG. 5 is a perspective view of another example of a conventional chip-type solid electrolytic capacitor.

FIG. 6 is a perspective view of another example of a conventional chip-type solid electrolytic capacitor.

FIG. 7 is a perspective view of another example of a conventional chip-type solid electrolytic capacitor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead wire of anode lead 2 Capacitor element 4 Conductive adhesive 5 Mounting surface 16, 26 Outer resin body 13, 23 External cathode terminal 15, 25 External anode terminal

Claims (7)

(57) [Claims] A solid electrolytic capacitor element and a strip-shaped external anode terminal and an external cathode terminal for electrically connecting the element to the outside are sealed with an insulating exterior resin body. In a resin-sealed chip-type solid electrolytic capacitor having a structure in which one terminal is bent along the surface of the exterior resin body at a position pulled out from the exterior resin body, each of the external anode terminal and the external cathode terminal includes: A portion on the surface of the exterior resin body that is separated in the extension direction of the terminal from the position where the terminal is pulled out from the exterior resin body is provided with a cutout or a notch from the distal end in the extension direction, and the exterior anode body and the exterior anode terminal are provided on the exterior resin body. A chip-type solid electrolytic capacitor characterized in that, at a position corresponding to the notch hole or notch provided in the external cathode terminal, a convex portion that fits into the notch hole or notch is provided. Capacitors. 2. The chip-type solid electrolytic capacitor according to claim 1 , wherein the external anode terminal and the external cathode terminal are respectively pulled out from the columnar capacitor element horizontally in opposite directions along the axis thereof, and the drawing position is provided. It is bent in the vertical direction along the end surface of the exterior resin body, and is a ridge formed by the end surface and the bottom surface of the exterior resin body, and is again bent inward along the bottom surface of the exterior resin body. The notch hole is provided at least in a portion located on the end face of the exterior resin body, and the end face of the exterior resin body has a projection fitted into the notch hole provided in the external anode terminal and the external cathode terminal. A chip-type solid electrolytic capacitor characterized by having a structure including a part. 3. The chip-type solid electrolytic capacitor according to claim 2 , wherein the notch holes provided in each of the external anode terminal and the external cathode terminal are formed from a portion located on an end surface of the package resin body. The convex portion provided on the exterior resin body is formed from the end surface of the exterior resin body, over the ridge formed by the end surface and the bottom surface, and over the bottom surface. A chip-type solid electrolytic capacitor characterized in that: 4. The chip-type solid electrolytic capacitor according to claim 2 , wherein the notch holes provided in each of the external anode terminal and the external cathode terminal have a portion located on an end face of the exterior resin body and the exterior resin. The protrusions provided on the exterior resin body are cut off from the external anode terminal and the external cathode terminal on the end surface and the bottom surface of the exterior resin body. A chip-type solid electrolytic capacitor formed independently at a position corresponding to a notch hole. 5. The chip-type solid electrolytic capacitor according to claim 1 , wherein the cuts provided in each of the external anode terminal and the external cathode terminal are formed from the front end in the extension direction located on the bottom surface of the package resin body. The convex portion provided on the exterior resin body extends from an end surface of the exterior resin body, over a ridge formed by the end surface and the bottom surface, and has a bottom surface. A chip-type solid electrolytic capacitor characterized by being formed over a period of time. 6. The chip-type solid electrolytic capacitor according to claim 1 , wherein each of said external anode terminal and said external cathode terminal has a width.
Formed with a fixed metal strip,
Place the strip plate on the bottom of the exterior resin
Pull out out of the plane, bend along the bottom of the exterior resin body,
A terminal part for connecting to the outside from the bending position
Chip type solid electrolytic capacitor, characterized in that the the. 7. The chip-type solid electrolytic capacitor according to claim 6 , wherein said external anode terminal has a metal strip and said cathode has an external cathode terminal.
The metal band of the child is pulled out of each band of the exterior resin body.
Bending from the bottom surface along the surface that intersects the bottom surface
Chip type solid electrolytic capacitor characterized in that it is.