KR940005608Y1 - Carrier for wafer transfer - Google Patents
Carrier for wafer transfer Download PDFInfo
- Publication number
- KR940005608Y1 KR940005608Y1 KR2019910012887U KR910012887U KR940005608Y1 KR 940005608 Y1 KR940005608 Y1 KR 940005608Y1 KR 2019910012887 U KR2019910012887 U KR 2019910012887U KR 910012887 U KR910012887 U KR 910012887U KR 940005608 Y1 KR940005608 Y1 KR 940005608Y1
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- main body
- carrier
- seating groove
- wafer transfer
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
Abstract
내용 없음.No content.
Description
제1도는 본 고안의 정면도.1 is a front view of the present invention.
제2도는 제1도의 A-A선 단면도.2 is a sectional view taken along the line A-A of FIG.
제3도는 제2도의 "B"부 사시도.3 is a perspective view of the "B" part of FIG.
제4도는 종래 캐리어의 평면도.4 is a plan view of a conventional carrier.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 본체 2 : 걸림편1: body 2: hook
3 : 웨이퍼 4 : 안착홈3: wafer 4: mounting groove
본 고안은 반도체 제조공정, 특히 웨이퍼의 검사 또는 테스트 공정에서 사용하는 웨이퍼 이송용 캐리어에 관한 것으로, 캐리어 본체에 진동에 가해져도 본체내에 적재된 웨이퍼가 유동하거나 이탈하는 것을 방지할수 있도록 한것이다.The present invention relates to a wafer transport carrier used in a semiconductor manufacturing process, in particular, a wafer inspection or test process, to prevent the wafer loaded in the main body from flowing or escaping even if the carrier body is subjected to vibration.
웨이퍼의 검사 또는 테스트 공정에서 사용되어온 종래의 캐리어는 제4도에 도시한 바와 같이 일측에 개방된 본체(1)의 내부 양측면에 다수의 걸림편(2)을 좌, 우로 대향되게 형성한 구조로 되어 있으며, 상기 각 걸림편(2)위에 웨이퍼(3)가 얹혀진 본체(1)를 시스템 인덱서(System Indexer)로 이동시키고 이송기구를 작동시키면 로보트등의 기구에 의재 적재된 웨이퍼가 한장씩 다음공정으로 이송된다.The conventional carrier which has been used in the inspection or testing process of the wafer has a structure in which a plurality of engaging pieces 2 are formed to face left and right on both inner sides of the main body 1 open to one side as shown in FIG. When the main body 1 on which the wafers 3 are placed on each of the engaging pieces 2 is moved to a system indexer and the transfer mechanism is operated, the wafers loaded on the robot or the like go one by one. Transferred.
즉, 본체(1)내에 다수의 웨이퍼(3)가 적재된 상태에서 본체(1)의 저면이 시스템 인덱서에 밀착되도록 위치시키고 이송기구를 작동시키면 별도의 이송장치(도시는 생략함)에 의해 본체가 한스텝(웨이퍼의 적층간격과 같음)씩 하강을 하게 되며, 이때 로보트등의 기구에 의해 작동하는 작동아암(도시는 생략함)은 걸림편(2)위에 얹혀진 웨이퍼(3)를 약간 상방으로 들어올려 전방으로 인출한후 다음 공정으로 차례로 보내준다.That is, when a plurality of wafers 3 are loaded in the main body 1 and the bottom surface of the main body 1 is placed in close contact with the system indexer, and the transfer mechanism is operated, the main body is separated by a separate transfer device (not shown). Is lowered by one step (same as the stacking interval of wafers), and the operating arm (not shown) operated by a mechanism such as a robot moves the wafer 3 placed on the latching piece 2 slightly upward. Lift it up, withdraw it to the front and send it to the next step in turn.
그러나 상기한 종래의 캐리어는 단지 본체(1)의 양측면에 걸림편(2)만을 형성한 구조이기 때문에 본체가 이송장치에 의해 한스텝씩 하강함에 따라 본체에 진동이 가해지는 경우 제4도의 일점쇄선도시와 같이 걸림편위에 얹혀진 웨이퍼가 입구부분(전방)으로 미그러져 나오기 쉽고, 이러한 경우 웨이퍼를 꺼내는 작동아암과 간섭을 일으켜 잼(Jam)과 같은 작동에러가 발생하는 문제가 있다.However, the above-described conventional carrier has a structure in which only the engaging pieces 2 are formed on both sides of the main body 1, so that the vibration is applied to the main body as the main body descends by one step by the transfer device. As shown in the figure, the wafer placed on the latching piece is easily protruded toward the inlet (front), and in this case, there is a problem that an operation error such as jam occurs due to interference with the operation arm for taking out the wafer.
본 고안의 목적은 캐리어 본체에 진동이 가해져도 웨이퍼가 미끄러지지 않고 적재된 본래의 위치를 유지할수 있는 웨이퍼 이송용 캐리어를 제공하기 위한 것이다. 상기와 같은 목적을 달성하기 위한 본 고안의 일실시예에 따라 캐리어 본체의 양측벽에 형성된 걸리편에는 웨이퍼가 얹혀 삽입될수 있는 형상의 안착홈이 형성되어 있으며, 웨이퍼가 상기 안착홈내에 삽입됨에 따라 본체에 진동이 가해져도 웨이퍼는 유동하지 않게 된다.An object of the present invention is to provide a carrier for wafer transfer that can maintain the original position of the wafer without slipping even when vibration is applied to the carrier body. According to one embodiment of the present invention for achieving the above object, a gripping piece formed on both side walls of the carrier main body has a seating groove having a shape in which a wafer can be inserted and formed, and as a wafer is inserted into the seating groove. Even if vibration is applied to the main body, the wafer does not flow.
이하 본 고안을 일실시예로 도시한 첨부된 도면 제1도 및 제2도를 참고로하여 더욱 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in more detail with reference to FIGS. 1 and 2 of the accompanying drawings.
첨부도면 제1도는 본 고안의 정면도이고, 제2도는 제1도의 A-A선 단면도로서, 일측이 개방된 본체(1)의 내부 양측면에 상호 대향되게 걸림편(2)(통상 25개 정도)이 일정간격으로 형성되어 있고, 걸림편(2)의 안쪽에는 본체(1)의 이송시에 걸림편(2)상에 얹혀진 웨이퍼(3)가 개방부측으로 미끄러지는 것을 방지하기 위한 안착홈(4)이 제3도와 같이 형성되어 있는데, 이때 안착홈(4)의 깊이는 웨이퍼 두께×3/5 정도가 가장 바람직하며 안착홈(4)에 웨이퍼(3)를 안착시켰을 때의 간격(S)은 웨이퍼(3)보다 약간 크게 형성된다.FIG. 1 is a front view of the present invention, and FIG. 2 is a cross-sectional view taken along line AA of FIG. 1, and the locking pieces 2 (usually about 25) are fixed so as to face each other both sides of the inner body 1 having one side open. It is formed at intervals, and inside the locking piece 2, there is a seating groove 4 for preventing the wafer 3 placed on the locking piece 2 from slipping to the opening side during the transfer of the main body 1. It is formed as shown in FIG. 3, wherein the depth of the seating groove 4 is most preferably about wafer thickness x 3/5, and the spacing S when the wafer 3 is seated in the seating groove 4 is the wafer ( Slightly larger than 3).
이는 안착홈(4)의 깊이가 너무 적을 경우에는 본체(1)의 이송시에 충격으로 인해 웨이퍼(3)가 안착홈(4) 내에서 이탈될 염려가 있고, 또한 깊이가 너무 깊을 경우에는 본체(1)의 안착홈(4)내에 얹혀진 웨이퍼(3)를 분리시킬 때 작동이 원활해 지지 않게 되는 문제점이 있기 때문이다.This is because when the depth of the seating groove 4 is too small, there is a fear that the wafer 3 may be separated from the seating groove 4 due to an impact during transport of the body 1, and when the depth is too deep, This is because there is a problem that the operation is not smooth when the wafer 3 placed in the seating groove 4 of (1) is separated.
또한 웨이퍼와 안착홈(4) 사이에 간격을 약간 크게 형성하는 것을 안착홈(4)에 안착된 웨이퍼를 꺼내는 작업이 용이해지도록 하기 위함이다.In addition, the gap between the wafer and the seating groove 4 is slightly larger in order to facilitate the operation of taking out the wafer seated in the seating groove 4.
이와 같이 구성된 본 고안의 작용효과를 설명하면 다음과 같다.Referring to the effect of the present invention configured as described above are as follows.
먼저 본체(1)에 상호대향되게 형성된 각 걸림편(2)의 안착홈(4)내에 웨이퍼(3)를 안착시킨 상태에서 본체(1)를 시스템 인덱서에 올려 놓으면 안착홈(4)내에 안착된 웨이퍼(3)가 수평을 이루게 된다.First, when the main body 1 is placed on the system indexer while the wafer 3 is seated in the seating groove 4 of each of the engaging pieces 2 formed to face each other, the seat 1 is seated in the seating groove 4. The wafer 3 is horizontal.
이러한 상태에서 본체(1)는 한 스텝씩 하강을 하고 이동아암(도시는 생략함)에 의해 안착홈(4)내에 안착된 웨이퍼(3)는 하나식 순차적으로 이송된다.In this state, the main body 1 descends by one step, and the wafer 3 seated in the seating groove 4 by the moving arm (not shown) is transferred one by one.
이와 같이 본체(1)가 별도의 이송장치에 의해 한 스텝씩 하방으로 이송될때 본체(1)에 충격이 발생되지만 웨이퍼(3)는 걸림편(2)상에 형성된 안착홈(4) 사이에 얹혀져 있어 개방부측으로 유동되지 않게 되는 것이다.In this way, when the main body 1 is transported downward by one step by a separate transfer device, an impact is generated in the main body 1, but the wafer 3 is placed between the seating grooves 4 formed on the engaging pieces 2, There is no flow to the open side.
이상에서와 같이 본 고안은 걸림편(2)상에 웨이퍼(4)에 얹혀질 수 있도록 안착홈(4)을 형성하는 간단한 구조에 의해 본체(1)내에 삽입된 웨이퍼를 이송시 웨이퍼가 개방부측으로 미끄러지는 것을 미연에 방지할수 있게 되므로 동작중 잼(Jam)이 발생되는 것을 방지하게 되는 효과를 가지게 된다.As described above, the present invention has a simple structure that forms a seating groove 4 so that the wafer can be placed on the wafer 4 on the engaging piece 2 when the wafer is transferred into the main body 1 when the wafer is opened. Since it is possible to prevent the sliding to the side in advance, it has an effect of preventing the jam (Jam) is generated during operation.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019910012887U KR940005608Y1 (en) | 1991-08-14 | 1991-08-14 | Carrier for wafer transfer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019910012887U KR940005608Y1 (en) | 1991-08-14 | 1991-08-14 | Carrier for wafer transfer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR930005664U KR930005664U (en) | 1993-03-22 |
| KR940005608Y1 true KR940005608Y1 (en) | 1994-08-19 |
Family
ID=19317843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019910012887U KR940005608Y1 (en) | 1991-08-14 | 1991-08-14 | Carrier for wafer transfer |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR940005608Y1 (en) |
-
1991
- 1991-08-14 KR KR2019910012887U patent/KR940005608Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR930005664U (en) | 1993-03-22 |
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