KR930023430A - Epoxy Resin Powder Coating Composition - Google Patents

Epoxy Resin Powder Coating Composition Download PDF

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Publication number
KR930023430A
KR930023430A KR1019930007866A KR930007866A KR930023430A KR 930023430 A KR930023430 A KR 930023430A KR 1019930007866 A KR1019930007866 A KR 1019930007866A KR 930007866 A KR930007866 A KR 930007866A KR 930023430 A KR930023430 A KR 930023430A
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KR
South Korea
Prior art keywords
epoxy resin
weight
parts
fine powder
noblock
Prior art date
Application number
KR1019930007866A
Other languages
Korean (ko)
Other versions
KR0146384B1 (en
Inventor
이끼라 야스다
쯔또무 야마구찌
요시히사 후지모또
Original Assignee
요꼬떼 아라아끼
소마루 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 요꼬떼 아라아끼, 소마루 가부시끼가이샤 filed Critical 요꼬떼 아라아끼
Publication of KR930023430A publication Critical patent/KR930023430A/en
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Publication of KR0146384B1 publication Critical patent/KR0146384B1/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C09D163/04Epoxynovolacs
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/03Powdery paints
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/934Powdered coating composition

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

비스 페놀형 에폭시수지와 노블락형 에폭시수지로 이루어지는 혼합 에폭시수지와 하기식(Ⅰ)Mixed epoxy resin composed of bisphenol epoxy resin and noblock epoxy resin and the following formula (Ⅰ)

(식중, n은 0~8의 정수로 나타낸다.) 로 표시되는 디페닐 유도체로 이루어지는 경화제와, 용점이 200℃이상이며, 평균입경이 18∼50㎛인 나일론 미세분말과 실리카 미세분말을 배합한 것으로 이루어지고, 이 융점 에폭시 수지 100중량부당 나일론 미세분말의 배합량이 5∼30중량부 및 실리카 미세분말의 배합량이 100∼200중량부인 것을 특징으로 하는 가용성 에폭시수지 분체 도료 조성물.(Wherein n is represented by an integer of 0 to 8). A curing agent composed of a diphenyl derivative represented by formula (I) and a nylon fine powder having a melting point of 200 ° C. or more and an average particle diameter of 18 to 50 μm and a silica fine powder are blended. A soluble epoxy resin powder coating composition, comprising: 5 to 30 parts by weight of the nylon fine powder and 100 to 200 parts by weight of the silica fine powder per 100 parts by weight of the melting point epoxy resin.

Description

에폭시 수지 분체 도료 조성물Epoxy Resin Powder Coating Composition

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (3)

에폭시당 180∼2500의 중량을 갖는 비스페놀형 에폭시 수지 40∼80중량 %와 에폭시당 180∼230의 중량을 갖는 노블락형 에폭시수지 60∼20중량%로 이루어지는 혼합 에폭시수지 100중량부 : 혼합 에폭시수지의 에폭시기 1당량당 0.6∼1.5당량의 하기식(Ⅰ)100 parts by weight of a mixed epoxy resin comprising 40 to 80% by weight of a bisphenol type epoxy resin having a weight of 180 to 2500 per epoxy and 60 to 20% by weight of a noblock type epoxy resin having a weight of 180 to 230 per epoxy: 0.6-1.5 equivalents of the following formula (1) (식중, n은 0∼8의 정수를 나타낸다) 로 표시되는 디페닐 유도체를 함유하는 경화제 ; 경화 촉진제 0.2∼5중량부 ; 융점이 200℃이상이며, 평균입경이 18∼50㎛인 나일론 미세분말 5∼30중량부 ; 및 평균 입경이 1∼50㎛인 실리카 미세분말 100∼200중량부를 포함하는 에폭시수지 분체도료 조성물.A curing agent containing a diphenyl derivative represented by (wherein n represents an integer of 0 to 8); 0.2-5 weight part of hardening accelerators; 5-30 weight part of nylon fine powders whose melting | fusing point is 200 degreeC or more and whose average particle diameter is 18-50 micrometers; And 100 to 200 parts by weight of silica fine powder having an average particle diameter of 1 to 50 µm. 제1항에 있어서, 혼합 에폭시수지가 에폭시당 350∼1000의 중량을 갖는 조성물.The composition of claim 1 wherein the mixed epoxy resin has a weight of 350-1000 per epoxy. 제1항 또는 2항에 있어서, 비스페놀형 에폭시수지가 비스페놀 A형 에폭시수지이며, 노블락형 에폭시수지가 크레졸형 노블락 에폭시수지인 조성물.The composition according to claim 1 or 2, wherein the bisphenol type epoxy resin is a bisphenol A type epoxy resin, and the noblock type epoxy resin is a cresol type noblock epoxy resin. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019930007866A 1992-07-10 1993-05-07 Epoxy resin powder coating composition KR0146384B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP92-207605 1992-07-10
JP4207605A JP2580444B2 (en) 1992-07-10 1992-07-10 Flexible epoxy resin composition
JP92-207,605 1992-07-10

Publications (2)

Publication Number Publication Date
KR930023430A true KR930023430A (en) 1993-12-18
KR0146384B1 KR0146384B1 (en) 1998-08-01

Family

ID=16542550

Family Applications (1)

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KR1019930007866A KR0146384B1 (en) 1992-07-10 1993-05-07 Epoxy resin powder coating composition

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JP (1) JP2580444B2 (en)
KR (1) KR0146384B1 (en)
CN (1) CN1042343C (en)
TW (1) TW227012B (en)

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JP2952397B2 (en) * 1994-08-23 1999-09-27 科学技術庁航空宇宙技術研究所長 Active air control aircraft using air speed vector measurement device
KR100710503B1 (en) * 1999-12-30 2007-04-23 주식회사 케이씨씨 Thermosetting powder coating composition for high temperature multilayer pipeline coating primer
KR100647891B1 (en) * 1999-12-30 2006-11-17 주식회사 케이씨씨 Multifunctional phenolic curing agent for epoxy resin type powder coating compositions
KR20010103196A (en) * 2000-05-04 2001-11-23 임무현 Eopoxy resin curing agent having hydroxy group and epoxy resin powder coating composition containing same
CN1312190C (en) * 2002-11-11 2007-04-25 西北工业大学 Resinoid phenols solidified agent and preparation method
CN100345921C (en) * 2004-03-24 2007-10-31 中央硝子株式会社 Coating material and mirror coated therewith
CN1330721C (en) * 2005-11-11 2007-08-08 淄博广通化工有限责任公司 Novel nylon powder coating and its preparation method
DE102006005807A1 (en) 2006-02-08 2007-08-16 BSH Bosch und Siemens Hausgeräte GmbH Filter element for extractor hood
JP5040404B2 (en) * 2007-04-04 2012-10-03 三菱化学株式会社 Epoxy resin composition for sealing material, cured product thereof and semiconductor device
CN101519544B (en) * 2009-04-03 2012-08-22 丹阳市科瑞特粉末新材料有限公司 Ultra-low temperature epoxy resin nylon hybrid thermosetting powder coating and method for preparing same
CN101608091B (en) * 2009-07-07 2011-06-01 宁波市派特勒粉末涂料有限公司 Low-temperature curing heavy-duty anticorrosion powder coating
CN101709195A (en) * 2009-12-25 2010-05-19 广州擎天实业有限公司 Pure epoxy powder coating for coating bakelite board and preparation method thereof
WO2012036091A1 (en) * 2010-09-13 2012-03-22 住友金属鉱山株式会社 Primer composition
CN102161859A (en) * 2011-05-27 2011-08-24 常州市飞扬粉末涂料有限公司 Modified epoxy heavy-duty anticorrosion powder paint and preparation method thereof
CN103382354B (en) * 2013-07-08 2015-06-17 吴江华诚复合材料科技有限公司 Anticorrosive and antibacterial novolac epoxy resin powdery paint
CN103666203B (en) * 2013-11-08 2016-05-11 洛阳双瑞防腐工程技术有限公司 A kind of low temperature fast curable epoxy powdery paints and preparation method thereof
CN104745048A (en) * 2013-12-31 2015-07-01 天津市凯华绝缘材料有限公司 Halogen-free flame retardant epoxy resin powder coating used for coating magnetic ring
JP6342696B2 (en) * 2014-04-23 2018-06-13 ソマール株式会社 Powder coating material and method for producing coating film using powder coating material
KR101734711B1 (en) * 2015-12-08 2017-05-12 주식회사 케이씨씨 Powdered paint composition for vaccum plating undercoating having heat resistance and molded article comprisng a cured coating layer formed from the same
JP7047243B2 (en) * 2016-02-12 2022-04-05 富士電機株式会社 Resin composition and electronic components
CN112625554A (en) * 2020-12-17 2021-04-09 重庆海联水性涂料有限公司 Water-based double-component environment-friendly insulating anticorrosive paint for inner wall of transformer and preparation method thereof

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* Cited by examiner, † Cited by third party
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JPS5882544A (en) * 1981-11-12 1983-05-18 Toshiba Corp Resin sealed type semiconductor device
JPS60201650A (en) * 1984-03-27 1985-10-12 Toshiba Corp Manufacture of epoxy resin molding material for semiconductor
JPS63148664A (en) * 1986-12-11 1988-06-21 Nitto Electric Ind Co Ltd Semiconductor device
JPH0627181B2 (en) * 1988-02-16 1994-04-13 ソマール株式会社 Flexible epoxy resin composition
CN1051050A (en) * 1989-10-20 1991-05-01 天津市合成材料工业研究所 Preparation of insulation coating of high-voltage electric apparatus

Also Published As

Publication number Publication date
TW227012B (en) 1994-07-21
CN1042343C (en) 1999-03-03
KR0146384B1 (en) 1998-08-01
JPH0641278A (en) 1994-02-15
JP2580444B2 (en) 1997-02-12
CN1082578A (en) 1994-02-23

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