KR930023430A - Epoxy Resin Powder Coating Composition - Google Patents
Epoxy Resin Powder Coating Composition Download PDFInfo
- Publication number
- KR930023430A KR930023430A KR1019930007866A KR930007866A KR930023430A KR 930023430 A KR930023430 A KR 930023430A KR 1019930007866 A KR1019930007866 A KR 1019930007866A KR 930007866 A KR930007866 A KR 930007866A KR 930023430 A KR930023430 A KR 930023430A
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- weight
- parts
- fine powder
- noblock
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/03—Powdery paints
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
- Y10S525/934—Powdered coating composition
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
비스 페놀형 에폭시수지와 노블락형 에폭시수지로 이루어지는 혼합 에폭시수지와 하기식(Ⅰ)Mixed epoxy resin composed of bisphenol epoxy resin and noblock epoxy resin and the following formula (Ⅰ)
(식중, n은 0~8의 정수로 나타낸다.) 로 표시되는 디페닐 유도체로 이루어지는 경화제와, 용점이 200℃이상이며, 평균입경이 18∼50㎛인 나일론 미세분말과 실리카 미세분말을 배합한 것으로 이루어지고, 이 융점 에폭시 수지 100중량부당 나일론 미세분말의 배합량이 5∼30중량부 및 실리카 미세분말의 배합량이 100∼200중량부인 것을 특징으로 하는 가용성 에폭시수지 분체 도료 조성물.(Wherein n is represented by an integer of 0 to 8). A curing agent composed of a diphenyl derivative represented by formula (I) and a nylon fine powder having a melting point of 200 ° C. or more and an average particle diameter of 18 to 50 μm and a silica fine powder are blended. A soluble epoxy resin powder coating composition, comprising: 5 to 30 parts by weight of the nylon fine powder and 100 to 200 parts by weight of the silica fine powder per 100 parts by weight of the melting point epoxy resin.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
Claims (3)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP92-207605 | 1992-07-10 | ||
JP4207605A JP2580444B2 (en) | 1992-07-10 | 1992-07-10 | Flexible epoxy resin composition |
JP92-207,605 | 1992-07-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR930023430A true KR930023430A (en) | 1993-12-18 |
KR0146384B1 KR0146384B1 (en) | 1998-08-01 |
Family
ID=16542550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930007866A KR0146384B1 (en) | 1992-07-10 | 1993-05-07 | Epoxy resin powder coating composition |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2580444B2 (en) |
KR (1) | KR0146384B1 (en) |
CN (1) | CN1042343C (en) |
TW (1) | TW227012B (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2952397B2 (en) * | 1994-08-23 | 1999-09-27 | 科学技術庁航空宇宙技術研究所長 | Active air control aircraft using air speed vector measurement device |
KR100710503B1 (en) * | 1999-12-30 | 2007-04-23 | 주식회사 케이씨씨 | Thermosetting powder coating composition for high temperature multilayer pipeline coating primer |
KR100647891B1 (en) * | 1999-12-30 | 2006-11-17 | 주식회사 케이씨씨 | Multifunctional phenolic curing agent for epoxy resin type powder coating compositions |
KR20010103196A (en) * | 2000-05-04 | 2001-11-23 | 임무현 | Eopoxy resin curing agent having hydroxy group and epoxy resin powder coating composition containing same |
CN1312190C (en) * | 2002-11-11 | 2007-04-25 | 西北工业大学 | Resinoid phenols solidified agent and preparation method |
CN100345921C (en) * | 2004-03-24 | 2007-10-31 | 中央硝子株式会社 | Coating material and mirror coated therewith |
CN1330721C (en) * | 2005-11-11 | 2007-08-08 | 淄博广通化工有限责任公司 | Novel nylon powder coating and its preparation method |
DE102006005807A1 (en) | 2006-02-08 | 2007-08-16 | BSH Bosch und Siemens Hausgeräte GmbH | Filter element for extractor hood |
JP5040404B2 (en) * | 2007-04-04 | 2012-10-03 | 三菱化学株式会社 | Epoxy resin composition for sealing material, cured product thereof and semiconductor device |
CN101519544B (en) * | 2009-04-03 | 2012-08-22 | 丹阳市科瑞特粉末新材料有限公司 | Ultra-low temperature epoxy resin nylon hybrid thermosetting powder coating and method for preparing same |
CN101608091B (en) * | 2009-07-07 | 2011-06-01 | 宁波市派特勒粉末涂料有限公司 | Low-temperature curing heavy-duty anticorrosion powder coating |
CN101709195A (en) * | 2009-12-25 | 2010-05-19 | 广州擎天实业有限公司 | Pure epoxy powder coating for coating bakelite board and preparation method thereof |
WO2012036091A1 (en) * | 2010-09-13 | 2012-03-22 | 住友金属鉱山株式会社 | Primer composition |
CN102161859A (en) * | 2011-05-27 | 2011-08-24 | 常州市飞扬粉末涂料有限公司 | Modified epoxy heavy-duty anticorrosion powder paint and preparation method thereof |
CN103382354B (en) * | 2013-07-08 | 2015-06-17 | 吴江华诚复合材料科技有限公司 | Anticorrosive and antibacterial novolac epoxy resin powdery paint |
CN103666203B (en) * | 2013-11-08 | 2016-05-11 | 洛阳双瑞防腐工程技术有限公司 | A kind of low temperature fast curable epoxy powdery paints and preparation method thereof |
CN104745048A (en) * | 2013-12-31 | 2015-07-01 | 天津市凯华绝缘材料有限公司 | Halogen-free flame retardant epoxy resin powder coating used for coating magnetic ring |
JP6342696B2 (en) * | 2014-04-23 | 2018-06-13 | ソマール株式会社 | Powder coating material and method for producing coating film using powder coating material |
KR101734711B1 (en) * | 2015-12-08 | 2017-05-12 | 주식회사 케이씨씨 | Powdered paint composition for vaccum plating undercoating having heat resistance and molded article comprisng a cured coating layer formed from the same |
JP7047243B2 (en) * | 2016-02-12 | 2022-04-05 | 富士電機株式会社 | Resin composition and electronic components |
CN112625554A (en) * | 2020-12-17 | 2021-04-09 | 重庆海联水性涂料有限公司 | Water-based double-component environment-friendly insulating anticorrosive paint for inner wall of transformer and preparation method thereof |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5882544A (en) * | 1981-11-12 | 1983-05-18 | Toshiba Corp | Resin sealed type semiconductor device |
JPS60201650A (en) * | 1984-03-27 | 1985-10-12 | Toshiba Corp | Manufacture of epoxy resin molding material for semiconductor |
JPS63148664A (en) * | 1986-12-11 | 1988-06-21 | Nitto Electric Ind Co Ltd | Semiconductor device |
JPH0627181B2 (en) * | 1988-02-16 | 1994-04-13 | ソマール株式会社 | Flexible epoxy resin composition |
CN1051050A (en) * | 1989-10-20 | 1991-05-01 | 天津市合成材料工业研究所 | Preparation of insulation coating of high-voltage electric apparatus |
-
1992
- 1992-07-10 JP JP4207605A patent/JP2580444B2/en not_active Expired - Fee Related
-
1993
- 1993-04-21 TW TW082103049A patent/TW227012B/zh active
- 1993-05-07 KR KR1019930007866A patent/KR0146384B1/en not_active IP Right Cessation
- 1993-05-19 CN CN93107227A patent/CN1042343C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW227012B (en) | 1994-07-21 |
CN1042343C (en) | 1999-03-03 |
KR0146384B1 (en) | 1998-08-01 |
JPH0641278A (en) | 1994-02-15 |
JP2580444B2 (en) | 1997-02-12 |
CN1082578A (en) | 1994-02-23 |
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A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20020910 Year of fee payment: 5 |
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LAPS | Lapse due to unpaid annual fee |