KR930015986A - 다층식 전자 조립체의 패키징을 위한 조립 시스템 - Google Patents

다층식 전자 조립체의 패키징을 위한 조립 시스템 Download PDF

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Publication number
KR930015986A
KR930015986A KR1019920021838A KR920021838A KR930015986A KR 930015986 A KR930015986 A KR 930015986A KR 1019920021838 A KR1019920021838 A KR 1019920021838A KR 920021838 A KR920021838 A KR 920021838A KR 930015986 A KR930015986 A KR 930015986A
Authority
KR
South Korea
Prior art keywords
cover
plate
multilayer electronic
electronic assembly
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019920021838A
Other languages
English (en)
Korean (ko)
Inventor
에이.존슨 로버트
오. 모린 아쿠스틴
비. 피들러 데이비드
Original Assignee
빈센트 비. 인그라시아
모토로라 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 빈센트 비. 인그라시아, 모토로라 인코포레이티드 filed Critical 빈센트 비. 인그라시아
Publication of KR930015986A publication Critical patent/KR930015986A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Telephone Set Structure (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
KR1019920021838A 1991-12-19 1992-11-20 다층식 전자 조립체의 패키징을 위한 조립 시스템 Withdrawn KR930015986A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/810,046 US5227956A (en) 1991-12-19 1991-12-19 Spring mounting of multi-layered electronic assemblies
US810,046 1991-12-19

Publications (1)

Publication Number Publication Date
KR930015986A true KR930015986A (ko) 1993-07-24

Family

ID=25202835

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920021838A Withdrawn KR930015986A (ko) 1991-12-19 1992-11-20 다층식 전자 조립체의 패키징을 위한 조립 시스템

Country Status (8)

Country Link
US (1) US5227956A (enExample)
EP (1) EP0547464A1 (enExample)
JP (1) JPH05275870A (enExample)
KR (1) KR930015986A (enExample)
AU (1) AU2633792A (enExample)
IE (1) IE922712A1 (enExample)
NO (1) NO923922L (enExample)
TW (1) TW239911B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5808863A (en) * 1996-12-10 1998-09-15 Dell U.S.A., L.P. Computer system having quick-detachable recyclable parts and method
US6296258B2 (en) * 1998-06-30 2001-10-02 Polar Design Snowboard shock-absorbing apparatus
US6685369B2 (en) * 2001-12-10 2004-02-03 Andy Lien Housing assembly for membrane keyboard
RU2241704C1 (ru) * 2003-07-14 2004-12-10 Государственное образовательное учреждение высшего профессионального образования "Уфимский государственный нефтяной технический университет" Производные 1,2,4-триазиндионов, обладающие гербицидной активностью
KR100926649B1 (ko) * 2006-07-06 2009-11-16 삼성전자주식회사 결합유닛 및 이를 갖는 휴대용컴퓨터
US9237685B2 (en) 2006-08-18 2016-01-12 Delphi Technologies, Inc. Lightweight audio system for automotive applications and method
US7733659B2 (en) * 2006-08-18 2010-06-08 Delphi Technologies, Inc. Lightweight audio system for automotive applications and method
WO2011138200A1 (en) * 2010-05-06 2011-11-10 Iee International Electronics & Engineering S.A. Input device
JP5337279B1 (ja) * 2012-05-21 2013-11-06 株式会社東芝 電子機器
CN104582390B (zh) * 2013-10-23 2017-09-12 鸿富锦精密工业（深圳）有限公司 电路板固定结构
TWI554178B (zh) * 2013-10-23 2016-10-11 鴻海精密工業股份有限公司 電路板固定結構
US10605476B2 (en) * 2015-10-26 2020-03-31 Wenzhou Mtlc Electric Appliances Co., Ltd Monitoring circuit and monitoring apparatus including the monitoring circuit

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2867405A (en) * 1953-11-06 1959-01-06 Lear Inc Instrument shock mount
US3668476A (en) * 1970-09-11 1972-06-06 Seeburg Corp Self-locking enclosure for electronic circuitry and method of assembling the same
US4375584A (en) * 1980-10-06 1983-03-01 Siemens Corporation Modular telephone keyset structure
DE3305968A1 (de) * 1983-02-21 1984-08-23 Hagenuk GmbH, 2300 Kiel Modulsystem fuer fernsprechgeraete
US4491695A (en) * 1983-04-20 1985-01-01 Northern Telecom Limited Mounting for a dial in a telephone set base
US5001603A (en) * 1990-07-27 1991-03-19 Motorola, Inc. Housing assembly with substantially spherical supports

Also Published As

Publication number Publication date
NO923922D0 (no) 1992-10-09
EP0547464A1 (en) 1993-06-23
AU2633792A (en) 1993-06-24
IE922712A1 (en) 1993-06-30
TW239911B (enExample) 1995-02-01
US5227956A (en) 1993-07-13
NO923922L (no) 1993-06-21
JPH05275870A (ja) 1993-10-22

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19921120

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid