KR930012109U - 반도체 조립장치 - Google Patents

반도체 조립장치

Info

Publication number
KR930012109U
KR930012109U KR2019910019667U KR910019667U KR930012109U KR 930012109 U KR930012109 U KR 930012109U KR 2019910019667 U KR2019910019667 U KR 2019910019667U KR 910019667 U KR910019667 U KR 910019667U KR 930012109 U KR930012109 U KR 930012109U
Authority
KR
South Korea
Prior art keywords
assembly device
semiconductor assembly
semiconductor
assembly
Prior art date
Application number
KR2019910019667U
Other languages
English (en)
Other versions
KR940006346Y1 (ko
Inventor
고준수
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019910019667U priority Critical patent/KR940006346Y1/ko
Publication of KR930012109U publication Critical patent/KR930012109U/ko
Application granted granted Critical
Publication of KR940006346Y1 publication Critical patent/KR940006346Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
KR2019910019667U 1991-11-16 1991-11-16 반도체 조립장치 KR940006346Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910019667U KR940006346Y1 (ko) 1991-11-16 1991-11-16 반도체 조립장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910019667U KR940006346Y1 (ko) 1991-11-16 1991-11-16 반도체 조립장치

Publications (2)

Publication Number Publication Date
KR930012109U true KR930012109U (ko) 1993-06-25
KR940006346Y1 KR940006346Y1 (ko) 1994-09-17

Family

ID=19322347

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910019667U KR940006346Y1 (ko) 1991-11-16 1991-11-16 반도체 조립장치

Country Status (1)

Country Link
KR (1) KR940006346Y1 (ko)

Also Published As

Publication number Publication date
KR940006346Y1 (ko) 1994-09-17

Similar Documents

Publication Publication Date Title
DE69231039D1 (de) Halbleiteranordnungzusammenbau
DE69328743T2 (de) Halbleiteranordnung
DE69334253D1 (de) Halbleitervorrichtung
DE69325951T2 (de) Halbleitervorrichtung
DE69132354D1 (de) Halbleitervorrichtung
DE69223484D1 (de) Vertikale Halbleiteranordnung
DE69229546T2 (de) Halbleiteranordnung
DE69233266D1 (de) HEMT-Halbleiterbauelement
DE69332857D1 (de) Halbleitervorrichtung.
DE69400694D1 (de) Halbleitervorrichtung
DE69131118T2 (de) Halbleitereinheit
DE69124399D1 (de) Halbleitervorrichtung
DE69226742T2 (de) Halbleitervorrichtung
KR930009747U (ko) 반도체장치
DE69127494D1 (de) Halbleiteranordnung
DE69223017D1 (de) Verbindungshalbleiterbauelement
DE4496282T1 (de) Halbleiter-Einrichtung
DE69210935D1 (de) Halbleiteranordnung
DE69325181T2 (de) Halbleitervorrichtung
DE69202363T2 (de) Halbleiteranordnung.
NO954863D0 (no) Halvlederanordning
DE69227663T2 (de) Halbleitereinrichtung
DE69128297T2 (de) Halbleiterbauelement
KR930012109U (ko) 반도체 조립장치
DE69217326T2 (de) Verbindungshalbleiterbauelement

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20040820

Year of fee payment: 11

LAPS Lapse due to unpaid annual fee