KR930009038A - Semiconductor device and sealing method and device - Google Patents

Semiconductor device and sealing method and device Download PDF

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Publication number
KR930009038A
KR930009038A KR1019910018335A KR910018335A KR930009038A KR 930009038 A KR930009038 A KR 930009038A KR 1019910018335 A KR1019910018335 A KR 1019910018335A KR 910018335 A KR910018335 A KR 910018335A KR 930009038 A KR930009038 A KR 930009038A
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KR
South Korea
Prior art keywords
sealing
semiconductor device
package
resin
glass
Prior art date
Application number
KR1019910018335A
Other languages
Korean (ko)
Other versions
KR940008330B1 (en
Inventor
김구성
김진호
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019910018335A priority Critical patent/KR940008330B1/en
Publication of KR930009038A publication Critical patent/KR930009038A/en
Application granted granted Critical
Publication of KR940008330B1 publication Critical patent/KR940008330B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Abstract

이 발명은 고체촬상소자(charge coupled device)패케이지와 글래스 리드(glass lid)를 봉합(sealing)하는 방법 및 그 장치에 관한 것으로, 특히 광경화성 에폭시를 사용하여 글래스 리드에 상기 에폭시를 도포하는 공정을 줄여 공정을 단순화하고 자동화하여 인라인(in-line)화 함으로써 생산성을 향상시키고 클립을 사용하지 않아 글스 리드의 긁힘을 방지할 수 있게 된다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and a device for sealing a solid-state imaging device package and a glass lid, and in particular, a process of applying the epoxy to a glass lead using photocurable epoxy. By reducing the cost, the process can be simplified, automated, and in-line, which improves productivity and prevents scratching of the glass lids without the use of clips.

Description

반도체장치의 봉합(sealing)방법과 그 장치Sealing method of semiconductor device and device therefor

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 이 발명에 따라 글래스 리드(glass lid)가 봉합된 고체촬상소자 패캐이지의 단면도1 is a cross-sectional view of a solid-state imaging device package in which a glass lid is sealed according to the present invention.

제2도는 이 발명에 따라 고체촬상소자를 봉합하는 장치의 개략도이다2 is a schematic diagram of an apparatus for sealing a solid state image pickup device according to the present invention.

Claims (11)

반도체장치의 봉합(sealing)방법에 있어서, 고체촬상소자 패캐이지의 소정영역에 경화성 수지를 도포하는 공정과, 글래스 리드를 집은후 상기 패케이지에 도포된 상기 수지의 상부에 상기 글래스 리드를 올려놓고 상기 글래스 리드와 수지를 밀착되게 하는 공정과, 상기 패케이지에 도포된 수지를 광경화하여 상기 글래스 리드와 패케이지를 고착시키는 공정과, 러더상부의 보우트에 탑재된 패케이지를 이송하는 공정을 포함하여 이루어지는 반도체장치의 봉합(sealing)방법.A method of sealing a semiconductor device, comprising: applying a curable resin to a predetermined region of a solid state imaging device package, picking a glass lead, and then placing the glass lead on top of the resin applied to the package. Placing the glass lid and the resin in close contact with each other; photocuring the resin applied to the package; fixing the glass lead and the package; and transferring the package mounted on the boat on the upper rudder. Sealing (sealing) method of a semiconductor device comprising a. 제1항에 있어서, 경화성 수지는 광경화성 에폭시임을 특징으로 하는 반도체장치의 봉합(sealing)방법.The method of sealing a semiconductor device according to claim 1, wherein the curable resin is a photocurable epoxy. 제2항에 있어서, 경화성 수지는 자외선에 경화됨을 특징으로 하는 반도체장치의 봉합(sealing)방법.The method of sealing a semiconductor device according to claim 2, wherein the curable resin is cured by ultraviolet rays. 제1항에 있어서, 경화성 수지는 패케이지의 홈주위에 도포됨을 특징으로 하는 반도체장치의 봉합(sealing)방법.The method of sealing a semiconductor device according to claim 1, wherein the curable resin is applied around the groove of the package. 제1항에 있어서, 글래스 리드는 진공시스템에 의하여 집어져 경화성 수지의 상부에 올려놓게 됨을 특징으로 하는 반도체장치의 봉합(sealing)방법.The method of sealing a semiconductor device according to claim 1, wherein the glass lead is picked up by a vacuum system and placed on top of the curable resin. 제1항에 있어서, 글래스 리드는 로러(Roller) 또는 에어건(air gun)에 의하여 수지와 밀착하게 됨을 특징으로 하는 반도체장치의 봉합(sealing)방법.The method of sealing a semiconductor device according to claim 1, wherein the glass lead is brought into close contact with the resin by a roller or an air gun. 제1항에 있어서, 경화부는 수지를 5~30초 동안 자외선 노광하여 경화시키게 함을 특징으로 하는 반도체장치의 봉합(sealing)방법.The sealing method of claim 1, wherein the curing unit causes the resin to be cured by ultraviolet exposure for 5 to 30 seconds. 제1항에 있어서, 패케이지의 홈은 상기 홈에 도포된 수지와 글래스 리드의 밀착을 양호하게 함을 특징으로 하는 반도체장치의 봉합(sealing)방법.2. The method of sealing a semiconductor device according to claim 1, wherein the groove of the package improves adhesion between the resin applied to the groove and the glass lead. 반도체장치의 봉합(sealing)방법에 있어서, 다수개의 전하결합소자 패케이지가 탑재될 수 있는 보우트를 이동시키는 로더와, 상기 보우트에 탑재되는 패캐이지의 소정영역에 경화성 수지를 도포하는 도포기와, 상기 도포기를 조절하는 조절부와, 다수개의 글래스 리드가 놓여질수 있는 트레이와, 상기 트레이상의 글래스 리드와 패케이지에 도포된 수지를 밀착시키는 수단과 상기 수지를 광경화시키는 노광부를 포함하여 이루어지는 반도체장치의 봉합(sealing)장치.A sealing method for a semiconductor device, comprising: a loader for moving a boat on which a plurality of charge-coupled device packages can be mounted, an applicator for applying a curable resin to a predetermined area of the package mounted on the boat, and Sealing of a semiconductor device comprising a control unit for adjusting the applicator, a tray in which a plurality of glass lids can be placed, a means for closely contacting the resin applied to the glass lid and the package on the tray, and an exposure unit for photocuring the resin. (sealing) device. 제9항에 있어서, 도포기는 1개 또는 2개 이상의 도포기로 구성됨을 특징으로 하는 반도체장치의 봉합(sealing)장치.10. The sealing device according to claim 9, wherein the applicator is composed of one or two or more applicators. 제9항에 있어서, 픽업부는 글래스 리드를 1개 또는 2개 이상의 단위로 집어지게 함을 특징으로 하는 반도체장치의 봉합(sealing)장치.10. The sealing device according to claim 9, wherein the pick-up unit picks up the glass leads in one or two or more units. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019910018335A 1991-10-17 1991-10-17 Method of sealing semiconductor device and sealing apparatus therefor KR940008330B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019910018335A KR940008330B1 (en) 1991-10-17 1991-10-17 Method of sealing semiconductor device and sealing apparatus therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910018335A KR940008330B1 (en) 1991-10-17 1991-10-17 Method of sealing semiconductor device and sealing apparatus therefor

Publications (2)

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KR930009038A true KR930009038A (en) 1993-05-22
KR940008330B1 KR940008330B1 (en) 1994-09-12

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KR1019910018335A KR940008330B1 (en) 1991-10-17 1991-10-17 Method of sealing semiconductor device and sealing apparatus therefor

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100405272B1 (en) * 2001-10-18 2003-11-12 주식회사 코스타트반도체 Quad Flat No-lead semiconductor package
KR100485342B1 (en) * 1997-12-12 2005-08-23 삼성전자주식회사 Apparatus for encapsulating lid of ceramic package
KR100520412B1 (en) * 1999-01-14 2005-10-12 삼성전자주식회사 Cover lid sealing apparatus for fabricating a semiconductor package

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100485342B1 (en) * 1997-12-12 2005-08-23 삼성전자주식회사 Apparatus for encapsulating lid of ceramic package
KR100520412B1 (en) * 1999-01-14 2005-10-12 삼성전자주식회사 Cover lid sealing apparatus for fabricating a semiconductor package
KR100405272B1 (en) * 2001-10-18 2003-11-12 주식회사 코스타트반도체 Quad Flat No-lead semiconductor package

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Publication number Publication date
KR940008330B1 (en) 1994-09-12

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