KR930006159Y1 - Conveying system for semiconductor wafer - Google Patents

Conveying system for semiconductor wafer Download PDF

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Publication number
KR930006159Y1
KR930006159Y1 KR2019910002156U KR910002156U KR930006159Y1 KR 930006159 Y1 KR930006159 Y1 KR 930006159Y1 KR 2019910002156 U KR2019910002156 U KR 2019910002156U KR 910002156 U KR910002156 U KR 910002156U KR 930006159 Y1 KR930006159 Y1 KR 930006159Y1
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South Korea
Prior art keywords
pusher
carrier
wafer
shaft
fixed
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KR2019910002156U
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Korean (ko)
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KR920016693U (en
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류도현
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금성일렉트론 주식회사
문정환
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Priority to KR2019910002156U priority Critical patent/KR930006159Y1/en
Publication of KR920016693U publication Critical patent/KR920016693U/en
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Publication of KR930006159Y1 publication Critical patent/KR930006159Y1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

내용 없음.No content.

Description

캐리어의 웨이퍼 이송장치Carrier Wafer Feeder

제1도는 본 고안 장치의 사시도.1 is a perspective view of the device of the present invention.

제2도는 팁의 확대 사시도.2 is an enlarged perspective view of the tip.

제3도는 캐리어의 사시도.3 is a perspective view of a carrier.

제4도는 본 고안 장치의 작동상태 평면도.Figure 4 is a plan view of the operating state of the device.

제5도는 본 고안 장치의 결합상태 종단면도.Figure 5 is a longitudinal cross-sectional view of the coupled state of the device of the present invention.

제6도는 제5도의 A-A선 단면도.6 is a cross-sectional view taken along the line A-A of FIG.

제7도는 종래 장치의 사시도.7 is a perspective view of a conventional apparatus.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 본체 2 : 축1: body 2: shaft

4 : 설치판 5 : 지지편4: mounting plate 5: support piece

7 : 푸셔 9 : 테이프7: pusher 9: tape

10 : 손잡이 14 : 조절나사10: handle 14: adjusting screw

본 고안은 반도체 제조공정중에서 캐리어(Carrier)에 담겨진 웨이퍼(Water)를 빈 캐리어로 이송시키기 위한 캐리어의 웨이퍼 이송장치에 관한 것으로서, 특히 캐리어에 담겨진 웨이퍼를 한꺼번에 옮기거나 또는 선별적으로 선택하여 옮길 수 있도록 한 것이다.The present invention relates to a wafer transfer device of a carrier for transferring a wafer contained in a carrier to an empty carrier in a semiconductor manufacturing process. In particular, the wafer contained in a carrier can be transferred at once or selectively selected. It would be.

종래에는 제7도에 도시한 바와 같이 고정판(21)에 푸셔(pusher)(22)가 일체로 형성된 슬라이드편(23)을 한쌍의 축(24)을 따라 이송가능하게 설치하여 고정판(21)의 상부, 즉 푸셔측으로 웨이퍼가 적재된 캐리어(통상 25장이 적재됨)를 놓고 그 외측으로는 빈 캐리어를 맞대어 놓은 상태에서 작업자가 슬라딩편(23)을 도면상 좌측으로 축(24)을 따라 이동시키면 슬라이딩편(23)에 도면상 좌측으로 축(24)을 따라 이동시키면 슬라이딩편(23)을 도면상 좌측으로 축(24)을 따라 이동시키면 슬라이딩편(23)에 도면상 좌측으로 축(24)을 따라 이동시키면 슬라이딩편(23)에 일체로 형성된 푸셔(22)가 웨이퍼를 밀어서 다른 캐리어로 이송시키도록 되어 있다.Conventionally, as shown in FIG. 7, a slide piece 23 having a pusher 22 integrally formed on a fixed plate 21 is provided to be transported along a pair of shafts 24 so that the fixed plate 21 can be moved. With the carrier loaded with wafers (usually 25 sheets loaded) on the upper side, that is, the pusher side, and the empty carrier facing the outside, the operator moves the slad piece 23 along the shaft 24 to the left in the drawing. Moving the sliding piece 23 along the shaft 24 to the left side in the drawing on the sliding piece 23 Moving the sliding piece 23 along the axis 24 to the left side in the drawing and moving the shaft 24 to the left side in the drawing on the sliding piece 23. By moving along, the pusher 22 formed integrally with the sliding piece 23 pushes the wafer and transfers it to another carrier.

그러나 이러한 종래의 웨이퍼 이송장치는 캐리어 내에 적재된 여러장의 웨이퍼를 일괄적으로 빈 캐리어에 옮길 수 있는 필요에 따라 웨이퍼를 선별적으로 이송시킬 수가 없다.However, such a conventional wafer transfer apparatus cannot selectively transfer wafers as needed to collectively transfer several wafers loaded in a carrier into an empty carrier.

예를 들어 캐리어내에 양품의 웨이퍼와 불량웨이퍼가 함께 적재된 상태에서 양품의 웨이퍼만을 빈 캐리어로 옮길 필요가 있는 경우에는 작업자가 튀져(tweezer)를 이용하여 필요한 웨이퍼를 다른 캐리어로 이송시켜야 한다.For example, if a good wafer and a bad wafer are loaded together in a carrier and only a good wafer needs to be moved to an empty carrier, a worker must use a tweezer to transfer the required wafer to another carrier.

따라서 수작업으로 인해 작업능률이 저하되고 작업자의 부주의로 인해 웨이퍼의 표면에 긁힘 현상이 발생하거나 심한 경우에는 깨지게 되어 불량품이 발생하기 쉬운 문제가 있다.Therefore, the work efficiency is deteriorated due to the manual work, and the surface of the wafer may be scratched due to the carelessness of the worker, or, in severe cases, it may be broken, thereby causing a defective product.

본 고안은 종래의 이와 같은 결점을 감안하여 안출한 것으로서, 캐리어에 적재되는 웨이퍼의 수량과 동일한 갯수로 푸셔를 회동가능하게 설치하여 캐리어에 적재된 웨이퍼를 작업자가 한꺼번에 다른 캐리어로 이송시키거나 또는 선별적으로 이송시킬 수 있도록 하는데 목적이 있다.The present invention has been made in view of the above-mentioned drawbacks of the prior art, and the pusher is rotatably installed in the same number as the number of wafers loaded on the carrier to transfer or sort the wafers loaded on the carrier to other carriers at once. The purpose is to make it possible to transport them.

상기 목적을 달성하기 위해, 본 고안은 본체에 설치판을 한 쌍의 축을 따라 이송가능하게 설치하고 지지편에는 접속봉과 손잡이가 일체형으로된 다수개의 푸셔를 회동 가능하게 설치함과 함께 푸셔를 조절나사에 의해 고정시킬 수 있도록 한 캐리어의 웨이퍼 이송장치가 제공된다.In order to achieve the above object, the present invention installs the mounting plate to the main body so as to be transported along a pair of shafts, and the support piece is provided with a plurality of pushers which are integrally connected to the connecting rod and the handle to be rotatable and adjusting the pusher There is provided a wafer transfer device of a carrier which can be fixed by means of a carrier.

이하, 본 고안을 일실시예로 도시한 첨부된 도면 제1도 내지 제6도에 의해 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to FIGS. 1 to 6 of the accompanying drawings showing an embodiment as follows.

첨부도면 제1도는 본 고안 장치의 사시도이고, 제5도는 결합상태 종단면도로서, 본체(1)에 한 쌍의 축(2)이 고정되어 있고 축(2)에는 캐리어(3)를 올려 놓기 위한 설치판(4)이 슬라이딩 가능하게 결합되어 있으며, 설치판(4)의 일측에는 설치판(4)을 용이하게 이송시키기 위한 손잡이(4a)가 형성되어 있다.1 is a perspective view of a device of the present invention, and FIG. 5 is a longitudinal cross-sectional view of an engaged state, in which a pair of shafts 2 are fixed to the main body 1 and a carrier 3 is mounted on the shafts 2. The mounting plate 4 is slidably coupled, and one side of the mounting plate 4 is formed with a handle 4a for easily transporting the mounting plate 4.

그리고 본체(1)에 고정된 지지편(5)에는 캐리어(3)에 적재되는 웨이퍼(6)의 수량과 동일하게 푸셔(7)가 축(8)을 중심으로 회동가능하게 설치되어 있다.The pusher 7 is rotatably provided around the shaft 8 in the support piece 5 fixed to the main body 1 in the same manner as the number of wafers 6 loaded on the carrier 3.

또한 푸셔(7)의 선단, 즉 웨이퍼(6)와 접속되는 부위에 제2도와 같이 테프론과 같은 재질로 된 접속봉(9)이 고정되어 있고 그 반대측에는 푸셔(7)를 용이하게 회동시키기 위한 손잡이(10)가 지그재그로 형성되어 있다.In addition, a connecting rod 9 made of a Teflon-like material is fixed to the tip of the pusher 7, that is, the portion connected to the wafer 6, and the pusher 7 is easily rotated on the opposite side thereof. The handle 10 is formed in a zigzag.

또, 제6도에 도시한 바와 같이 푸셔(7)에 상호 직각을 이루도록 한 쌍의 요입홈(11)이 형성되어 있고 지지편(5)에는 볼(12)이 스프링(13)으로 탄력설치되어 푸셔(7)를 회동시킴에 따라 볼(12)이 스프링(13)으로 탄력설치되어 푸쇼(7)를 회동시킴에 따라 볼(12)이 요입홈(11)에 선택적으로 끼워질 수 있도록 되어 있다.In addition, as shown in FIG. 6, a pair of recessed grooves 11 are formed in the pusher 7 so as to be perpendicular to each other, and the support piece 5 is elastically installed with a ball 12 in the spring 13. As the pusher 7 rotates, the ball 12 is elastically installed with the spring 13 so that the ball 12 can be selectively fitted into the recessed groove 11 as the pusher 7 rotates. .

그리고 지지편(5)의 상방에는 조절나사(14)가 결합되어 조절나사(14)를 조이면 와셔(15)가 하방으로 눌리면서 각 푸셔(7)가 회전불가능한 상태로 되고 조절나사를 풀면 푸셔(7)가 회전자유로운 상태로 된다.And when the adjusting screw 14 is coupled to the upper side of the support piece 5 and tightening the adjusting screw 14, the washer 15 is pushed downward, and the respective pushers 7 are not rotatable, and the pusher 7 is released when the adjusting screw is loosened. ) Is free to rotate.

첨가도면 제4도는 본 고안 장치의 작동상태도이고, 제6도는 제5도의 A-A선 단면도로서, 설치판(4)의 상방에 웨이퍼(6)가 적재된 캐리어(3)와 빈 캐리어(3)를 상호 마주보도록 맞대어 놓고 설치판(4)에 형성된 손잡이(4a)를 제4도의 화살표 방향으로 이송시키면 웨이퍼(6)가 푸셔(7)에 의해 제어되어 빈 캐리어(3)로 이송되는데, 이를 좀더 구체적으로 설명하면 다음과 같다.FIG. 4 is an operation state diagram of the device of the present invention, and FIG. 6 is a cross-sectional view taken along line AA of FIG. 5 to show the carrier 3 and the empty carrier 3 on which the wafer 6 is placed above the mounting plate 4. When facing each other and transferring the handle 4a formed on the mounting plate 4 in the direction of the arrow of FIG. 4, the wafer 6 is controlled by the pusher 7 and transferred to the empty carrier 3, which is more specific. Explained as follows.

먼저 지지편(5)에 고정된 조절나사(14)를 반시계 방향으로 회전시킨 상태 풀린상태에서 모든 푸셔(7)를 제5도와 같이 축(2)과 동일한 방향으로 위치토록 한 후, 다시 조절나사(14)를 시계방향으로 조여주면 와셔(15)가 하방으로 이동하면서 푸셔를 누르게되고 이에 따라 모든 푸셔는 회전이 불가능한 상태가 된다.First, all the pushers 7 are positioned in the same direction as the shaft 2 as shown in FIG. 5 in the loosened state in which the adjusting screw 14 fixed to the support piece 5 is rotated counterclockwise, and then adjusting again. When the screw 14 is tightened in the clockwise direction, the washer 15 moves downward and presses the pusher, thereby making the pusher impossible to rotate.

이러한 상태에서 설치판(4)에 형성된 손잡이(4a)를 잡고 설치판(4)을 이동시키면 푸셔(7)에 의해 캐리어내에 적재된 모든 웨이퍼가 푸셔(7) 선단의 접속봉(9)과 접속하면서 밀려나 서로 마주보고 있는 빈 캐리어가 이동하게 되며, 이때 웨이퍼(6)는 푸셔(7)의 선단에 고정된 접속봉(9)에 접속되어 손상이나 파손이 방지된다.In this state, holding the handle 4a formed on the mounting plate 4 and moving the mounting plate 4, all the wafers loaded in the carrier by the pusher 7 are connected to the connecting rod 9 at the tip of the pusher 7. The empty carriers pushed to face each other are moved while the wafer 6 is connected to the connecting rod 9 fixed to the tip of the pusher 7 to prevent damage or breakage.

또한 캐리어(3)에 적재된 웨이퍼(6)를 선별적으로 이송시키고자 할 경우에는 전술한 바와 같이 조절나사(14)를 풀어 푸셔(7)를 고정 상태로부터 해제시킨 후에 이송을 원하는 위치에 있는 푸셔(7)는 제외하고 이송을 원하지 않는 위치에 있는 푸셔(7)를 반시계방향으로 회전시키면 푸셔(7)가 제6도의 일점쇄선과 같이 90°회동하면서 요입홈(11)에 삽입되어 있던 볼(12)이 또 다른 요입홈에 도달하게 되면 스프링(13)의 복원력에 의해 볼(12)이 요입홈(11)에 결합되어지므로 푸셔(7)는 회전된 위치에서 고정된다.In addition, in order to selectively transfer the wafer 6 loaded on the carrier 3, the adjustment screw 14 is released as described above to release the pusher 7 from the fixed state, and then the transfer is performed at a desired position. When the pusher 7 is rotated counterclockwise, except for the pusher 7, the pusher 7 is inserted into the recess 11 while being rotated by 90 ° like a dashed line in FIG. When the ball 12 reaches another recess groove, the pusher 7 is fixed in the rotated position because the ball 12 is coupled to the recess groove 11 by the restoring force of the spring 13.

이와 같이 웨이퍼(6)의 이송을 원하지 않는 위치에 있던 푸셔(7)를 각각 회동시키고 조절나사(14)를 조임방향으로 회전시켜 푸셔(7)를 고정한 다음 설치판(4)을 이동시키면 축(2)과 평행하게 위치한 푸셔(7)와 접속되는 웨이퍼만 빈 캐리어로 이송되고 나머지는 이송이 되지 않는다.As described above, the pusher 7 is rotated in the position where the transfer of the wafer 6 is not desired, the adjustment screw 14 is rotated in the tightening direction to fix the pusher 7, and then the mounting plate 4 is moved. Only wafers connected to the pushers 7 located parallel to 2) are transferred to the empty carriers and the rest are not transferred.

이상에서와 같이 본 고안 장치는 지지편(5)에 푸셔(7)를 회동가능하게 설치하는 간단한 구조에 의해 캐리어(3)에 적재된 웨이퍼(6)를 한꺼번에 이송시키거나 또는 선별적으로 이송시킬 수 있게 되므로 선별이송 작업이 용이해지고 튀져를 이용하여 수동적으로 웨이퍼를 이송시키는 종래 장치에 비해 불량품의 발생이 현저히 감소되는 효과가 있다.As described above, the device of the present invention transfers or selectively transfers the wafers 6 loaded on the carrier 3 at a time by a simple structure in which the pusher 7 is rotatably installed on the support piece 5. This facilitates the sorting transfer operation and has the effect of significantly reducing the occurrence of defective products compared to the conventional apparatus for manually transferring the wafer by using the flipper.

Claims (1)

본체(1)에 고정된 축(2)을 따라 이동 가능하게 설치된 설치판(4)과, 상기 본체에 고정된 지지편(5) 및 축(8)과, 상기 축에 회전가능하게 결합되고, 선단부에 캐리어내에 웨이퍼와 접속을 위한 접속봉(9)이 고정된 복수개의 푸셔(7)와, 상기 지지편에 나사결합되어 상기 푸셔의 회전을 구속하는 조절나사(14)를 구비하여서된 캐리어의 웨이퍼 이송장치.A mounting plate 4 movably installed along the shaft 2 fixed to the main body 1, a support piece 5 and the shaft 8 fixed to the main body, and rotatably coupled to the shaft, A plurality of pushers (7) having a connecting rod (9) secured to a wafer in a carrier at a distal end thereof, and an adjusting screw (14) screwed to the support piece to restrain the rotation of the pusher, Wafer Transfer Device.
KR2019910002156U 1991-02-13 1991-02-13 Conveying system for semiconductor wafer KR930006159Y1 (en)

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KR2019910002156U KR930006159Y1 (en) 1991-02-13 1991-02-13 Conveying system for semiconductor wafer

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KR920016693U KR920016693U (en) 1992-09-16
KR930006159Y1 true KR930006159Y1 (en) 1993-09-15

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