KR930004243B1 - 세라믹 패키지 - Google Patents
세라믹 패키지 Download PDFInfo
- Publication number
- KR930004243B1 KR930004243B1 KR1019900012001A KR900012001A KR930004243B1 KR 930004243 B1 KR930004243 B1 KR 930004243B1 KR 1019900012001 A KR1019900012001 A KR 1019900012001A KR 900012001 A KR900012001 A KR 900012001A KR 930004243 B1 KR930004243 B1 KR 930004243B1
- Authority
- KR
- South Korea
- Prior art keywords
- chamfer
- ceramic
- ceramic package
- package
- corner portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000919 ceramic Substances 0.000 title claims description 65
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000000295 complement effect Effects 0.000 claims description 3
- 238000005336 cracking Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000007547 defect Effects 0.000 description 4
- 230000001154 acute effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (3)
- 세라믹 베이스를 사용하여 반도체 소자등의 전자부품을 수납하는 세라믹 패키지에 있어서, 평면 형상이 구형상을 갖는 상기 세라믹 베이스의 인접하는 측벽면이 형성하는 각 코너부에 제 1 의 모따기부와 이 제 1의 모따기부의 양측에 위치하여 세라믹 베이스의 측벽면에 이르는 제 2의 모따기부를 형성한 것을 특징으로 하는 세라믹 패키지.
- 제 1 항에 있어서, 제 2의 모따기부와 세라믹 베이스측를 벽면으로 형성된 모서리부의 위치가 세라믹 베이스에 설비되어 있는 비어중의 상기 모서리부가 존재하는 측의 세라믹 베이스 변측의 소정의 2개의 비어의 사이인 것을 특징으로 하는 세라믹 패키지.
- 제 1 항 또는 제 2 항에 있어서, 상기 제 2의 모따기부와 세라믹 베이스측 벽면으로 형성된 모서리부의 각의 보각이 세라믹 패키지가 수납되는 수납부에서의 세라믹 패키지의 흔들리는 각과 동일 또는 약간 큰것을 특징으로 하는 세라믹 패키지.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1271396A JP2746693B2 (ja) | 1989-10-18 | 1989-10-18 | セラミックパッケージ |
JP271396/1 | 1989-10-18 | ||
JP1-271396 | 1989-10-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910008827A KR910008827A (ko) | 1991-05-31 |
KR930004243B1 true KR930004243B1 (ko) | 1993-05-22 |
Family
ID=17499480
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900012001A Expired - Fee Related KR930004243B1 (ko) | 1989-10-18 | 1990-08-06 | 세라믹 패키지 |
Country Status (6)
Country | Link |
---|---|
US (1) | US5084595A (ko) |
EP (1) | EP0424024B1 (ko) |
JP (1) | JP2746693B2 (ko) |
KR (1) | KR930004243B1 (ko) |
DE (1) | DE69009928T2 (ko) |
HK (1) | HK15995A (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB201701173D0 (en) * | 2017-01-24 | 2017-03-08 | Element Six Tech Ltd | Synthetic diamond plates |
CN116314040A (zh) * | 2023-05-24 | 2023-06-23 | 深圳和美精艺半导体科技股份有限公司 | 一种承载基板及其制造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4007479A (en) * | 1976-03-29 | 1977-02-08 | Honeywell Information Systems, Inc. | Fixture for an integrated circuit chip |
US4288841A (en) * | 1979-09-20 | 1981-09-08 | Bell Telephone Laboratories, Incorporated | Double cavity semiconductor chip carrier |
US4330683A (en) * | 1980-12-03 | 1982-05-18 | Bell Telephone Laboratories, Incorporated | Encapsulation for semiconductor device |
US4474017A (en) * | 1982-09-07 | 1984-10-02 | General Electric Company | Method of assembling an anti-sweat heater in a refrigerator cabinet |
US4853271A (en) * | 1987-03-31 | 1989-08-01 | Kyocera Corporation | Ceramic substrate for semiconductor package |
US4862247A (en) * | 1987-11-24 | 1989-08-29 | Texas Instruments Incorporated | Contact joint for semiconductor chip carriers |
-
1989
- 1989-10-18 JP JP1271396A patent/JP2746693B2/ja not_active Expired - Lifetime
-
1990
- 1990-08-06 KR KR1019900012001A patent/KR930004243B1/ko not_active Expired - Fee Related
- 1990-10-11 DE DE69009928T patent/DE69009928T2/de not_active Expired - Fee Related
- 1990-10-11 EP EP90311126A patent/EP0424024B1/en not_active Expired - Lifetime
- 1990-10-15 US US07/598,360 patent/US5084595A/en not_active Expired - Lifetime
-
1995
- 1995-02-06 HK HK15995A patent/HK15995A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0424024B1 (en) | 1994-06-15 |
JP2746693B2 (ja) | 1998-05-06 |
US5084595A (en) | 1992-01-28 |
DE69009928T2 (de) | 1994-09-22 |
EP0424024A1 (en) | 1991-04-24 |
DE69009928D1 (de) | 1994-07-21 |
JPH03133159A (ja) | 1991-06-06 |
HK15995A (en) | 1995-02-10 |
KR910008827A (ko) | 1991-05-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19900806 |
|
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19900806 Comment text: Request for Examination of Application |
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PG1501 | Laying open of application | ||
PG1605 | Publication of application before grant of patent | ||
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 19930731 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 19930921 Patent event code: PR07011E01D |
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PR1002 | Payment of registration fee |
Payment date: 19930920 End annual number: 3 Start annual number: 1 |
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PR1001 | Payment of annual fee |
Payment date: 19960423 Start annual number: 4 End annual number: 4 |
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PR1001 | Payment of annual fee |
Payment date: 19970417 Start annual number: 5 End annual number: 5 |
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FPAY | Annual fee payment |
Payment date: 20010516 Year of fee payment: 9 |
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PR1001 | Payment of annual fee |
Payment date: 20010516 Start annual number: 9 End annual number: 9 |
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LAPS | Lapse due to unpaid annual fee | ||
PC1903 | Unpaid annual fee |