KR930001329A - Wafer cleaning method in DRAM manufacturing - Google Patents

Wafer cleaning method in DRAM manufacturing Download PDF

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Publication number
KR930001329A
KR930001329A KR1019910009644A KR910009644A KR930001329A KR 930001329 A KR930001329 A KR 930001329A KR 1019910009644 A KR1019910009644 A KR 1019910009644A KR 910009644 A KR910009644 A KR 910009644A KR 930001329 A KR930001329 A KR 930001329A
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KR
South Korea
Prior art keywords
cleaning method
wafer cleaning
dram manufacturing
wafer
dram
Prior art date
Application number
KR1019910009644A
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Korean (ko)
Other versions
KR930011903B1 (en
Inventor
김재정
Original Assignee
문정환
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 문정환, 금성일렉트론 주식회사 filed Critical 문정환
Priority to KR1019910009644A priority Critical patent/KR930011903B1/en
Publication of KR930001329A publication Critical patent/KR930001329A/en
Application granted granted Critical
Publication of KR930011903B1 publication Critical patent/KR930011903B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

내용 없음No content

Description

디램 제조시 웨이퍼 세정방법Wafer cleaning method in DRAM manufacturing

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 본 발명의 증기수를 사용한 웨이퍼 세정공정을 나타낸 개략도.2 is a schematic view showing a wafer cleaning process using steam water of the present invention.

Claims (1)

탈이온수를 사용하는 세정 방법에 있어서, 웨이퍼 표면에 증기수를 분사시켜 웨이퍼상의 홀내에 액상막을 응축시킨 후 통상의 QDR(1)과 OFR(2)을 사용하여 이물질을 제거하게 함을 특징으로 하는 디램 제조시 웨이퍼 세정방법.In the cleaning method using deionized water, vapor water is sprayed onto the wafer surface to condense the liquid film in the hole on the wafer, and then foreign matters are removed by using ordinary QDR (1) and OFR (2). Wafer cleaning method in DRAM manufacturing. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019910009644A 1991-06-12 1991-06-12 Cleaning method of wafer KR930011903B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019910009644A KR930011903B1 (en) 1991-06-12 1991-06-12 Cleaning method of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910009644A KR930011903B1 (en) 1991-06-12 1991-06-12 Cleaning method of wafer

Publications (2)

Publication Number Publication Date
KR930001329A true KR930001329A (en) 1993-01-16
KR930011903B1 KR930011903B1 (en) 1993-12-22

Family

ID=19315668

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910009644A KR930011903B1 (en) 1991-06-12 1991-06-12 Cleaning method of wafer

Country Status (1)

Country Link
KR (1) KR930011903B1 (en)

Also Published As

Publication number Publication date
KR930011903B1 (en) 1993-12-22

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