KR920020629A - Cooling device of semiconductor device - Google Patents

Cooling device of semiconductor device Download PDF

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Publication number
KR920020629A
KR920020629A KR1019920005339A KR920005339A KR920020629A KR 920020629 A KR920020629 A KR 920020629A KR 1019920005339 A KR1019920005339 A KR 1019920005339A KR 920005339 A KR920005339 A KR 920005339A KR 920020629 A KR920020629 A KR 920020629A
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KR
South Korea
Prior art keywords
cooling
insulator
semiconductor device
cooling member
semiconductor
Prior art date
Application number
KR1019920005339A
Other languages
Korean (ko)
Inventor
이타하나 히로시
투노다 규지
타카오까 타다시
유수이 요시노리
도꾸나가 유시가투
사이토오 슈우찌
Original Assignee
가나이 쯔도무
가부시끼가이샤 히다찌세이사꾸쇼
미쓰이 노리히꼬
히다찌모토 엔지니어링콤파니리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가나이 쯔도무, 가부시끼가이샤 히다찌세이사꾸쇼, 미쓰이 노리히꼬, 히다찌모토 엔지니어링콤파니리미티드 filed Critical 가나이 쯔도무
Publication of KR920020629A publication Critical patent/KR920020629A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/24—Safety or protection arrangements; Arrangements for preventing malfunction for electrical insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

내용 없음No content

Description

반도체소자의 냉각장치Cooling device of semiconductor device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명에 따른 반도체소자의 냉각장치의 일실시예의 종단면도,1 is a longitudinal sectional view of an embodiment of a cooling device for a semiconductor device according to the present invention;

제2도는 본 발명에 따른 반도체소자의 냉각장치의 다른 실시예의 종단면도,2 is a longitudinal sectional view of another embodiment of a cooling device for a semiconductor device according to the present invention;

제3도는 본 발명에 따른 반도체소자의 냉각장치의 또 다른 실시예의 종단면도.3 is a longitudinal sectional view of yet another embodiment of a cooling device for a semiconductor device according to the present invention.

Claims (10)

접속도체를 거쳐 복수의 반도체소자간에 냉각부재를 배치하고, 냉각부재의 접속부에 방열부가 접속되고, 냉각부재, 접속부와 방열부내에 냉각매체가 채워지는 반도체소자의 냉각장치에 있어서, 냉각매체로 전기적으로 도전성이 있는 냉각매체가 사용되고, 상기 냉각부재의 상기 접속도체로의 대향부 외주가 절연물로 덮이고, 적어도 상기 냉각부재의 상기 접속도체로의 대향부의 절연물이 열전도성이 양호함 절연물로 이루어지는 것을 특징으로 하는 반도체소자의 냉각장치.In a cooling device of a semiconductor device in which a cooling member is disposed between a plurality of semiconductor elements via a connecting conductor, and a heat radiating portion is connected to the connecting portion of the cooling member, and a cooling medium is filled in the cooling member, the connecting portion and the heat radiating portion, the cooling medium is electrically connected to the cooling medium. A conductive cooling medium is used, and an outer periphery of the opposing portion of the cooling member to the connecting conductor is covered with an insulator, and at least the insulator of the opposing portion of the cooling member to the connecting conductor is made of an insulating material. Cooling device for semiconductor devices. 제1항에 있어서, 상기 절연물이 상기 접속도체와 상기 냉각부재사이에 배치된 판모양의 절연물과, 상기 냉각부재의 외주를 덮은 서라운딩절연물로 이루어지는 것을 특징으로 하는 반도체소자의 냉각장치.The semiconductor device cooling apparatus according to claim 1, wherein the insulator comprises a plate-shaped insulator disposed between the connection conductor and the cooling member, and a surround insulator covering the outer circumference of the cooling member. 제2항에 있어서, 또 하나의 상기 냉각부재의 접속부를 덮는 서라운딩절연물을 가지는 것을 특징으로 하는 반도체소자의 냉각장치.3. The semiconductor device cooling device according to claim 2, further comprising a surrounding insulator covering another connection part of said cooling member. 제2항에 있어서, 상기 서라운딩절연물과 상기 판모양의 절연물의 대향부사이를 절연성접착제로 접착하는 것을 특징으로 하는 반도체소자의 냉각장치.3. The semiconductor device cooling device according to claim 2, wherein an insulating adhesive agent is used to bond between the surrounding insulator and the opposing portion of the plate-shaped insulator. 제4항에 있어서, 상기 판모양의 절연물이 상기 냉각부재의 대향부와 실질적으로는 동일한 크기를 가지며, 대향부 위치에 맞게 배치되는 것을 특징으로 하는 반도체소자의 냉각장치.5. The cooling device of claim 4, wherein the plate-shaped insulator has a size substantially the same as that of the opposing portion of the cooling member, and is disposed at an opposing position. 복수의 반도체소자간에 접속도체를 거쳐 냉각부재가 배치되고, 냉각부재의 접속부로 방열부가 접속되고, 냉각부재, 접속부, 그리고 방열부에 냉각매체가 채워지는 반도체소자의 냉각장치에 있어서, 도전성이 있는 냉각매체가 냉각 매체로 사용되고, 상기 냉각부재가 열전도성이 양호한 절연물로 이루어지는 것을 특징으로 하는 반도체소자의 냉각장치.A cooling element is disposed between a plurality of semiconductor elements via a connecting conductor, the radiating portion is connected to the connecting portion of the cooling member, and the cooling element, the connecting portion, and the cooling device of the semiconductor element in which the cooling medium is filled in the radiating portion are conductive. A cooling medium is used as a cooling medium, and said cooling member is a semiconductor device cooling apparatus characterized by the above-mentioned. 제1-6항중 하나에 있어서, 상기 열전도성이 양호한 절연물이 질화붕소, 질화알루미늄, 알루미나, 베릴리아 그리고 탄화규소중 적어도 하나로 이루어지는 것을 특징으로 하는 반도체소자의 냉각장치.The semiconductor device cooling apparatus according to any one of claims 1 to 6, wherein the insulator having good thermal conductivity is made of at least one of boron nitride, aluminum nitride, alumina, beryllia, and silicon carbide. 제1-7항중 하나에 있어서, 상기 도전성이 있는 냉각 매체로 물이 사용되는 것을 특징으로 하는 반도체소자의 냉각장치.The cooling device according to any one of claims 1 to 7, wherein water is used as the conductive cooling medium. 제1-8항중 하나에 있어서, 상기 냉각부재의 접속부와 상기 방열부간에 펌프를 제공하여 강제순환경로를 형성하는 것을 특징으로 하는 반도체소자의 냉각장치.The semiconductor device cooling apparatus according to any one of claims 1 to 8, wherein a pump is provided between the connection portion of the cooling member and the heat dissipation portion to form a forced pure environment path. 제1-8항중 하나에 있어서, 상기 냉각부재로 히트파이프의 수열부가 접속되고, 상기 히트파이프의 방열부가 상기 방열부를 구성하는 것을 특징으로 하는 반도체소자의 냉각장치.The semiconductor device cooling device according to any one of claims 1 to 8, wherein the heat receiving portion of the heat pipe is connected to the cooling member, and the heat radiating portion of the heat pipe constitutes the heat radiating portion. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019920005339A 1991-04-02 1992-03-31 Cooling device of semiconductor device KR920020629A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP91-095010 1991-04-02
JP3095010A JPH04305963A (en) 1991-04-02 1991-04-02 Cooling device for semiconductor devices

Publications (1)

Publication Number Publication Date
KR920020629A true KR920020629A (en) 1992-11-21

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Application Number Title Priority Date Filing Date
KR1019920005339A KR920020629A (en) 1991-04-02 1992-03-31 Cooling device of semiconductor device

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JP (1) JPH04305963A (en)
KR (1) KR920020629A (en)
AU (1) AU642084B2 (en)
DE (1) DE4210643A1 (en)
FR (1) FR2674989A1 (en)
ZA (1) ZA922415B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4302816C2 (en) * 1993-01-28 1996-08-08 Aeg Westinghouse Transport Arrangement for cooling pressure contactable power disc semiconductors
DE4322932A1 (en) * 1993-07-09 1995-01-19 Abb Patent Gmbh Liquid cooling body with insulating discs, electrical contact plates and an insulation ring
DE4322933A1 (en) * 1993-07-09 1995-01-12 Abb Patent Gmbh Liquid-cooling body with hydraulic coolant connection
DE102011003041A1 (en) * 2011-01-24 2012-07-26 Siemens Aktiengesellschaft Apparatus and method for cooling a superconducting machine

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2523232C3 (en) * 1975-05-26 1979-04-05 Siemens Ag, 1000 Berlin Und 8000 Muenchen Cooling box for a liquid-cooled thyristor
JPS56124252A (en) * 1980-03-03 1981-09-29 Murata Mfg Co Ltd Heat-dissipating device for semiconductor
BR8108635A (en) * 1980-06-03 1982-04-13 Mitsubishi Electric Corp SEMICONDUCTOR ELEMENT STACK
JPS5749787A (en) * 1980-09-08 1982-03-23 Hitachi Ltd Boiling cooler
JPS5837482A (en) * 1981-08-28 1983-03-04 Hitachi Ltd Boiling and cooling device
DE3329325A1 (en) * 1982-09-03 1984-03-08 Peter 2563 Ipsach Herren Heat sink for liquid cooling of at least one electrical power element
JPS61230346A (en) * 1985-04-04 1986-10-14 Mitsubishi Electric Corp Cooling device for semiconductor element
JPS6292349A (en) * 1985-10-17 1987-04-27 Mitsubishi Electric Corp Cooling device for semiconductor element
DE8614173U1 (en) * 1986-05-24 1989-08-10 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt, De
JPS6396946A (en) * 1986-10-13 1988-04-27 Mitsubishi Electric Corp Semiconductor device
DE3740233A1 (en) * 1987-11-27 1989-06-08 Asea Brown Boveri Cooling box for conducting away the waste heat from semiconductors
DE3908996C2 (en) * 1989-03-18 1993-09-30 Abb Patent Gmbh Method of manufacturing a liquid heat sink
DE3937130A1 (en) * 1989-11-08 1990-05-31 Asea Brown Boveri Box-type cooler - for power semiconductor modules insulated by layer of specified plastic material

Also Published As

Publication number Publication date
AU642084B2 (en) 1993-10-07
AU1385492A (en) 1992-10-08
FR2674989A1 (en) 1992-10-09
DE4210643A1 (en) 1992-10-15
ZA922415B (en) 1992-12-30
JPH04305963A (en) 1992-10-28

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