AU1385492A - Cooling device for semiconductor element do not seal until urgent - Google Patents

Cooling device for semiconductor element do not seal until urgent

Info

Publication number
AU1385492A
AU1385492A AU13854/92A AU1385492A AU1385492A AU 1385492 A AU1385492 A AU 1385492A AU 13854/92 A AU13854/92 A AU 13854/92A AU 1385492 A AU1385492 A AU 1385492A AU 1385492 A AU1385492 A AU 1385492A
Authority
AU
Australia
Prior art keywords
semiconductor element
cooling device
seal until
urgent
until urgent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
AU13854/92A
Other versions
AU642084B2 (en
Inventor
Hiroshi Itahana
Syuuji Saitoh
Tadashi Takaoka
Yoshikatu Tokunaga
Kouji Tunoda
Yoshinori Usui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Mito Engineering Co Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of AU1385492A publication Critical patent/AU1385492A/en
Application granted granted Critical
Publication of AU642084B2 publication Critical patent/AU642084B2/en
Anticipated expiration legal-status Critical
Withdrawn - After Issue legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/24—Safety or protection arrangements; Arrangements for preventing malfunction for electrical insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AU13854/92A 1991-04-02 1992-03-26 Cooling device for semiconductor element do not seal until urgent Withdrawn - After Issue AU642084B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3-95010 1991-04-02
JP3095010A JPH04305963A (en) 1991-04-02 1991-04-02 Cooling device for semiconductor devices

Publications (2)

Publication Number Publication Date
AU1385492A true AU1385492A (en) 1992-10-08
AU642084B2 AU642084B2 (en) 1993-10-07

Family

ID=14125980

Family Applications (1)

Application Number Title Priority Date Filing Date
AU13854/92A Withdrawn - After Issue AU642084B2 (en) 1991-04-02 1992-03-26 Cooling device for semiconductor element do not seal until urgent

Country Status (6)

Country Link
JP (1) JPH04305963A (en)
KR (1) KR920020629A (en)
AU (1) AU642084B2 (en)
DE (1) DE4210643A1 (en)
FR (1) FR2674989A1 (en)
ZA (1) ZA922415B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4302816C2 (en) * 1993-01-28 1996-08-08 Aeg Westinghouse Transport Arrangement for cooling pressure contactable power disc semiconductors
DE4322932A1 (en) * 1993-07-09 1995-01-19 Abb Patent Gmbh Liquid cooling body with insulating discs, electrical contact plates and an insulation ring
DE4322933A1 (en) * 1993-07-09 1995-01-12 Abb Patent Gmbh Liquid-cooling body with hydraulic coolant connection
DE102011003041A1 (en) * 2011-01-24 2012-07-26 Siemens Aktiengesellschaft Apparatus and method for cooling a superconducting machine

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2523232C3 (en) * 1975-05-26 1979-04-05 Siemens Ag, 1000 Berlin Und 8000 Muenchen Cooling box for a liquid-cooled thyristor
JPS56124252A (en) * 1980-03-03 1981-09-29 Murata Mfg Co Ltd Heat-dissipating device for semiconductor
BR8108635A (en) * 1980-06-03 1982-04-13 Mitsubishi Electric Corp SEMICONDUCTOR ELEMENT STACK
JPS5749787A (en) * 1980-09-08 1982-03-23 Hitachi Ltd Boiling cooler
JPS5837482A (en) * 1981-08-28 1983-03-04 Hitachi Ltd Boiling and cooling device
DE3329325A1 (en) * 1982-09-03 1984-03-08 Peter 2563 Ipsach Herren Heat sink for liquid cooling of at least one electrical power element
JPS61230346A (en) * 1985-04-04 1986-10-14 Mitsubishi Electric Corp Cooling device for semiconductor element
JPS6292349A (en) * 1985-10-17 1987-04-27 Mitsubishi Electric Corp Cooling device for semiconductor element
DE8614173U1 (en) * 1986-05-24 1989-08-10 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt, De
JPS6396946A (en) * 1986-10-13 1988-04-27 Mitsubishi Electric Corp Semiconductor device
DE3740233A1 (en) * 1987-11-27 1989-06-08 Asea Brown Boveri Cooling box for conducting away the waste heat from semiconductors
DE3908996C2 (en) * 1989-03-18 1993-09-30 Abb Patent Gmbh Method of manufacturing a liquid heat sink
DE3937130A1 (en) * 1989-11-08 1990-05-31 Asea Brown Boveri Box-type cooler - for power semiconductor modules insulated by layer of specified plastic material

Also Published As

Publication number Publication date
AU642084B2 (en) 1993-10-07
KR920020629A (en) 1992-11-21
FR2674989A1 (en) 1992-10-09
DE4210643A1 (en) 1992-10-15
ZA922415B (en) 1992-12-30
JPH04305963A (en) 1992-10-28

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