KR920020628A - Wafer Cleaner - Google Patents

Wafer Cleaner Download PDF

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Publication number
KR920020628A
KR920020628A KR1019910006343A KR910006343A KR920020628A KR 920020628 A KR920020628 A KR 920020628A KR 1019910006343 A KR1019910006343 A KR 1019910006343A KR 910006343 A KR910006343 A KR 910006343A KR 920020628 A KR920020628 A KR 920020628A
Authority
KR
South Korea
Prior art keywords
chamber
wafer
rinse
cleaning
cleaning apparatus
Prior art date
Application number
KR1019910006343A
Other languages
Korean (ko)
Inventor
고용선
송창룡
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019910006343A priority Critical patent/KR920020628A/en
Publication of KR920020628A publication Critical patent/KR920020628A/en

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  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

내용 없음No content

Description

웨이퍼 제정장치Wafer Defining Device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명에 따른 웨이퍼 세정장치의 블록도이다.1 is a block diagram of a wafer cleaning apparatus according to the present invention.

Claims (4)

세정할 웨이퍼 카펫트를 장.탈착하는 로더부(1) 및 언로더부(1'), 상기 로더부(1)의 웨이퍼를 처리 챔버로 이동시키는 로보트(2), 세정처리 약품 및 린스액을 분사시키는 노즐(3,8)이 설치된 약품처리 챔버(5), 세정처리가 완료된 웨이퍼를 린스 드라이하는 린스 및 드라이 챔버(9)로 구성된 웨이퍼 세정장치.Loader part 1 and unloader part 1 'for mounting and detaching the wafer carpet to be cleaned, robot 2 for moving the wafer of the loader part 1 to the processing chamber, cleaning treatment chemicals and rinse liquid are sprayed. A chemical cleaning chamber (5) provided with nozzles (3, 8) to make a wafer, and a rinse and dry chamber (9) for rinsing and drying the wafer having been cleaned. 제1항에 있어서, 약품처리 챔버(5)와 린스 및 드라이 챔버(9)는 노즐을 이용한 분사(spray)방식을 취함을 특징으로 하는 세정장치.The cleaning apparatus according to claim 1, wherein the chemical treatment chamber (5) and the rinse and dry chamber (9) take a spray method using a nozzle. 제1항에 있어서, 약품처리 챔버(5)와 린스 및 드라이 챔버(9)는 공기를 이용한 감압방식을 사용함을 특징으로 하는 세정장치.The cleaning apparatus according to claim 1, wherein the chemical treatment chamber (5) and the rinse and dry chamber (9) use a pressure reduction method using air. 제3항에 있어서, 감압의 경우 약 0.7-0.8Torr를 유지하는 세정장치.The cleaning apparatus of claim 3, wherein the apparatus maintains about 0.7-0.8 Torr in the case of reduced pressure. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019910006343A 1991-04-19 1991-04-19 Wafer Cleaner KR920020628A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019910006343A KR920020628A (en) 1991-04-19 1991-04-19 Wafer Cleaner

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910006343A KR920020628A (en) 1991-04-19 1991-04-19 Wafer Cleaner

Publications (1)

Publication Number Publication Date
KR920020628A true KR920020628A (en) 1992-11-21

Family

ID=67432916

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910006343A KR920020628A (en) 1991-04-19 1991-04-19 Wafer Cleaner

Country Status (1)

Country Link
KR (1) KR920020628A (en)

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E601 Decision to refuse application