KR920019221A - Electrolytic copper foil for printed circuit and manufacturing method - Google Patents

Electrolytic copper foil for printed circuit and manufacturing method Download PDF

Info

Publication number
KR920019221A
KR920019221A KR1019910003870A KR910003870A KR920019221A KR 920019221 A KR920019221 A KR 920019221A KR 1019910003870 A KR1019910003870 A KR 1019910003870A KR 910003870 A KR910003870 A KR 910003870A KR 920019221 A KR920019221 A KR 920019221A
Authority
KR
South Korea
Prior art keywords
copper foil
alloy coating
electrolytic copper
current
printed circuit
Prior art date
Application number
KR1019910003870A
Other languages
Korean (ko)
Other versions
KR930001934B1 (en
Inventor
김윤근
양점식
Original Assignee
황기연
덕산금속 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 황기연, 덕산금속 주식회사 filed Critical 황기연
Priority to KR1019910003870A priority Critical patent/KR930001934B1/en
Priority to JP3317502A priority patent/JPH07109936B2/en
Publication of KR920019221A publication Critical patent/KR920019221A/en
Application granted granted Critical
Publication of KR930001934B1 publication Critical patent/KR930001934B1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

내용 없음No content

Description

인쇄회로용 전해동박 및 그 제조방법Electrolytic copper foil for printed circuit and manufacturing method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (4)

각종의전기, 전자기기의 정밀 제어회로로 사용되는 인쇄회로용 전해동박에 있어서, 절연기판과 접합하는 거침처리가 끝난 동박의 면에 구리와 비소의 합금 피복층을 가지고 그 위에 아연과 철합금 피복층을 형성한 후 크로메이트 방청처리해서 된 것을 특징으로 하는 인쇄회로용 전해동박.In electrolytic copper foil for printed circuits used as precision control circuits of various electric and electronic devices, an alloy coating layer of copper and arsenic is formed on the surface of the roughened copper foil bonded to an insulating substrate, and a zinc and iron alloy coating layer is formed thereon. An electrolytic copper foil for printed circuits, which has been subjected to chromate rust prevention treatment. 절연기판과 접합하는 거침처리가 끝난 동박의 면에 피복층을 전기 도금법으로 피복처리함에 있어서, 도금액을 황산동 50-70g/1, 비소(금속)1-3g/1, 황산50-70g/1로 조성하여 액온도를 20℃-35℃인 상태에서 펄스전류로써 5-10sec 실행하여 구리와 비소의 합금피복층을 형성하여 이온교환수로 수세한 후, 도금액을 황산아연 10-20g/1, 황산철 1-5g/1, PH3-5가 되도록 황산으로 조절하여 상온의 액온도 상태에서 펄스 전류로써 5sec간 실행하여 아연과 철의 합금 피복층을 형성하여 이온교환수로 수세후 방청 크로메이트처리를 전해법으로 처리 하여서 됨을 특징으로 하는 인쇄회로용 전해동박 제조방법.In coating the surface of the roughened copper foil to be insulated with the insulating substrate by electroplating, the plating solution is composed of copper sulfate 50-70g / 1, arsenic (metal) 1-3g / 1 and sulfuric acid 50-70g / 1 After 5-10 sec using a pulsed current at a liquid temperature of 20 ° C.-35 ° C. to form an alloy coating layer of copper and arsenic, washed with ion-exchanged water, and then the plating solution was 10-20 g / 1 of zinc sulfate and 1 of iron sulfate. Adjusted with sulfuric acid to -5g / 1, PH3-5, run for 5sec with pulse current at liquid temperature at room temperature to form an alloy coating layer of zinc and iron, and washed with ion-exchanged water. Electrolytic copper foil manufacturing method for a printed circuit characterized in that. 제2항에 있어서, 구리와 비소의 합금피복시 펄스 전류는 피이크 전류위상에서의 전류 밀도를 10-20amp/dm2로 하여 실행시간을 8-10msec, 기저전류 위상에서의 전류밀도를 3-8amp/dm2로 하여 실행시간을 10-60msec로 함을 특징으로 한 인쇄회로용 전해동박 제조방법.The pulsed current of the alloy coating of copper and arsenic has a current density of 10-20 amp / dm 2 at a peak current phase and an execution time of 8-10 msec, and a current density of 3-8 amp at a base current phase. electrolytic copper foil production method for a run-time by a / dm 2, characterized in that a printed circuit to 10-60msec. 제2항에 있어서, 아연과 철의 합금피복시 펄스 전류는 피이크 전류위상에서의 전류 밀도를 8-10amp/dm2로 하여 실행시간을 8-10msec, 기저전류 위상에서의 전류밀도를 4-7amp/dm2로 하여 실행시간을 10-60msec로 함을 특징으로 한 인쇄회로용 전해동박 제조방법.The pulse current of an alloy coating of zinc and iron has a current density of 8-10 amp / dm 2 at a peak current phase and an execution time of 8-10 msec, and a current density of 4-7 amp at a base current phase. electrolytic copper foil production method for a run-time by a / dm 2, characterized in that a printed circuit to 10-60msec. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019910003870A 1991-03-11 1991-03-11 Electrolysis copper foil & making method for printed circuit KR930001934B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1019910003870A KR930001934B1 (en) 1991-03-11 1991-03-11 Electrolysis copper foil & making method for printed circuit
JP3317502A JPH07109936B2 (en) 1991-03-11 1991-11-05 Method for manufacturing copper foil for printed circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910003870A KR930001934B1 (en) 1991-03-11 1991-03-11 Electrolysis copper foil & making method for printed circuit

Publications (2)

Publication Number Publication Date
KR920019221A true KR920019221A (en) 1992-10-22
KR930001934B1 KR930001934B1 (en) 1993-03-20

Family

ID=19311974

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910003870A KR930001934B1 (en) 1991-03-11 1991-03-11 Electrolysis copper foil & making method for printed circuit

Country Status (2)

Country Link
JP (1) JPH07109936B2 (en)
KR (1) KR930001934B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6342308B1 (en) * 1999-09-29 2002-01-29 Yates Foil Usa, Inc. Copper foil bonding treatment with improved bond strength and resistance to undercutting
CN113930807B (en) * 2021-11-11 2023-03-31 中南大学 Method for preparing copper-arsenic alloy by pulse electrodeposition

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6134385A (en) * 1984-07-26 1986-02-18 Matsushita Electric Ind Co Ltd Enclosed rotary compressor
JPS6152240A (en) * 1984-08-18 1986-03-14 Ishihara Suisan Kk Minced meat of bonito fried with oil

Also Published As

Publication number Publication date
KR930001934B1 (en) 1993-03-20
JPH04318996A (en) 1992-11-10
JPH07109936B2 (en) 1995-11-22

Similar Documents

Publication Publication Date Title
DE2238004C3 (en) Process for the pretreatment for the subsequent metallization of plastics, in particular for the production of printed circuit boards
US4943346A (en) Method for manufacturing printed circuit boards
TW200603707A (en) Printed circuit board and method for manufacturing printed circuit board
MY132467A (en) Tin electroplating process
KR960016662A (en) Through-hole plating method for two-layer and multilayer printed circuit boards
KR940021765A (en) Self-accelerated and rechargeable formaldehyde-free impregnated metal plating methods and compositions therefor
SE442124B (en) PROCEDURE FOR ELECTROCHEMICAL METALIZATION OF A DIELECTRIC AND ACTIVATION SOLUTION FOR USE THEREOF
GB1101299A (en) Method of manufacturing an electric circuit unit
TW200401850A (en) Copper foil with a carrier, method for manufacturing the copper foil with a carrier, and copper clad laminate employing the copper foil with a carrier
KR920019221A (en) Electrolytic copper foil for printed circuit and manufacturing method
GB1208337A (en) Method to produce printed circuits
CN110724987A (en) VCP copper plating method
KR920019222A (en) Electrolytic copper foil for printed circuit and manufacturing method
US3108931A (en) Etching of chromium alloys
GB2017416A (en) Circuit board manufacturing method
KR930007319A (en) Electrolytic Copper Foil for Printed Circuits
JPH04231473A (en) Preliminary treatment composition and method for tin-lead immersion plating
JPS6133907B2 (en)
Karwan Method for Surface Treating Copper Foil
GB1450351A (en) Solder wettability of copper foil
KR930007318A (en) Electrolytic Copper Foil for Printed Circuits
JP2926996B2 (en) Plating solution composition for sulfol plating
IE49971B1 (en) Manufacture of printed circuits
SU834947A1 (en) Printed circuit board manufacturing method
US3433719A (en) Plating process for printed circuit boards

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20040113

Year of fee payment: 12

LAPS Lapse due to unpaid annual fee