KR930007319A - Electrolytic Copper Foil for Printed Circuits - Google Patents

Electrolytic Copper Foil for Printed Circuits Download PDF

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Publication number
KR930007319A
KR930007319A KR1019910016080A KR910016080A KR930007319A KR 930007319 A KR930007319 A KR 930007319A KR 1019910016080 A KR1019910016080 A KR 1019910016080A KR 910016080 A KR910016080 A KR 910016080A KR 930007319 A KR930007319 A KR 930007319A
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KR
South Korea
Prior art keywords
copper foil
electrolytic copper
sulfate
hexahydrate
seconds
Prior art date
Application number
KR1019910016080A
Other languages
Korean (ko)
Inventor
김윤근
Original Assignee
황기연
덕산금속 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 황기연, 덕산금속 주식회사 filed Critical 황기연
Priority to KR1019910016080A priority Critical patent/KR930007319A/en
Publication of KR930007319A publication Critical patent/KR930007319A/en

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  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

본 발명은 기본 구리층을 가진 동박을 통상의 방법으로 거침처리를 하고, 나서 황산니켈(6수화물) 6-10g/ℓ, 황산아연(7수화물)40-60g/ℓ, 황산동 2-5g/ℓ, 황산암모늄 10-20g/ℓ을 함유하며, pH 4-5(황산으로 조절)로 조절된 도금액중에서, 도금액은 20-40℃, 전류밀도 4-10A/dm2에서 3-10초간 전착하고, 중크롬산소다 5g/ℓ의 크로메이트 처리액중에서 사온하에 약 30V의 전위에서 가스발생이 될 정도로 약 5초간 크로메이터처리 하는 것에 의하여 제조되는 인쇄회로용 전해동박에 관한 것으로서, 본 발명에 의하여 절연기관에 대한 접착력과, 내열성 및 내약품성이 우수한 전해동박을 제조할 수 있게 된다.In the present invention, the copper foil having a basic copper layer is roughened by a conventional method, and then nickel sulfate (hexahydrate) 6-10 g / l, zinc sulfate (hexahydrate) 40-60 g / l, copper sulfate 2-5 g / l In a plating liquid containing 10-20 g / l ammonium sulfate and adjusted to pH 4-5 (controlled with sulfuric acid), the plating liquid was electrodeposited at 20-40 ° C. and a current density of 4-10 A / dm 2 for 3-10 seconds. The present invention relates to an electrolytic copper foil for printed circuits produced by chromatizing for about 5 seconds in a chromate treatment solution of sodium bichromate at a temperature of about 30 V in a chromate treatment solution of 5 g / L. And it becomes possible to manufacture the electrolytic copper foil excellent in heat resistance and chemical resistance.

Description

인쇄회로용 전해동박Electrolytic Copper Foil for Printed Circuits

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (2)

절연기판과 접합하기 위한 인쇄회로용 전해동박에 있어서, 통상의 방법으로 거침처리한 동박면위에 니켈-아연-구리의 합금층을 피복하고 방청 크로메이트 층을 피복시킨 인쇄회로용 전해동박.An electrolytic copper foil for a printed circuit for joining with an insulating substrate, wherein an electrolytic copper foil for coating a nickel-zinc-copper alloy layer on a copper foil surface treated by a conventional method and coated with an rust-proof chromate layer. 절연기판과 접합하기 위한 인쇄회로용 전해동박의 제조방법에 있어서, 기본 구리층을 위한 동박을 통상의 방법으로 거침처리하고 나서, 황산니켈(6수화물) 5-10g/ℓ, 황산아연(7수화물) 40-60g/ℓ, 황산동 2-5g/ℓ, 황산암모늄 10-20g/ℓ을 함유하며, pH 4-5(황산으로 조절)로 조절된 도금액중에서, 도금액은 20-40℃, 전류밀도 4-10A/dm2에서 3-10초간 전착하고, 중크롬산소다 5g/ℓ의 크로메이트 처리액중에서 상온하에 약 30V의 전위에서 가스발생이 될 정도로 약 5초간 크로메이터처리 하는 것을 특징으로 하는 인쇄회로용 전해동박의 제조방법.In the method of manufacturing an electrolytic copper foil for a printed circuit for joining with an insulating substrate, after roughly treating the copper foil for the basic copper layer by a conventional method, 5-10 g / L nickel sulfate (hexahydrate) and zinc sulfate (hexahydrate) Among plating solutions containing 40-60 g / l, copper sulfate 2-5 g / l, ammonium sulfate 10-20 g / l and adjusted to pH 4-5 (controlled by sulfuric acid), the plating liquid is 20-40 ° C., current density is 4- Electrolytic copper foil for printed circuits, which is electrodeposited at 10 A / dm 2 for 3-10 seconds and chromateized for 5 seconds to generate gas at a potential of about 30 V in a chromate treatment solution of 5 g / l sodium bichromate at room temperature. Manufacturing method. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019910016080A 1991-09-16 1991-09-16 Electrolytic Copper Foil for Printed Circuits KR930007319A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019910016080A KR930007319A (en) 1991-09-16 1991-09-16 Electrolytic Copper Foil for Printed Circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910016080A KR930007319A (en) 1991-09-16 1991-09-16 Electrolytic Copper Foil for Printed Circuits

Publications (1)

Publication Number Publication Date
KR930007319A true KR930007319A (en) 1993-04-22

Family

ID=67433449

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910016080A KR930007319A (en) 1991-09-16 1991-09-16 Electrolytic Copper Foil for Printed Circuits

Country Status (1)

Country Link
KR (1) KR930007319A (en)

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