KR930007319A - Electrolytic Copper Foil for Printed Circuits - Google Patents
Electrolytic Copper Foil for Printed Circuits Download PDFInfo
- Publication number
- KR930007319A KR930007319A KR1019910016080A KR910016080A KR930007319A KR 930007319 A KR930007319 A KR 930007319A KR 1019910016080 A KR1019910016080 A KR 1019910016080A KR 910016080 A KR910016080 A KR 910016080A KR 930007319 A KR930007319 A KR 930007319A
- Authority
- KR
- South Korea
- Prior art keywords
- copper foil
- electrolytic copper
- sulfate
- hexahydrate
- seconds
- Prior art date
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- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
본 발명은 기본 구리층을 가진 동박을 통상의 방법으로 거침처리를 하고, 나서 황산니켈(6수화물) 6-10g/ℓ, 황산아연(7수화물)40-60g/ℓ, 황산동 2-5g/ℓ, 황산암모늄 10-20g/ℓ을 함유하며, pH 4-5(황산으로 조절)로 조절된 도금액중에서, 도금액은 20-40℃, 전류밀도 4-10A/dm2에서 3-10초간 전착하고, 중크롬산소다 5g/ℓ의 크로메이트 처리액중에서 사온하에 약 30V의 전위에서 가스발생이 될 정도로 약 5초간 크로메이터처리 하는 것에 의하여 제조되는 인쇄회로용 전해동박에 관한 것으로서, 본 발명에 의하여 절연기관에 대한 접착력과, 내열성 및 내약품성이 우수한 전해동박을 제조할 수 있게 된다.In the present invention, the copper foil having a basic copper layer is roughened by a conventional method, and then nickel sulfate (hexahydrate) 6-10 g / l, zinc sulfate (hexahydrate) 40-60 g / l, copper sulfate 2-5 g / l In a plating liquid containing 10-20 g / l ammonium sulfate and adjusted to pH 4-5 (controlled with sulfuric acid), the plating liquid was electrodeposited at 20-40 ° C. and a current density of 4-10 A / dm 2 for 3-10 seconds. The present invention relates to an electrolytic copper foil for printed circuits produced by chromatizing for about 5 seconds in a chromate treatment solution of sodium bichromate at a temperature of about 30 V in a chromate treatment solution of 5 g / L. And it becomes possible to manufacture the electrolytic copper foil excellent in heat resistance and chemical resistance.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019910016080A KR930007319A (en) | 1991-09-16 | 1991-09-16 | Electrolytic Copper Foil for Printed Circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019910016080A KR930007319A (en) | 1991-09-16 | 1991-09-16 | Electrolytic Copper Foil for Printed Circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
KR930007319A true KR930007319A (en) | 1993-04-22 |
Family
ID=67433449
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910016080A KR930007319A (en) | 1991-09-16 | 1991-09-16 | Electrolytic Copper Foil for Printed Circuits |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR930007319A (en) |
-
1991
- 1991-09-16 KR KR1019910016080A patent/KR930007319A/en not_active Application Discontinuation
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |