JPH04311575A - Method for treating and conditioning surface of magnesium alloy - Google Patents
Method for treating and conditioning surface of magnesium alloyInfo
- Publication number
- JPH04311575A JPH04311575A JP7511191A JP7511191A JPH04311575A JP H04311575 A JPH04311575 A JP H04311575A JP 7511191 A JP7511191 A JP 7511191A JP 7511191 A JP7511191 A JP 7511191A JP H04311575 A JPH04311575 A JP H04311575A
- Authority
- JP
- Japan
- Prior art keywords
- sodium
- plating
- cyanide
- copper
- magnesium alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000861 Mg alloy Inorganic materials 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims description 14
- 230000003750 conditioning effect Effects 0.000 title 1
- 238000007747 plating Methods 0.000 claims abstract description 42
- 239000010949 copper Substances 0.000 claims abstract description 23
- CDBYLPFSWZWCQE-UHFFFAOYSA-L sodium carbonate Substances [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims abstract description 14
- 238000005238 degreasing Methods 0.000 claims abstract description 8
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 claims abstract description 8
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 claims abstract description 8
- 235000011006 sodium potassium tartrate Nutrition 0.000 claims abstract description 8
- 239000011701 zinc Substances 0.000 claims abstract description 8
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 claims abstract description 7
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910000029 sodium carbonate Inorganic materials 0.000 claims abstract description 7
- 238000007654 immersion Methods 0.000 claims abstract description 5
- 238000001994 activation Methods 0.000 claims abstract description 4
- 230000004913 activation Effects 0.000 claims abstract description 4
- 238000005554 pickling Methods 0.000 claims abstract description 4
- 239000011775 sodium fluoride Substances 0.000 claims abstract description 4
- 235000013024 sodium fluoride Nutrition 0.000 claims abstract description 4
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 claims abstract description 4
- 229960001763 zinc sulfate Drugs 0.000 claims abstract description 4
- 229910000368 zinc sulfate Inorganic materials 0.000 claims abstract description 4
- 229940001593 sodium carbonate Drugs 0.000 claims abstract description 3
- 235000017550 sodium carbonate Nutrition 0.000 claims abstract description 3
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 claims abstract description 3
- 229960000414 sodium fluoride Drugs 0.000 claims abstract description 3
- 229940048086 sodium pyrophosphate Drugs 0.000 claims abstract description 3
- 235000019818 tetrasodium diphosphate Nutrition 0.000 claims abstract description 3
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 claims abstract description 3
- 229940074439 potassium sodium tartrate Drugs 0.000 claims abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 21
- 238000004381 surface treatment Methods 0.000 claims description 9
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 7
- 239000003513 alkali Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 11
- 239000010410 layer Substances 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000001476 sodium potassium tartrate Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229940005657 pyrophosphoric acid Drugs 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 150000004691 decahydrates Chemical class 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- VZWGHDYJGOMEKT-UHFFFAOYSA-J sodium pyrophosphate decahydrate Chemical compound O.O.O.O.O.O.O.O.O.O.[Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O VZWGHDYJGOMEKT-UHFFFAOYSA-J 0.000 description 1
- 239000001433 sodium tartrate Substances 0.000 description 1
- 235000011004 sodium tartrates Nutrition 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】この発明は、マグネシウム合金上
に所要の金属の膜をコーティングする場合の表面処理下
地調整方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a method for preparing a surface treatment surface when coating a magnesium alloy with a desired metal film.
【０００２】0002
【従来の技術】周知の通り、マグネシウム合金は現在の
実用金属の中では比重が最も小さいことから軽量化が必
要な宇宙機器等への応用が中心に行われている。かかる
応用の中で宇宙機器搭載用電子機器の筺体に使用する場
合には、耐侯性及び電気伝導性を向上させる為に、その
表面に銅、又は、金のような金属をコーティングするこ
とが必要となる。かかるマグネシウム合金の表面処理方
法としては、従来、ＪＩＳ−Ｈ−８６５１によるクロム
酸を使用した化学被膜処理及び陽極処理が採用されてい
た。BACKGROUND OF THE INVENTION As is well known, magnesium alloys have the lowest specific gravity among the metals currently in practical use, and are therefore mainly used in space equipment and the like that require weight reduction. When used in the case of electronic equipment mounted on space equipment in such applications, it is necessary to coat the surface with a metal such as copper or gold to improve weather resistance and electrical conductivity. becomes. Conventionally, chemical coating treatment using chromic acid and anodic treatment according to JIS-H-8651 have been employed as surface treatment methods for such magnesium alloys.
【０００３】しかし、化学被膜処理方法は得られる被膜
が数μｍ以下と薄いことから耐侯性が悪く、又、被膜の
電気伝導性が母材よりも劣るという欠点があった。又、
陽極処理方法により得られる被膜が酸化膜てあるため、
耐侯性は優れているものの母材表面の電気伝導性が失わ
れるという欠点があった。However, the chemical coating treatment method has disadvantages in that the resulting coating is thin, several μm or less, and therefore has poor weather resistance, and the electrical conductivity of the coating is inferior to that of the base material. or,
Because the film obtained by the anodizing method is an oxide film,
Although it has excellent weather resistance, it has the disadvantage that the electrical conductivity of the base material surface is lost.
【０００４】0004
【発明が解決しようとする課題】上記のように、従来は
マグネシウム合金上へ直接金属層をコーティングさせる
研究は少なかった。これはマグネシウム合金が化学的に
非常に活性であるため、例えば多少工夫した常法による
アルミニウム合金へのめっきの下地調整処理を行ってい
る間にも表面の酸化がすすみめっき被膜を形成はするが
、密着性、耐侯性の面で劣り信頼性が低いものであるた
めであった。As mentioned above, there has been little research into coating a metal layer directly onto a magnesium alloy. This is because magnesium alloys are very active chemically, so even if a slightly modified conventional method is used to prepare the base for plating on aluminum alloys, surface oxidation progresses and a plating film is formed. This was because they were inferior in terms of adhesion and weather resistance, and had low reliability.
【０００５】この発明は上記の問題点を解決するために
なされたものであり、マグネシウム合金上に密着性が良
く、電気伝導性が優れ、耐侯性が向上できる所要の金属
の膜を形成する為の表面処理下地調整方法を提供するこ
とにある。[0005] This invention was made to solve the above-mentioned problems, and is to form a required metal film on a magnesium alloy that has good adhesion, excellent electrical conductivity, and improved weather resistance. An object of the present invention is to provide a surface treatment base adjustment method.
【０００６】[0006]
【課題を解決するための手段】この発明に係わるマグネ
シウム合金上への表面処理下地調整方法は、鋭意検討を
重ねた結果マグネシウム合金から成る物品を常法により
蒸気脱脂、アルカリ脱脂、酸洗い及び活性化処理を行い
、次いで硫酸亜鉛とピロリン酸ナトリウムとフッ化ナト
リウムと炭酸ナトリウムから成る亜鉛置換処理液中で所
要の温度、時間をかけて浸漬処理を行い、次いでシアン
化銅とシアン化ナトリウムと炭酸ナトリウムと酒石酸ナ
トリウムカリウムとから成るめっき浴を使用して所要の
温度、時間をかけて銅ストライクめっきを行い、次いで
シアン化銅とシアン化ナトリウムと酒石酸ナトリウムカ
リウムとから成るめっき浴を使用して所要の膜厚の銅め
っきを行うことにより、密着性が優れ、耐侯性及び電気
伝導性を向上することができる、マグネシウム合金上へ
の表面処理下地調整方法を見い出した。[Means for Solving the Problems] As a result of extensive research, the method of preparing a surface treatment base on a magnesium alloy according to the present invention has been developed by subjecting an article made of a magnesium alloy to vapor degreasing, alkaline degreasing, pickling and activation using conventional methods. Then, immersion treatment is performed at the required temperature and time in a zinc replacement treatment solution consisting of zinc sulfate, sodium pyrophosphate, sodium fluoride, and sodium carbonate. Copper strike plating is performed using a plating bath consisting of sodium and sodium potassium tartrate for the required temperature and time, and then a plating bath consisting of copper cyanide, sodium cyanide, and sodium potassium tartrate is used to perform copper strike plating as required. We have discovered a method for preparing a surface treatment base on a magnesium alloy that provides excellent adhesion and improves weather resistance and electrical conductivity by plating copper to a thickness of .
【０００７】[0007]
【作用】この発明のマグネシウム合金上への表面処理下
地調整方法は、化学的に非常に活性なマグネシウム合金
と銅ストライクめっき層の双方に対して密着性が良好で
、かつ、銅ストライクめっきを行うまでの時間に安定し
た被膜を形成することを特徴とした亜鉛置換処理方法を
行い、次いで亜鉛置換被膜と密着性の良好な銅ストライ
クめっきを施し、次いで銅ストライクめっき層密着性が
良好で、耐侯性を確保するために必要な膜厚の銅めっき
を施すことにより密着性が優れ、耐侯性及び電気伝導性
を向上させる、マグネシウム合金上への表面処理下地調
整方法が可能となるものである。[Operation] The method of preparing a surface treatment base on a magnesium alloy of the present invention has good adhesion to both the chemically very active magnesium alloy and the copper strike plating layer, and also performs copper strike plating. A zinc-replacement treatment method that is characterized by forming a stable film over a period of By applying copper plating to a thickness necessary to ensure properties, it is possible to provide a method for preparing a surface treatment base on a magnesium alloy that provides excellent adhesion, improves weather resistance and electrical conductivity.
【０００８】[0008]
【実施例】実施例１．以下において実施例を揚げ、この
発明を更に詳しく説明する。図１に示すめっき被膜の断
面図を利用して説明すると１はマグネシウム合金、２は
亜鉛置換被膜、３は銅ストライクめっき層、４は銅めっ
き層である。[Example] Example 1. The present invention will be explained in more detail with reference to Examples below. Referring to the cross-sectional view of the plating film shown in FIG. 1, 1 is a magnesium alloy, 2 is a zinc substitution film, 3 is a copper strike plating layer, and 4 is a copper plating layer.
【０００９】先ず、マグネシウム合金から成る物品を常
法により蒸気脱脂、アルカリ脱脂、酸洗い及び活性化処
理を行い、次いで硫酸亜鉛（７水塩）０．１０モル／１
、ピロリン酸ナトリウム（１０水塩）０．２６モル／１
、フッ化ナトリウム０．１２モル／１、炭酸ナトリウム
（１０水塩）０．０２モル／１から成る水溶液中で６５
〜７０℃の温度で５〜７分間浸漬処理を行いマグネシウ
ム合金上に亜鉛置換被膜２を形成させる。この場合、上
記、処理温度及び浸漬時間の範囲を外れた条件で亜鉛置
換処理を行うと亜鉛置換被膜２と銅ストライクめっき層
３の層間で密着不良が発生する。First, an article made of a magnesium alloy is subjected to steam degreasing, alkaline degreasing, pickling, and activation treatment by a conventional method, and then zinc sulfate (7 hydrate) is added at 0.10 mol/1.
, sodium pyrophosphate (decahydrate) 0.26 mol/1
65 in an aqueous solution consisting of 0.12 mol/1 sodium fluoride and 0.02 mol/1 sodium carbonate (decahydrate).
A immersion treatment is performed at a temperature of ~70° C. for 5 to 7 minutes to form a zinc-substituted coating 2 on the magnesium alloy. In this case, if the zinc replacement treatment is performed under conditions outside the above-mentioned treatment temperature and immersion time ranges, poor adhesion will occur between the zinc replacement coating 2 and the copper strike plating layer 3.
【００１０】次いで、水洗後、シアン化銅０．４５モル
／１、シアン化ナトリウム０．９２モル／１、炭酸ナト
リウム０．１１モル／１、酒石酸ナトリウムカリウム０
．１９モル／１とから成る組成のめっき浴を使用して、
最初の３０秒間は陰極電流密度０．５Ａ／ｄｍ２ で、
次に陰極電流密度１．８Ａ／ｄｍ２ で５分間の間、銅
ストライクめっき３を行う。この場合、上記、組成のめ
っき浴以外、例えばピロリン酸浴、フッ化浴等を使用し
て銅ストライクめっき３を行うと亜鉛置換被膜２と銅ス
トライクめっき３の層間で密着不良が発生する。Next, after washing with water, copper cyanide 0.45 mol/1, sodium cyanide 0.92 mol/1, sodium carbonate 0.11 mol/1, sodium potassium tartrate 0
．． Using a plating bath with a composition of 19 mol/1,
For the first 30 seconds, the cathode current density was 0.5 A/dm2,
Next, copper strike plating 3 is performed for 5 minutes at a cathode current density of 1.8 A/dm2. In this case, if the copper strike plating 3 is performed using a plating bath other than the above-mentioned composition, such as a pyrophosphoric acid bath or a fluoride bath, poor adhesion will occur between the zinc substitution coating 2 and the copper strike plating 3.
【００１１】次いで、水洗後、シアン化銅０．８０モル
／１、シアン化ナトリウム１．７０モル／１、酒石酸ナ
トリウムカリウム０．１３モル／１とから成る組成のめ
っき浴を使用して２５μｍ以上の膜厚の銅めっき４を行
う。この場合、上記、めっき浴以外、例えばピロリン酸
浴、硫酸浴、硼フッ化浴等を使用してめっき４を行うと
銅ストライクめっき３と銅めっき４の層間で密着不良が
発生する。更に、上記、めっき浴を使用した場合でも銅
めっき４の膜厚が２５μｍ未満であると耐侯性が悪くな
ることが確認された。Next, after washing with water, a plating bath having a composition of copper cyanide 0.80 mol/1, sodium cyanide 1.70 mol/1, and sodium potassium tartrate 0.13 mol/1 was used to form a plating solution with a thickness of 25 μm or more. Copper plating 4 is performed to a film thickness of . In this case, if plating 4 is performed using a bath other than the above-mentioned plating bath, for example, a pyrophosphoric acid bath, a sulfuric acid bath, a borofluoride bath, etc., poor adhesion will occur between the copper strike plating 3 and the copper plating 4. Furthermore, even when the above-mentioned plating bath was used, it was confirmed that if the film thickness of the copper plating 4 was less than 25 μm, the weather resistance would deteriorate.
【００１２】以上、述べてきたようにマグネシウム合金
から成る物品に本発明による表面処理下地調整方法を施
した後、常法により例えば２．５μｍ以上の金めっきを
施すことにより、目的とする密着性が良好で耐侯性が優
れているコーティング層をマグネシウム合金へ付与する
ことができる。As described above, after subjecting an article made of a magnesium alloy to the method for surface treatment and base preparation according to the present invention, it is plated with gold to a thickness of, for example, 2.5 μm or more by a conventional method, thereby achieving the desired adhesion. It is possible to provide a coating layer with good weather resistance and excellent weather resistance to a magnesium alloy.
【００１３】[0013]
【発明の効果】以上、説明したように、この発明によれ
ば実用金属で最も軽量なマグネシウム合金上に高周波特
性を向上させる為の金、銀めっきコーティングを、又、
はんだ付性を向上させる為の金、錫めっきコーティング
を、更に、耐侯性を向上させる為のニッケル、錫めっき
コーティングを付与する為の下地調整方法として高い信
頼性を保証することが出来る。このことから、例えば宇
宙機器搭載用電子機器へのマグネシウム合金の採用が可
能となり、上記、機器の軽量化、小型化の要求に答えら
れるものである。[Effects of the Invention] As explained above, according to the present invention, a gold or silver plating coating is applied on a magnesium alloy, which is the lightest practical metal, to improve high frequency characteristics.
High reliability can be guaranteed as a base preparation method for applying gold and tin plating coatings to improve solderability, as well as nickel and tin plating coatings to improve weather resistance. This makes it possible to employ magnesium alloys, for example, in electronic equipment mounted on space equipment, meeting the above-mentioned demands for lighter weight and smaller equipment.
【図１】この発明の実施例１を示す断面図である。FIG. 1 is a sectional view showing a first embodiment of the present invention.
１ マグネシウム合金 ２ 亜鉛置換被膜 ３ 銅ストライクめっき ４ 銅めっき 1 Magnesium alloy 2 Zinc replacement coating 3 Copper strike plating 4 Copper plating
Claims (1)
法により蒸気脱脂、アルカリ脱脂、酸洗い及び活性化処
理を実施し、次いで、硫酸亜鉛とピロリン酸ナトリウム
とフッ化ナトリウムと炭酸ナトリウムから成る溶液中で
６５〜７０℃の温度で、５〜７分間浸漬して亜鉛置換処
理を行い、次いで、シアン化銅とシアン化ナトリウムと
炭酸ナトリウムと酒石酸カリウムナトリウムとから成る
めっき浴を使用して、銅ストライクめっきを行い、次い
で、シアン化銅とシアン化ナトリウムと酒石酸カリウム
ナトリウムとから成るめっき浴を使用して、銅めっきを
２５μｍ以上行うことを特徴とするマグネシウム合金へ
の表面処理下地調整方法。Claim 1: An article made of a magnesium alloy is subjected to steam degreasing, alkaline degreasing, pickling and activation treatment in a conventional manner, and then placed in a solution consisting of zinc sulfate, sodium pyrophosphate, sodium fluoride and sodium carbonate. Zinc replacement treatment is carried out by immersion at a temperature of 65 to 70 °C for 5 to 7 minutes, and then copper strike is performed using a plating bath consisting of copper cyanide, sodium cyanide, sodium carbonate, and potassium sodium tartrate. A method for preparing a surface treatment base for a magnesium alloy, the method comprising plating and then copper plating to a thickness of 25 μm or more using a plating bath consisting of copper cyanide, sodium cyanide, and potassium sodium tartrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7511191A JPH04311575A (en) | 1991-04-08 | 1991-04-08 | Method for treating and conditioning surface of magnesium alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7511191A JPH04311575A (en) | 1991-04-08 | 1991-04-08 | Method for treating and conditioning surface of magnesium alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04311575A true JPH04311575A (en) | 1992-11-04 |
Family
ID=13566741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7511191A Pending JPH04311575A (en) | 1991-04-08 | 1991-04-08 | Method for treating and conditioning surface of magnesium alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04311575A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009504923A (en) * | 2005-08-17 | 2009-02-05 | マクダーミッド インコーポレーテッド | Pretreatment of magnesium substrate for electroplating |
| CN102634805A (en) * | 2012-05-04 | 2012-08-15 | 西南大学 | Method for preparing magnesium alloy with super-hydrophobic layer on surface |
| JP2013508553A (en) * | 2009-10-22 | 2013-03-07 | アトテック・ドイチュラント・ゲーエムベーハー | Compositions and methods for improved zincate treatment of magnesium and magnesium alloy substrates |
-
1991
- 1991-04-08 JP JP7511191A patent/JPH04311575A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009504923A (en) * | 2005-08-17 | 2009-02-05 | マクダーミッド インコーポレーテッド | Pretreatment of magnesium substrate for electroplating |
| JP4857340B2 (en) * | 2005-08-17 | 2012-01-18 | マクダーミッド インコーポレーテッド | Pretreatment of magnesium substrate for electroplating |
| JP2013508553A (en) * | 2009-10-22 | 2013-03-07 | アトテック・ドイチュラント・ゲーエムベーハー | Compositions and methods for improved zincate treatment of magnesium and magnesium alloy substrates |
| CN102634805A (en) * | 2012-05-04 | 2012-08-15 | 西南大学 | Method for preparing magnesium alloy with super-hydrophobic layer on surface |
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