KR920016257A - Thermal head - Google Patents

Thermal head Download PDF

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Publication number
KR920016257A
KR920016257A KR1019920001613A KR920001613A KR920016257A KR 920016257 A KR920016257 A KR 920016257A KR 1019920001613 A KR1019920001613 A KR 1019920001613A KR 920001613 A KR920001613 A KR 920001613A KR 920016257 A KR920016257 A KR 920016257A
Authority
KR
South Korea
Prior art keywords
driving
synthetic resin
resin material
sealing portion
generating resistor
Prior art date
Application number
KR1019920001613A
Other languages
Korean (ko)
Other versions
KR970004233B1 (en
Inventor
미네오 니시카와
히로시 하야시
Original Assignee
사토오 켄이치로오
로움 카부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 사토오 켄이치로오, 로움 카부시키가이샤 filed Critical 사토오 켄이치로오
Publication of KR920016257A publication Critical patent/KR920016257A/en
Application granted granted Critical
Publication of KR970004233B1 publication Critical patent/KR970004233B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/3353—Protective layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33555—Structure of thermal heads characterised by type
    • B41J2/3357—Surface type resistors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
    • H05F3/00—Carrying-off electrostatic charges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Electronic Switches (AREA)
  • Accessory Devices And Overall Control Thereof (AREA)
  • Elimination Of Static Electricity (AREA)

Abstract

내용 없음No content

Description

감열식 헤드Thermal head

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 그 일부를 절단한, 감열식 헤드의 평면도이다. 제2도는 주요부의 확대평면도이다. 제3도는 제1도에서의 Ⅲ-Ⅲ선을 따르는 측면단면도이다.1 is a plan view of a thermosensitive head, a part of which is cut away. 2 is an enlarged plan view of the main part. 3 is a side cross-sectional view along the III-III line in FIG.

Claims (4)

헤드 기관(2)의 표면에, 발열 저항체(4)와, 그 발열 저항체(4)를 구동시키기 위한 구동용 IC(5), 그 구동용 IC(5)로부터전기한 발열 저항체(4)로 전기를 급전하기 위한 인쇄배선회로(6)등으로 구성된 감열식 헤드에 있어서, 전기한 구동용IC(5)부분에, 정전기에 대해서는 양도체이며, 또한 전기 절연성이 있는 대전방지 기능형 합성수지재로 밀봉시키는 밀봉부(14)를 형성하는 것을 특징으로 하는 감열식 헤드.On the surface of the head engine 2, electricity is generated from the heat generating resistor 4, the driving IC 5 for driving the heat generating resistor 4, and the heat generating resistor 4 transferred from the driving IC 5. In the heat-sensitive head composed of a printed wiring circuit (6) for feeding electric power, the electrically conductive IC (5) part is sealed with an antistatic functional synthetic resin material which is a good conductor against static electricity and is electrically insulating. A thermal head, characterized by forming a seal (14). 헤드 기판(2)의 표면에 발열 저항체(4), 그 발열 저항체(4)를 구동시키기 위한 구동용 IC(5)와, 그 구동용 IC(5)로부터전기한 발열 저항체(4)로 전기를 급전하기 위한 인쇄배선회로(6) 등으로 구성된 감열식 헤드에 있어서, 전기한 구동용IC(5)의 표면을 전기 절연성의 합성수지재로 밀봉시키는 한편, 그 밀봉부(18)의 표면에, 정전기에 대해서는 양도체이며,또, 전기 절연성이 있는 대전방지기능형 합성수지재를 사용하여 대전방지층(19)을 형성하는 것을 특징으로 하는 감열식헤드.Electricity is supplied to the heat generating resistor 4 on the surface of the head substrate 2, the driving IC 5 for driving the heat generating resistor 4, and the heat generating resistor 4 transferred from the driving IC 5. In a heat-sensitive head composed of a printed wiring circuit 6 for feeding power, the surface of the drive IC 5 is sealed with an electrically insulating synthetic resin material, while the surface of the sealing portion 18 is electrostatically charged. It is a good conductor, and the heat-sensitive head, characterized in that to form an antistatic layer (19) using an electrically insulating antistatic functional synthetic resin material. 제2항에 있어서, 전기한 밀봉부(20)를, 연질합성수지재로 형성하는 것을 특징으로 하는 감열식 헤드.The heat-sensitive head according to claim 2, wherein the sealing portion (20) described above is formed of a soft synthetic resin material. 제2항에 있어서, 전기한 밀봉부를 전기한 구동용 IC(5)를 연질합성수지재를 사용하여 밀봉시키는 제1밀봉부(22)와, 제1밀봉부(22)의 표면을 경질합성수지재를 사용하여 밀봉시키는 제2 밀봉부(23)로 형성하는 것을 특징으로 하는 감열식 헤드.The method of claim 2, wherein the first sealing portion 22 for sealing the drive IC (5) in which the electric sealing portion is delivered using a soft synthetic resin material, and the surface of the first sealing portion 22 is made of a hard synthetic resin material. And a second sealing portion (23) for sealing by use. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019920001613A 1991-02-06 1992-02-01 Thermal head KR970004233B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3038046A JP3016884B2 (en) 1991-02-06 1991-02-06 Thermal head
JP91-38046 1991-02-06

Publications (2)

Publication Number Publication Date
KR920016257A true KR920016257A (en) 1992-09-24
KR970004233B1 KR970004233B1 (en) 1997-03-26

Family

ID=12514590

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920001613A KR970004233B1 (en) 1991-02-06 1992-02-01 Thermal head

Country Status (5)

Country Link
US (1) US5278580A (en)
EP (1) EP0498400B1 (en)
JP (1) JP3016884B2 (en)
KR (1) KR970004233B1 (en)
DE (1) DE69207785T2 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2085568C (en) * 1991-12-19 2000-10-17 Kenjiro Watanabe Ink jet recording head, ink jet recording head cartridge and recording apparatus using same
US5764267A (en) * 1992-05-15 1998-06-09 Fuji Xerox Co., Ltd. Conduction recording head
JPH0732634A (en) * 1993-07-22 1995-02-03 Seiko Instr Inc Printer
CN1143777C (en) * 1995-07-31 2004-03-31 罗姆股份有限公司 Linear thermal print head and linear thermal print head appts.
DE19614914A1 (en) * 1996-04-16 1997-10-23 Telesensomatic Gmbh Transponder arrangement with single- or multi-layer integrated circuit
US5936581A (en) * 1997-03-03 1999-08-10 Motorola, Inc. Radio frequency switch assembly
EP0891868B1 (en) * 1997-07-17 2004-06-02 Fuji Photo Film Co., Ltd. Thermal head
JP2001353893A (en) * 2000-06-14 2001-12-25 Kyocera Corp Thermal head
JP2002011900A (en) * 2000-06-29 2002-01-15 Kyocera Corp Thermal head
JP4398766B2 (en) * 2004-03-30 2010-01-13 アルプス電気株式会社 Thermal head and manufacturing method thereof
CN102555515B (en) * 2010-11-19 2015-08-26 罗姆股份有限公司 Thermal printing head and manufacture method thereof
CN102529416B (en) * 2010-11-30 2016-01-20 罗姆股份有限公司 Thermal printing head
JP6178669B2 (en) * 2012-08-29 2017-08-09 ローム株式会社 Thermal print head and thermal printer
CN105408119B (en) * 2013-08-26 2017-08-29 京瓷株式会社 Thermal head and the thermal printer for possessing the thermal head
US9937728B2 (en) * 2014-08-26 2018-04-10 Kyocera Corporation Thermal head and thermal printer
CN109986888B (en) * 2019-05-15 2020-03-24 山东华菱电子股份有限公司 Heating substrate for thermal printing head

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5544737A (en) * 1978-09-25 1980-03-29 Mitsubishi Electric Corp Hybrid integrated circuit device
JPS59228743A (en) * 1983-06-10 1984-12-22 Kyodo Printing Co Ltd Ic module for ic card
US4689638A (en) * 1984-03-26 1987-08-25 Fujitsu Limited Thermal recording head and process for manufacturing wiring substrate therefor
DE3433779A1 (en) * 1984-09-14 1986-03-27 Robert Bosch Gmbh, 7000 Stuttgart Protective layer for semiconductor circuits
KR870008706A (en) * 1986-03-06 1987-10-20 오오가 노리오 Thermal print head
US4699830A (en) * 1986-06-30 1987-10-13 Baxter Travenol Laboratories, Inc. Laminated sheet material for packaging electronic components
JP2629007B2 (en) * 1987-09-21 1997-07-09 京セラ株式会社 Thermal head
FR2636776A1 (en) * 1988-09-16 1990-03-23 Trt Telecom Radio Electr DEVICE COMPRISING AN ELECTRONIC CIRCUIT MOUNTED ON A FLEXIBLE SUPPORT, PROTECTING AGAINST STATIC ELECTRICITY DISCHARGES, AND A FLEXIBLE CARD COMPRISING SAME
US5043195A (en) * 1988-10-28 1991-08-27 Minnesota Mining & Manufacturing Company Static shielding film

Also Published As

Publication number Publication date
DE69207785D1 (en) 1996-03-07
JPH04255362A (en) 1992-09-10
DE69207785T2 (en) 1996-05-30
JP3016884B2 (en) 2000-03-06
EP0498400B1 (en) 1996-01-24
EP0498400A1 (en) 1992-08-12
KR970004233B1 (en) 1997-03-26
US5278580A (en) 1994-01-11

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A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
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Payment date: 20020723

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