KR920016074U - 세라믹 기판 절단 장치 - Google Patents

세라믹 기판 절단 장치

Info

Publication number
KR920016074U
KR920016074U KR2019910001171U KR910001171U KR920016074U KR 920016074 U KR920016074 U KR 920016074U KR 2019910001171 U KR2019910001171 U KR 2019910001171U KR 910001171 U KR910001171 U KR 910001171U KR 920016074 U KR920016074 U KR 920016074U
Authority
KR
South Korea
Prior art keywords
cutting device
ceramic substrate
substrate cutting
ceramic
substrate
Prior art date
Application number
KR2019910001171U
Other languages
English (en)
Other versions
KR930000859Y1 (ko
Inventor
최현종
Original Assignee
대우전자부품 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 대우전자부품 주식회사 filed Critical 대우전자부품 주식회사
Priority to KR2019910001171U priority Critical patent/KR930000859Y1/ko
Publication of KR920016074U publication Critical patent/KR920016074U/ko
Application granted granted Critical
Publication of KR930000859Y1 publication Critical patent/KR930000859Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
KR2019910001171U 1991-01-28 1991-01-28 세라믹 기판 절단 장치 KR930000859Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910001171U KR930000859Y1 (ko) 1991-01-28 1991-01-28 세라믹 기판 절단 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910001171U KR930000859Y1 (ko) 1991-01-28 1991-01-28 세라믹 기판 절단 장치

Publications (2)

Publication Number Publication Date
KR920016074U true KR920016074U (ko) 1992-08-17
KR930000859Y1 KR930000859Y1 (ko) 1993-02-27

Family

ID=19310233

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910001171U KR930000859Y1 (ko) 1991-01-28 1991-01-28 세라믹 기판 절단 장치

Country Status (1)

Country Link
KR (1) KR930000859Y1 (ko)

Also Published As

Publication number Publication date
KR930000859Y1 (ko) 1993-02-27

Similar Documents

Publication Publication Date Title
DE69127314D1 (de) Diamant-Halbleiteranordnung
DE69322565T2 (de) Diamant-Halbleiteranordnung
DE69216486D1 (de) Fliesenschneidvorrichtung
DE69424477D1 (de) Keramik-Halbleiterbauelement
DE69026972T2 (de) Halbleiterlaservorrichtung
DK0519661T3 (da) Roterende skæreindretning
DE69226742D1 (de) Halbleitervorrichtung
DE69124399D1 (de) Halbleitervorrichtung
DE69030930T2 (de) Halbleiterlaservorrichtung
DE69208622T2 (de) Halbleiterlaservorrichtung
KR930009747U (ko) 반도체장치
DE69209516T2 (de) Drehvorrichtung
DE68928760D1 (de) Halbleitervorrichtung
DE69210935T2 (de) Halbleiteranordnung
DE69227663T2 (de) Halbleitereinrichtung
KR920016074U (ko) 세라믹 기판 절단 장치
DE69220753T2 (de) Halbleiterlaservorrichtung
KR930016160U (ko) 세라믹 기판
ITRM920532A0 (it) Dispositivo di taglio per pietre
FI924256A0 (fi) Kääntölaite
KR910011545U (ko) 유리기판 절단장치
KR910012333U (ko) 기판 세정장치
KR930019039U (ko) 기판 착탈 장치
UA21890A1 (uk) Подрібhюючий апарат
KR950007638U (ko) 세라믹기판분리장치

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 19960124

Year of fee payment: 6

LAPS Lapse due to unpaid annual fee