KR920010393U - 반도체 소자(chip)와 인쇄회로 기판의 연결장치 - Google Patents

반도체 소자(chip)와 인쇄회로 기판의 연결장치

Info

Publication number
KR920010393U
KR920010393U KR2019900017394U KR900017394U KR920010393U KR 920010393 U KR920010393 U KR 920010393U KR 2019900017394 U KR2019900017394 U KR 2019900017394U KR 900017394 U KR900017394 U KR 900017394U KR 920010393 U KR920010393 U KR 920010393U
Authority
KR
South Korea
Prior art keywords
chip
circuit board
printed circuit
board connection
semiconductor device
Prior art date
Application number
KR2019900017394U
Other languages
English (en)
Other versions
KR940000738Y1 (ko
Inventor
고준수
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019900017394U priority Critical patent/KR940000738Y1/ko
Publication of KR920010393U publication Critical patent/KR920010393U/ko
Application granted granted Critical
Publication of KR940000738Y1 publication Critical patent/KR940000738Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
KR2019900017394U 1990-11-13 1990-11-13 반도체 소자(chip)와 인쇄회로 기판의 연결장치 KR940000738Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019900017394U KR940000738Y1 (ko) 1990-11-13 1990-11-13 반도체 소자(chip)와 인쇄회로 기판의 연결장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019900017394U KR940000738Y1 (ko) 1990-11-13 1990-11-13 반도체 소자(chip)와 인쇄회로 기판의 연결장치

Publications (2)

Publication Number Publication Date
KR920010393U true KR920010393U (ko) 1992-06-17
KR940000738Y1 KR940000738Y1 (ko) 1994-02-14

Family

ID=19305350

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019900017394U KR940000738Y1 (ko) 1990-11-13 1990-11-13 반도체 소자(chip)와 인쇄회로 기판의 연결장치

Country Status (1)

Country Link
KR (1) KR940000738Y1 (ko)

Also Published As

Publication number Publication date
KR940000738Y1 (ko) 1994-02-14

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