KR920007828B1 - 인쇄 회로 기판상에 ic 칩 패키지를 장착시키기 위한 소켓 - Google Patents

인쇄 회로 기판상에 ic 칩 패키지를 장착시키기 위한 소켓 Download PDF

Info

Publication number
KR920007828B1
KR920007828B1 KR1019900002199A KR900002199A KR920007828B1 KR 920007828 B1 KR920007828 B1 KR 920007828B1 KR 1019900002199 A KR1019900002199 A KR 1019900002199A KR 900002199 A KR900002199 A KR 900002199A KR 920007828 B1 KR920007828 B1 KR 920007828B1
Authority
KR
South Korea
Prior art keywords
socket body
socket
leg
spring
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019900002199A
Other languages
English (en)
Korean (ko)
Other versions
KR900013677A (ko
Inventor
쯔또무 후지자끼
미노루 시바따
Original Assignee
마쯔시다 덴꼬 가부시끼가이샤
미요시 도시오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4461189A external-priority patent/JP2760009B2/ja
Priority claimed from JP1989112424U external-priority patent/JP2500505Y2/ja
Application filed by 마쯔시다 덴꼬 가부시끼가이샤, 미요시 도시오 filed Critical 마쯔시다 덴꼬 가부시끼가이샤
Publication of KR900013677A publication Critical patent/KR900013677A/ko
Application granted granted Critical
Publication of KR920007828B1 publication Critical patent/KR920007828B1/ko
Expired legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/1023—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
KR1019900002199A 1989-02-23 1990-02-22 인쇄 회로 기판상에 ic 칩 패키지를 장착시키기 위한 소켓 Expired KR920007828B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP1-44611 1989-02-23
JP?89-44611 1989-02-23
JP4461189A JP2760009B2 (ja) 1989-02-23 1989-02-23 Ｉｃソケット
JP??112424 1989-09-26
JP1989112424U JP2500505Y2 (ja) 1989-09-26 1989-09-26 Ｉｃ用ソケット
JP?89-112424 1989-09-26

Publications (2)

Publication Number Publication Date
KR900013677A KR900013677A (ko) 1990-09-06
KR920007828B1 true KR920007828B1 (ko) 1992-09-17

Family

ID=26384556

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900002199A Expired KR920007828B1 (ko) 1989-02-23 1990-02-22 인쇄 회로 기판상에 ic 칩 패키지를 장착시키기 위한 소켓

Country Status (3)

Country Link
US (1) US4954088A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR920007828B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE4005829A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0726880Y2 (ja) * 1990-05-15 1995-06-14 ヒロセ電機株式会社 チップ構造
US5301416A (en) * 1992-04-24 1994-04-12 Altera Corporation Surface mount chip carrier
EP0567255B1 (en) * 1992-04-24 1999-01-20 Altera Corporation Surface mount chip carrier
US5273446A (en) * 1992-11-02 1993-12-28 Burndy Corporation Zero separation force connector with wiping insertion
WO1994028697A1 (en) * 1993-05-20 1994-12-08 Advanced Interconnections Corporation Intercoupling component for installing integrated circuit packages on circuit boards
USD389726S (en) 1994-10-11 1998-01-27 Lucent Technologies Inc. Display unit for an icon symbol for use with a telephone modular connector
JPH08124644A (ja) * 1994-10-18 1996-05-17 Thomas & Betts Corp <T&B> 電子部品用ソケット
US5629837A (en) * 1995-09-20 1997-05-13 Oz Technologies, Inc. Button contact for surface mounting an IC device to a circuit board
US6046597A (en) * 1995-10-04 2000-04-04 Oz Technologies, Inc. Test socket for an IC device
US5785535A (en) * 1996-01-17 1998-07-28 International Business Machines Corporation Computer system with surface mount socket
USD430024S (en) * 1998-11-04 2000-08-29 Affymetrix, Inc. Chip packaging device
JP4040917B2 (ja) * 2002-06-28 2008-01-30 株式会社東海理化電機製作所 プレスフィットピン
TW558094U (en) * 2003-02-26 2003-10-11 Hon Hai Prec Ind Co Ltd Electrical connector assembly
US20060121754A1 (en) * 2003-06-13 2006-06-08 Milos Krejcik Conforming Lid Socket for Leaded Surface Mount Packages
US7918671B2 (en) * 2004-07-13 2011-04-05 Research In Motion Limited Mounting structure with springs biasing towards a latching edge
US20070279883A1 (en) * 2006-05-30 2007-12-06 Speed Tech Corp. Locking device having releasing arm
KR100795490B1 (ko) * 2006-07-07 2008-01-16 미래산업 주식회사 반도체 소자 테스트 핸들러용 캐리어 모듈
JP5075537B2 (ja) * 2007-09-04 2012-11-21 矢崎総業株式会社 カバーの取付構造、コネクタ、及びカバー

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2342504A1 (fr) * 1976-02-26 1977-09-23 Xaverius College Ensemble d'experimentation electronique
US4252390A (en) * 1979-04-09 1981-02-24 Bowling William M Low insertion force electrical retainer
US4410223A (en) * 1981-08-03 1983-10-18 Bell Telephone Laboratories, Incorporated Module mounting assembly
US4422128A (en) * 1981-08-06 1983-12-20 General Motors Corporation Push-on terminal clip and assembly
US4417777A (en) * 1981-10-13 1983-11-29 Molex Incorporated Integrated circuit carrier assembly
US4491377A (en) * 1982-04-19 1985-01-01 Pfaff Wayne Mounting housing for leadless chip carrier
FR2541827B1 (fr) * 1983-02-25 1985-07-05 Socapex Connecteur comprenant au moins un contact presentant un bras elastiquement deformable
US4682829A (en) * 1985-06-13 1987-07-28 Amp Incorporated Surface mount socket for dual in-line package
JPS6317550A (ja) * 1986-07-10 1988-01-25 Yamaichi Electric Mfg Co Ltd Ｉｃ載接形ソケツト
US4824392A (en) * 1987-11-10 1989-04-25 Amp Incorporated Burn-in socket for gull wing integrated circuit package

Also Published As

Publication number Publication date
DE4005829A1 (de) 1990-08-30
KR900013677A (ko) 1990-09-06
DE4005829C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-09-26
US4954088A (en) 1990-09-04

Similar Documents

Publication Publication Date Title
KR920007828B1 (ko) 인쇄 회로 기판상에 ic 칩 패키지를 장착시키기 위한 소켓
EP0373003B1 (en) Surface-mounted component&#39;s contact having a soldering portion
US4317609A (en) Electrical contact
US4150863A (en) Circuit board connector and means of mounting same
JPH1092526A (ja) 接点支持体
US4436358A (en) Terminal tab intended for mounting on a circuit board
JPH10511212A (ja) 表面実装型電気コネクタのための改良されたラッチ及び固定用部材
KR100607003B1 (ko) 낮은 프로파일 전기 커넥터
US5259795A (en) Edge connector for a printed circuit board or the like
KR920022617A (ko) 전기 모우터 제어 부품용 장착장치 및 고정된 연결기 해제 방법
KR960028721A (ko) 카드수납 커넥터용 만능 접지 클립
JPH0225257B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH04229965A (ja) ラッチ装置付き回路板用コネクタ
US2922978A (en) Printed wire socket
CA1038466A (en) Electrical connector assembly for panel mounting
US4614387A (en) Connecting element for chip carriers
US5203710A (en) Surface mount electrical connector
KR910002047A (ko) 클로버형 접촉의 회로 패널 소켓
US3725842A (en) Connector for integrated package
US4376562A (en) Cam actuated socket for electrical leads
US4171856A (en) Substrate recessed receptacle
US4536055A (en) Stamped and formed stacking device for circuit boards and a method for making
JPH0817099B2 (ja) 表面実装型電気部品およびその製造方法
EP0232630A1 (en) Slide switch in a dual in-line package configuration
JPH0414874Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

St.27 status event code: A-2-2-Q10-Q13-nap-PG1605

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 15

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 16

FPAY Annual fee payment

Payment date: 20080911

Year of fee payment: 17

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 17

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20090918

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20090918

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301