KR920007738A - 저잔사 타잎 납땜 플럭스 - Google Patents

저잔사 타잎 납땜 플럭스 Download PDF

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Publication number
KR920007738A
KR920007738A KR1019910011319A KR910011319A KR920007738A KR 920007738 A KR920007738 A KR 920007738A KR 1019910011319 A KR1019910011319 A KR 1019910011319A KR 910011319 A KR910011319 A KR 910011319A KR 920007738 A KR920007738 A KR 920007738A
Authority
KR
South Korea
Prior art keywords
soldering flux
acid
weight
ester
low residue
Prior art date
Application number
KR1019910011319A
Other languages
English (en)
Inventor
하쯔히로 미나하라
노리꼬 이꾸다
Original Assignee
마에다 고사꾸
멕구 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 마에다 고사꾸, 멕구 가부시끼가이샤 filed Critical 마에다 고사꾸
Publication of KR920007738A publication Critical patent/KR920007738A/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

내용 없음

Description

저잔사 타잎 납땜 플럭스
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 플럭스의 납땜용 평가기준을 나타낸 것으로 상단 열의 형태는 양호한 납땜을 나타내고, 하단 열의 형태는 불량한 납땜을 나타낸 것이다.

Claims (3)

  1. 2염기성 카르복실산, 옥시산 및 케토카르복실산으로 구성된 군에서 선택된 1종 이상의 산성붐과 인산에스테르, 및 차아인산에스테르으로 구성된 군에서 선택된 1종 이상의 에스테르성분을 함유하는 것을 특징으로 하는 납땜용 플럭스.
  2. 제1항에 있어서, 산성분이 0.1내지 20중량%의 범위이며, 에스테르 성분이 0.01내지 10중량%인 것이 특징인 납땜용 플럭스.
  3. 제1항에 있어서, 산성분이 0.5내지 5중량%의 범위이고, 에스테르 성분이 0.1내지 3중량%인 것이 특징인 납땜용 플럭스.
    ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
KR1019910011319A 1990-10-03 1991-07-04 저잔사 타잎 납땜 플럭스 KR920007738A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2263767A JPH07121468B2 (ja) 1990-10-03 1990-10-03 はんだ付け用フラックス
JP90-263767 1990-10-03

Publications (1)

Publication Number Publication Date
KR920007738A true KR920007738A (ko) 1992-05-27

Family

ID=17394001

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910011319A KR920007738A (ko) 1990-10-03 1991-07-04 저잔사 타잎 납땜 플럭스

Country Status (5)

Country Link
US (1) US5131962A (ko)
JP (1) JPH07121468B2 (ko)
KR (1) KR920007738A (ko)
DE (1) DE4132545A1 (ko)
GB (1) GB2250754B (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5297721A (en) * 1992-11-19 1994-03-29 Fry's Metals, Inc. No-clean soldering flux and method using the same
EP0619162A3 (en) * 1993-04-05 1995-12-27 Takeda Chemical Industries Ltd Soft soldering fluid.
US5417771A (en) * 1994-02-16 1995-05-23 Takeda Chemical Industries, Ltd. Soldering flux
US5571340A (en) * 1994-09-09 1996-11-05 Fry's Metals, Inc. Rosin-free, low VOC, no-clean soldering flux and method using the same
US6059894A (en) * 1998-04-08 2000-05-09 Hewlett-Packard Company High temperature flip chip joining flux that obviates the cleaning process
US20070284412A1 (en) * 2006-05-31 2007-12-13 Prakash Anna M Solder flux composition
US7780801B2 (en) * 2006-07-26 2010-08-24 International Business Machines Corporation Flux composition and process for use thereof
CN101437900B (zh) 2006-08-28 2012-09-19 松下电器产业株式会社 热固性树脂组合物、其制备方法及电路板
JP4936192B2 (ja) * 2008-03-31 2012-05-23 パナソニック株式会社 熱硬化性樹脂組成物及びその製造方法
JP6861688B2 (ja) * 2018-11-19 2021-04-21 株式会社タムラ製作所 無残渣フラックス組成物及びソルダペースト

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2493372A (en) * 1946-11-08 1950-01-03 Harold R Williams Brazing flux composition
US2927049A (en) * 1956-12-27 1960-03-01 Eutectic Welding Alloys Fluxing method and composition
GB1458351A (en) * 1972-12-06 1976-12-15 Jacobs N L Fluxes
GB1550648A (en) * 1976-06-11 1979-08-15 Multicore Solders Ltd Soft soldering
GB1577519A (en) * 1976-11-25 1980-10-22 Multicore Solders Ltd Soft soldering
US4180419A (en) * 1978-05-23 1979-12-25 M. W. Dunton Company Solder flux
GB1594804A (en) * 1978-05-23 1981-08-05 Multicore Solders Ltd Soft soldering
US4342607A (en) * 1981-01-05 1982-08-03 Western Electric Company, Inc. Solder flux
GB2120964A (en) * 1982-03-25 1983-12-14 Alpha Metals Processes of applying solder
JPS61242790A (ja) * 1985-04-19 1986-10-29 Asahi Kagaku Kenkyusho:Kk 半田付け用フラツクス
US5011546A (en) * 1990-04-12 1991-04-30 International Business Machines Corporation Water soluble solder flux and paste
US5004509A (en) * 1990-05-04 1991-04-02 Delco Electronics Corporation Low residue soldering flux

Also Published As

Publication number Publication date
GB2250754B (en) 1994-06-15
GB9119887D0 (en) 1991-10-30
DE4132545A1 (de) 1992-04-16
GB2250754A (en) 1992-06-17
US5131962A (en) 1992-07-21
JPH07121468B2 (ja) 1995-12-25
JPH04143094A (ja) 1992-05-18

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Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid