KR920005462B1 - Flexible printed wiring board with multilayered pattern and manufacturing process - Google Patents

Flexible printed wiring board with multilayered pattern and manufacturing process

Info

Publication number
KR920005462B1
KR920005462B1 KR8712061A KR870012061A KR920005462B1 KR 920005462 B1 KR920005462 B1 KR 920005462B1 KR 8712061 A KR8712061 A KR 8712061A KR 870012061 A KR870012061 A KR 870012061A KR 920005462 B1 KR920005462 B1 KR 920005462B1
Authority
KR
South Korea
Prior art keywords
manufacturing process
wiring board
printed wiring
flexible printed
multilayered pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR8712061A
Other languages
English (en)
Korean (ko)
Other versions
KR890003269A (ko
Inventor
Minoru Dakuma
Original Assignee
Midori Mark Seisakusho Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Midori Mark Seisakusho Kk filed Critical Midori Mark Seisakusho Kk
Publication of KR890003269A publication Critical patent/KR890003269A/ko
Application granted granted Critical
Publication of KR920005462B1 publication Critical patent/KR920005462B1/ko
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
KR8712061A 1987-07-14 1987-10-30 Flexible printed wiring board with multilayered pattern and manufacturing process Expired KR920005462B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62-175765 1987-07-14
JP62175765A JPS6419795A (en) 1987-07-14 1987-07-14 Flexible printed wiring board with multilayered pattern and manufacture thereof

Publications (2)

Publication Number Publication Date
KR890003269A KR890003269A (ko) 1989-04-13
KR920005462B1 true KR920005462B1 (en) 1992-07-04

Family

ID=16001867

Family Applications (1)

Application Number Title Priority Date Filing Date
KR8712061A Expired KR920005462B1 (en) 1987-07-14 1987-10-30 Flexible printed wiring board with multilayered pattern and manufacturing process

Country Status (2)

Country Link
JP (1) JPS6419795A (enExample)
KR (1) KR920005462B1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03196691A (ja) * 1989-12-26 1991-08-28 Cmk Corp プリント配線板の絶縁層の形成方法
KR100494679B1 (ko) * 1998-12-18 2005-09-26 비오이 하이디스 테크놀로지 주식회사 플렉서블 프린티드 서킷
KR100395814B1 (ko) * 2000-11-14 2003-08-27 삼성에스디아이 주식회사 단선 방지형 유연성 프린트 회로

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5517518B2 (enExample) * 1972-01-28 1980-05-12
JPS50135559A (enExample) * 1974-04-17 1975-10-27
JPS6149491A (ja) * 1984-08-18 1986-03-11 松下電器産業株式会社 セラミツク多層配線基板
JPS6284975U (enExample) * 1985-11-18 1987-05-30

Also Published As

Publication number Publication date
JPS6419795A (en) 1989-01-23
JPH0252432B2 (enExample) 1990-11-13
KR890003269A (ko) 1989-04-13

Similar Documents

Publication Publication Date Title
GB2231839B (en) Multi-layer printed wiring boards
EP0247575A3 (en) Multilayer printed wiring board and method for producing the same
EP0243507A4 (en) FLEXIBLE LAMINATE FOR PRINTED CIRCUIT BOARDS AND PRODUCTION METHOD.
EP0351034A3 (en) Process for producing printed wiring boards
GB9113916D0 (en) Method of manufacturing a printed wiring board
GB8714639D0 (en) Printed circuit board topography
GB2207287B (en) A multilayer circuit board
GB2247112B (en) Method of forming through holes in a printed wiring board
GB2246243B (en) Printed wiring board and method of manufacturing same
EP0411772A3 (en) Flexible printed-circuit base board and process for producing the same
IL92272A0 (en) Multilayer printed wiring board with single layer vias
GB2249876B (en) Improvements in the manufacture of printed wiring boards
EP0202858A3 (en) A multilayered ceramic wiring circuit board and the method of producing the same
GB8904557D0 (en) A laminated printed circuit board and process for its manufacture
EP0275070A3 (en) Multilayer printed wiring board and method for making same
GB9207285D0 (en) Method of manufacturing printed wiring boards
GB2224464B (en) Printed wiring board
EP0308576A3 (en) A printed wiring board
EP0341629A3 (en) Printed circuit board and a method of recognizing the position of surface mounted parts
EP0310010A3 (en) Multilayer printed circuit board formation
KR880702043A (ko) 다층프린트배선판 및 그 제조방법
KR920005462B1 (en) Flexible printed wiring board with multilayered pattern and manufacturing process
GB2202094B (en) Multilayer printed circuit board
GB8707929D0 (en) Printed circuit boards
EP0335565A3 (en) Process for producing printed wiring board

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

St.27 status event code: A-2-2-Q10-Q13-nap-PG1605

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 19980610

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 19990705

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 19990705

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000